Aapo Varpula

  • Phone+358403571370
20082020

Research output per year

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Research Output

High-performance infrared thermoelectric bolometers based on nanomembranes

Varpula, A., Tappura, K., Tiira, J., Grigoras, K., Viherkanto, K., Ahopelto, J. & Prunnila, M., 26 Feb 2020, Photonic and Phononic Properties of Engineered Nanostructures X. Adibi, A., Lin, S-Y. & Scherer, A. (eds.). International Society for Optics and Photonics SPIE, 112891O. (Proceedings of SPIE, Vol. 11289).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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    Fast and sensitive thermoelectric bolometers based on silicon nanomembranes

    Varpula, A., Tappura, K., Tiira, J., Grigoras, K., Viherkanto, K., Ahopelto, J. & Prunnila, M., 2019.

    Research output: Contribution to conferenceOther conference contributionScientific

    Silicon Membranes for Nanophononics

    Varpula, A., Shchepetov, A., Grigoras, K., Hassel, J., Prunnila, M. & Ahopelto, J., 24 Jan 2019, 18th International Conference on Nanotechnology, NANO 2018. IEEE Institute of Electrical and Electronic Engineers, 2 p. 8626348. (Proceedings of the IEEE Conference on Nanotechnology).

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

  • Microfabricated sensor platform with through-glass vias for bidirectional 3-omega thermal characterization of solid and liquid samples

    Grosse, C., Ras, M. A., Varpula, A., Grigoras, K., May, D., Wunderle, B., Chapuis, P-O., Gomès, S. & Prunnila, M., 1 Aug 2018, In : Sensors and Actuators A: Physical. 278, p. 33-42 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  • 2 Citations (Scopus)

    Rapid Thermal Characterization of Materials with Ultra-High Resolution of Droplet Size Specimens using the Three-Omega Method

    Grosse, C., Ras, M. A., Grigoras, K., May, D., Varpula, A., Elabshihy, K., Wunderle, B. & Prunnila, M., 24 Jul 2018, Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. IEEE Institute of Electrical and Electronic Engineers, p. 562-566 5 p. 8419617

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review