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Henri Ailas

20192019
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Fingerprint Dive into the research topics where Henri Ailas is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 3 Similar Profiles
Encapsulation Chemical Compounds
Copper Chemical Compounds
Mirrors Chemical Compounds
MEMS Chemical Compounds
Temperature Chemical Compounds
Packaging Chemical Compounds
Acetic Acid Chemical Compounds
Coatings Chemical Compounds

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Research Output 2019 2019

  • 1 Conference article in proceedings
  • 1 Master's thesis

Copper thermocompression for MEMS encapsulation: Master’s thesis

Ailas, H., 7 May 2019, Aalto University. 97 p.

Research output: ThesisMaster's thesis

Open Access
Encapsulation
Copper
Eutectics
Packaging
Mirrors

Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS Mirror

Ailas, H., Saarilahti, J., Pensala, T. & Kiihamäki, J., 11 Jun 2019, 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019. IEEE Institute of Electrical and Electronic Engineers , p. 12-16 8760353

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Encapsulation
MEMS
Mirrors
Copper
Temperature