James R. Dekker

20032018
If you made any changes in Pure these will be visible here soon.

Fingerprint Dive into the research topics where James R. Dekker is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 29 Similar Profiles
MEMS Engineering & Materials Science
microelectromechanical systems Physics & Astronomy
silicon Physics & Astronomy
Resonators Engineering & Materials Science
Silicon Engineering & Materials Science
wafers Physics & Astronomy
resonators Physics & Astronomy
Wafer bonding Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output 2003 2018

Laterally acoustically coupled BAW filters at 3.6 GHz

Pensala, T., Makkonen, T., Dekker, J. R. & Ylilammi, M., 2018, 2018 IEEE International Ultrasonics Symposium: IUS 2018. IEEE Institute of Electrical and Electronic Engineers , p. 1-4 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Aluminum nitride
Insertion losses
Bandwidth

PiezoMEMS at VTT: R&D and manufacturing services

Dekker, J. & Pensala, T., 2017. 42 p.

Research output: Contribution to conferenceConference articleProfessional

silicon
manufacturing
sensor
substrate
cost

Self-assembled three-dimensional inverted photonic crystals on a photonic chip

Arpiainen, S., Vynck, K., Dekker, J., Kapulainen, M., Khunsin, W., Aalto, T., Mulot, M., Kocher-Oberlehrer, G., Zentel, R., Torres, C. M. S., Cassagne, D. & Ahopelto, J., 1 Sep 2017, In : Physica Status Solidi A: Applications and Materials Science. 214, 9, 1700039.

Research output: Contribution to journalArticleScientificpeer-review

Photonic crystals
Photonics
chips
photonics
Silicon
4 Citations (Scopus)

Design rules for temperature compensated degerately n-type-doped silicon MEMS resonators

Jaakkola, A., Prunnila, M., Pensala, T., Dekker, J. & Pekko, P., 2016, In : Journal of Microelectromechanical Systems. 24, 6, p. 1832-1839

Research output: Contribution to journalArticleScientificpeer-review

MEMS
Resonators
Silicon
Doping (additives)
Elastic constants
3 Citations (Scopus)

Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

Manier, C-A., Zoschke, K., Wilke, M., Oppermann, H., Ruffieux, D., Dalla Piazza, S., Suni, T., Dekker, J., Allegato, G. & Lang, K-D., 18 Jul 2016, Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2016 Symposium on. IEEE Institute of Electrical and Electronic Engineers , p. 1-6

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

packaging
microelectromechanical systems
CMOS
time measurement
wafers