Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure
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Collaborations and top research areas from the last five years
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Med-IPUT: MEDical Integrated Photonic Ultrasound Transducers
Marin Vasquez, Y. (Manager), Heimala, P. (Participant), Sun, F. (Participant), Ylinen, S. (Participant), Eskelinen, P. (Participant), Ailas, H. (Participant), Lee, J.-W. (Participant) & Harjanne, M. (Participant)
1/01/23 → 30/06/26
Project: EU project
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Beetles: BEOL ecosystem for Telecommunication and Sensors
Salo, T. (Manager), Dekker, J. R. (Participant), Ailas, H. (Participant), Pensala, T. (Participant), Khan, W. (Participant), Pohjonen, H. (Participant), Arpiainen, S. (Manager), Pehto, E. (Participant), Eskelinen, P. (Participant), Soikkeli, M. (Participant), Rantakari, P. (Manager), Saijets, J. (Participant), Pusa, J. (Participant), Järvi, K. (Participant) & Marles, J. (Participant)
1/06/21 → 31/05/24
Project: Business Finland project
Research output
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Module Implementation of 3D Sub-THz and THz Silicon Micromachined Systems
Ermolov, V., Varonen, M., Hujanen, A., Lamminen, A., Ailas, H. & Pursula, P., 2024, 2024 Asia-Pacific Microwave Conference. IEEE Institute of Electrical and Electronic Engineers, p. 61-63 (Asia-Pacific Conference on Microwave).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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Patterning of Miniaturized Oxide TFTs with High-Resolution Reverse-Offset Printing for Low-Voltage IoT Applications
Sneck, A., Liu, F., Eskelinen, P., Halonen, O., Eiroma, K., Suhonen, M., Ailas, H., Sandberg, H. G. O., Alastalo, A. & Leppäniemi, J., 5 Dec 2024, 2024 MRSFall Meeting & Exhibit : abstract-program. Materials Research Society, EN09.10.03Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Scientific
Open Access -
Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits
Ermolov, V., Lamminen, A., Varonen, M., Ailas, H., Lahti, M., Forstén, H., Kaunisto, M., Kantanen, M., Parveg, D. & Pursula, P., 26 Sept 2024, 2024 54th European Microwave Conference (EuMC). Wiley-IEEE Press, p. 581-584 4 p. 10732737Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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High-resolution reverse-offset printing-based patterning of thin films for metal oxide TFTs
Sneck, A., Liu, F., Leppäniemi, J., Halonen, O., Eiroma, K. & Ailas, H., 25 Aug 2023, The 23rd International Meeting on Information Display IMID 2023 : Final Program Book. p. 42 1 p.Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Scientific
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Reverse-Offset Printing of Polymer Resist Ink for Micrometer-Level Patterning of Metal and Metal-Oxide Layers
Sneck, A., Ailas, H., Gao, F. & Leppäniemi, J., 8 Sept 2021, In: ACS Applied Materials & Interfaces. 13, 35, p. 41782-41790Research output: Contribution to journal › Article › Scientific › peer-review
Open Access24 Link opens in a new tab Citations (Scopus)
Activities
- 2 Conference presentation
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Patterning of Miniaturized Oxide TFTs with High-Resolution Reverse-Offset Printing for Low-Voltage IoT Applications
Sneck, A. (Speaker), Liu, F. (Contributor), Eskelinen, P. (Contributor), Halonen, O. (Contributor), Eiroma, K. (Contributor), Suhonen, M. (Contributor), Sandberg, H. (Contributor), Ailas, H. (Contributor), Alastalo, A. (Contributor) & Leppäniemi, J. (Contributor)
5 Dec 2024Activity: Talk or presentation types › Conference presentation
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Oxide TFTs patterned by high-resolution reverse-offset printed resist layers
Liu, F. (Speaker), Sneck, A. (Contributor), Ailas, H. (Contributor), Eiroma, K. (Contributor), Alastalo, A. (Contributor) & Leppäniemi, J. (Contributor)
17 Oct 2022Activity: Talk or presentation types › Conference presentation