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INIS
applications
28%
bonding
16%
charges
14%
control
35%
coolers
48%
cooling
55%
cryogenics
100%
deposition
24%
design
32%
devices
83%
electrodes
19%
electrolysis
24%
electrons
35%
energy
35%
films
24%
holes
27%
indium
12%
junctions
47%
layers
26%
low temperature
18%
metals
28%
molybdenum carbides
24%
niobium
24%
noise
33%
optimization
30%
oxides
45%
performance
51%
power
26%
quantum bits
13%
quantum computers
12%
quantum dots
48%
qubits
58%
refrigeration
39%
refrigerators
56%
resonators
16%
semiconductor materials
21%
silicon
96%
size
14%
solids
38%
solutions
19%
substrates
28%
superconducting junctions
24%
superconductivity
10%
temperature range
16%
thermal conduction
16%
thin films
30%
tunnel junctions
56%
vertical integration
24%
x radiation
24%
x-ray diffraction
12%
Keyphrases
3D Integration
36%
Atomic Layer Deposition
24%
Carbide Thin Films
24%
Charge Noise
22%
Chip-scale
16%
Complementary Metal Oxide Semiconductor
24%
Conformality
12%
Cryogenic Technology
24%
Deposition Process
12%
Double Quantum Dot
24%
Electrolytic Cell
24%
Electronics Cooling
24%
Energy Efficient
12%
Flip-chip Assembly
24%
Ground Plane
24%
High-energy X-rays
24%
High-speed Data Transfer
12%
Low Noise
30%
Molybdenum Carbide
24%
Multiplexing
48%
Niobium
24%
On chip
60%
Operando Measurements
24%
Optical Control
24%
Performance Limits
24%
Processor chips
12%
Quantum Bit
20%
Quantum Devices
24%
Quantum Dots
48%
Quantum Processor
16%
Quantum Technologies
36%
Qubit
42%
Refrigeration
40%
Refrigeration Performance
12%
Refrigerator
40%
Resonator
24%
Scattering Techniques
24%
Self-heating Effect
12%
Silicon Quantum Dots (Si QDs)
14%
Silicon-based
22%
Single Quantum Dot
24%
Solid-state Cooler
24%
Superconducting Junction
24%
Superconducting Tunnel Junctions
42%
Temperature Range
14%
Thermal Resistance
36%
Through Silicon via
24%
Tunnel Junction
12%
Vanadium
12%
Vertical Integration
24%