Projects per year
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- 42 Similar Profiles
MEMS
Engineering & Materials Science
microelectromechanical systems
Physics & Astronomy
Electric potential
Engineering & Materials Science
Pressure sensors
Engineering & Materials Science
Catheters
Engineering & Materials Science
electric potential
Physics & Astronomy
Magnetometers
Engineering & Materials Science
alternating current
Physics & Astronomy
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Projects 2015 2018
- 1 Finished
InForMed: An integrated pilot line for micro-fabricated medical devices
1/06/15 → 30/09/18
Project: Research › EU project
Research Output 2004 2017
Integration of a capacitive pressure sensing system into the outer catheter wall for coronary artery FFR measurements
Stam, F., Kuisma, H., Gao, F., Saarilahti, J., Gomes Martins, D., Kärkkäinen, A., Marrinan, B. & Pintal, S., 1 Jan 2017, Bio-MEMS and Medical Microdevices III. Giouroudi, I., Giouroudi, I., Delgado-Restituto, M. & van den Driesche, S. (eds.). Vol. 10247. 1024703. (Proceedings of SPIE; vol. 10247).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Research › peer-review
Catheters
Pressure sensors
Blood
Blood vessels
Application specific integrated circuits
Ultrathin MEMS pressure sensor and readout ASIC
Saarilahti, J., Gomes Martins, D., Kärkkäinen, A., Feng, G., Kyynäräinen, J. & Kuisma, H., 2017, DMD Europe 2017: Micro-fabrication for medical devices: Abstracts and program. 1 p. 33Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Research › peer-review
Open Access
Pressure sensors
Application specific integrated circuits
MEMS
Capacitive sensors
Catheters
New MEMS pressure sensor element and concept for coronary catheter
Kärkkäinen, A., Saarilahti, J., Kyynäräinen, J. & Kuisma, H., 2016, In : Procedia Engineering. 168, p. 76-79Research output: Contribution to journal › Article › Research › peer-review
Open Access
Catheters
Pressure sensors
MEMS
Wire
Fabrication
3D flip chip packaging of MEMS sensor
Gädda, A., Tuovinen, R., Rimminen, H., Lalu, S., Saarilahti, J. & Kärkkäinen, A., 1 Jan 2014, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronic Engineers IEEE, 6962737Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Research › peer-review
Soldering alloys
Packaging
Sensors
Application specific integrated circuits
Plating
A novel MEMS gas sensor based on ultrasonic resonance cavity
Koppinen, P. J., Sillanpää, T., Kärkkäinen, A., Saarilahti, J. & Seppä, H., 1 Jan 2014, IEEE International Ultrasonics Symposium, IUS. p. 655-658 4 p. 6931795Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Research › peer-review
microelectromechanical systems
ultrasonics
cavities
sensors
gases