Anu Kärkkäinen

20042018
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MEMS Engineering & Materials Science
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Pressure sensors Engineering & Materials Science
Catheters Engineering & Materials Science
electric potential Physics & Astronomy
Magnetometers Engineering & Materials Science
alternating current Physics & Astronomy

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Projects 2015 2018

Research Output 2004 2017

  • 7 Article
  • 3 Conference article in proceedings
  • 1 Conference abstract in proceedings

Integration of a capacitive pressure sensing system into the outer catheter wall for coronary artery FFR measurements

Stam, F., Kuisma, H., Gao, F., Saarilahti, J., Gomes Martins, D., Kärkkäinen, A., Marrinan, B. & Pintal, S., 2017, Bio-MEMS and Medical Microdevices III. (Proceedings of SPIE; vol. 10247).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsResearchpeer-review

Catheters
Pressure sensors
Blood
Blood vessels
Application specific integrated circuits

Ultrathin MEMS pressure sensor and readout ASIC

Saarilahti, J., Gomes Martins, D., Kärkkäinen, A., Feng, G., Kyynäräinen, J. & Kuisma, H., 2017, DMD Europe 2017: Micro-fabrication for medical devices: Abstracts and program. 1 p. 33

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsResearchpeer-review

Open Access
Pressure sensors
Application specific integrated circuits
MEMS
Capacitive sensors
Catheters
1 Citations

New MEMS pressure sensor element and concept for coronary catheter

Kärkkäinen, A., Saarilahti, J., Kyynäräinen, J. & Kuisma, H., 2016, In : Procedia Engineering. 168, p. 76-79

Research output: Contribution to journalArticleResearchpeer-review

Open Access
Catheters
Pressure sensors
MEMS
Wire
Fabrication

3D flip chip packaging of MEMS sensor

Gädda, A., Tuovinen, R., Rimminen, H., Lalu, S., Saarilahti, J. & Kärkkäinen, A., 1 Jan 2014, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronic Engineers IEEE, 6962737

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsResearchpeer-review

Soldering alloys
Packaging
Sensors
Application specific integrated circuits
Plating

A novel MEMS gas sensor based on ultrasonic resonance cavity

Koppinen, P. J., Sillanpää, T., Kärkkäinen, A., Saarilahti, J. & Seppä, H., 1 Jan 2014, IEEE International Ultrasonics Symposium, IUS. p. 655-658 4 p. 6931795

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsResearchpeer-review

microelectromechanical systems
ultrasonics
cavities
sensors
gases