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Henri Ailas

20192019
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Research Output 2019 2019

  • 1 Conference article in proceedings
  • 1 Master's thesis
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Conference article in proceedings
2019

Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror

Ailas, H., Saarilahti, J., Pensala, T. & Kiihamäki, J., 22 May 2019, (Submitted) International Microelectronics and Packaging Society, Nordic: NordPac 2019.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Encapsulation
MEMS
Mirrors
Copper
Temperature