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Jyrki Kiihamäki

1991 …2019
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Research Output 1991 2019

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Conference article in proceedings
2019

Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS Mirror

Ailas, H., Saarilahti, J., Pensala, T. & Kiihamäki, J., 11 Jun 2019, 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019. Institute of Electrical and Electronic Engineers IEEE, p. 12-16 5 p. 8760353. (Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Encapsulation
MEMS
Mirrors
Copper
Temperature
2011
4 Citations (Scopus)

Reducing stiction in Microelectromechanical Systems by nanometer-scale films grown by atomic layer deposition

Puurunen, R., Häärä, A., Ritala, H., Dekker, J. R., Kainlauri, M., Pohjonen, H., Suni, T., Kiihamäki, J., Santala, E., Leskelä, M. & Kattelus, H., 2011, Proceedings: 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2011. Institute of Electrical and Electronic Engineers IEEE, p. 1887-1890

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

stiction
atomic layer epitaxy
microelectromechanical systems
cantilever beams
silicon