Projects per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Dive into the research topics where Antti Lamminen is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Projects
- 1 Finished
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RF SAMPO
Säily, J. (Manager), Rantakari, P. (Manager), Pusa, J. (Participant), Lamminen, A. (Participant), Paaso, H. (Participant), Ahonen, A. (Participant), Somersalo, M. (Participant), Varonen, M. (Participant), Jaakkola, K. (Participant), Hirvonen, M. (Participant), Karttaavi, T. (Participant), Lahdes, M. (Participant), Forsten, H. (Participant), Parveg, D. (Participant) & Hujanen, A. (Participant)
1/11/21 → 31/08/24
Project: Business Finland project
Research output
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Integrated Radiometer at 240 GHz With SiGe MMIC Detector and GRIN Silicon Lens
Pursula, P., Lamminen, A., Forsten, H., Sipola, H., Tappura, K., Saarilahti, J., Varonen, M., Ermolov, V. & Kantanen, M., 1 Jun 2024, In: IEEE Transactions on Microwave Theory and Techniques. 72, 6, p. 3505-3513Research output: Contribution to journal › Article › Scientific › peer-review
2 Citations (Scopus) -
MMIC Design for Radiometer Receiver at 240 GHz in 0.13 μm SiGe BiCMOS Technology
Najmussadat, M., Tawfik, Y., Ahamed, R., Varonen, M., Parveg, D., Lamminen, A., Pursula, P. & Halonen, K. A. I., 2024, 2024 IEEE Nordic Circuits and Systems Conference, NORCAS 2024 : Proceedings. Nurmi, J., Rodrigues, J., Pezzarossa, L., Aberg, V. & Behmanesh, B. (eds.). IEEE Institute of Electrical and Electronic Engineers, 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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Module Implementation of 3D Sub-THz and THz Silicon Micromachined Systems
Ermolov, V., Varonen, M., Hujanen, A., Lamminen, A., Ailas, H. & Pursula, P., 2024, 2024 Asia-Pacific Microwave Conference. IEEE Institute of Electrical and Electronic Engineers, p. 61-63 3 p.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits
Ermolov, V., Lamminen, A., Varonen, M., Ailas, H., Lahti, M., Forstén, H., Kaunisto, M., Kantanen, M., Parveg, D. & Pursula, P., 26 Sept 2024, 2024 54th European Microwave Conference (EuMC). Wiley-IEEE Press, p. 581-584 4 p. 10732737Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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Wafer Level Integration of Sub-THz and THz Systems
Ermolov, V., Lamminen, A., Saarilahti, J., Varonen, M., Kantanen, M., Lahti, M. & Pursula, P., 1 Feb 2024, In: IEEE Microwave and Wireless Technology Letters. 34, 2, p. 187-190Research output: Contribution to journal › Article › Scientific › peer-review
3 Citations (Scopus)
Prizes
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2017 EuMC Microwave Prize
Pursula, P. (Recipient), Lamminen, A. (Recipient), Kantanen, M. (Recipient), Saarilahti, J. (Recipient) & Ermolov, V. (Recipient), 12 Oct 2017
Prize: Prize for a work