INIS
applications
23%
bonding
22%
cables
11%
charges
14%
compression
11%
control
40%
coolers
33%
cooling
22%
cryogenics
74%
deposition
33%
design
33%
devices
77%
electrodes
22%
electrolysis
33%
electrons
44%
energy
44%
films
33%
holes
33%
increasing
11%
indium
16%
layers
33%
low temperature
16%
metals
25%
molybdenum carbides
33%
noise
33%
optimization
37%
oxides
14%
performance
66%
power
18%
quality factor
11%
quantum bits
18%
quantum dots
33%
qubits
33%
refrigeration
33%
refrigerators
44%
resonators
22%
semiconductor materials
14%
silicon
100%
solids
44%
solutions
14%
substrates
40%
superconducting junctions
33%
temperature dependence
11%
thermal conduction
22%
thickness
13%
thin films
33%
tunnel junctions
27%
vertical integration
33%
x radiation
33%
x-ray diffraction
17%
Keyphrases
3D Integration
50%
Atomic Layer Deposition
33%
Carbide Thin Films
33%
Charge Noise
22%
Complex Structure
16%
Conformality
16%
Deposition Process
16%
Diffraction Ray
16%
Electrolytic Cell
33%
Energy Efficient
16%
Flip-chip Assembly
33%
Functional Characterization
16%
Ground Plane
33%
High Growth Rate
16%
High-energy X-rays
33%
High-speed Data Transfer
16%
Low Noise
33%
Molybdenum Carbide
33%
Multiplexing
33%
On chip
50%
Operando Measurements
33%
Optical Control
33%
Performance Limits
33%
Phase Analysis
16%
Processor chips
16%
Quantum Bit
27%
Quantum Devices
33%
Quantum Dots
33%
Quantum Processor
22%
Quantum Technologies
50%
Qubit
33%
Radio-frequency Cables
16%
Raman Modes
16%
Refrigeration
33%
Refrigeration Performance
16%
Refrigerator
33%
Resonator
33%
Scattering Techniques
33%
Self-heating Effect
16%
Semiconductor Devices
16%
Silicon-based
22%
Solid-state Cooler
33%
Superconducting Junction
33%
Superconducting Tunnel Junctions
25%
Thermal Resistance
50%
Through Silicon via
33%
Tunnel Junction
16%
Vanadium
16%
Vertical Integration
33%
X-ray Photoelectron Spectroscopy
16%
