No photo of Henri Ailas

Henri Ailas

20192019
If you made any changes in Pure these will be visible here soon.

Fingerprint Dive into the research topics where Henri Ailas is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 3 Similar Profiles
Encapsulation Chemical Compounds
MEMS Engineering & Materials Science
Copper Chemical Compounds
Mirrors Engineering & Materials Science
Temperature Engineering & Materials Science
Eutectics Chemical Compounds
Packaging Chemical Compounds
Surface roughness Chemical Compounds

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output 2019 2019

  • 1 Conference article in proceedings
  • 1 Master's thesis

Copper thermocompression for MEMS encapsulation: Master’s thesis

Ailas, H., 7 May 2019, Aalto University. 97 p.

Research output: ThesisMaster's thesisTheses

Open Access
Encapsulation
Copper
Eutectics
Packaging
Mirrors

Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror

Ailas, H., Saarilahti, J., Pensala, T. & Kiihamäki, J., 22 May 2019, (Submitted) International Microelectronics and Packaging Society, Nordic: NordPac 2019.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Encapsulation
MEMS
Mirrors
Copper
Temperature