INIS
cryogenics
100%
kinetics
83%
inductance
83%
bolometers
83%
performance
77%
radiations
66%
security
50%
detection
50%
applications
44%
power
44%
sensitivity
33%
risks
33%
comparative evaluations
33%
humans
33%
noise
33%
temperature dependence
27%
bonding
27%
silicon
27%
compression
27%
values
27%
indium
27%
electrons
27%
heating load
27%
low temperature
27%
solids
27%
thermalization
27%
thermal conduction
27%
devices
27%
management
27%
junctions
27%
narcotics
16%
water
16%
increasing
16%
packaging
16%
explosives
16%
signals
16%
industrial plants
16%
data
16%
finland
16%
clothing
16%
superconducting films
16%
people
16%
losses
16%
metals
16%
spatial resolution
16%
fabrication
16%
organic matter
16%
fluids
16%
temperature range 0273-0400 k
16%
thermal properties
16%
Keyphrases
Flip-chip Assembly
83%
Thermal Resistance
83%
3D Integration
41%
Interchip
41%
Thermal Isolation
20%
Microsystems
20%
Thermal Management
20%
Integration Techniques
20%
Thermalization
20%
Resistance Value
20%
Temperature Effect
20%
Indium Bump
20%
Power Law
20%
Thermal Conduction
20%
Heat Load
20%
Microrefrigerators
20%
Compression Bonding
20%
Interfacial Thermal Resistance
20%
Solid-state Junction
20%
Contact Area
20%
Flip chip
20%
Phononics
20%
Cryogenic Temperature
20%
Bonded Assemblies
20%
Thermal Contact
20%
Quantum Technologies
20%
Low Temperature Devices
20%
Silicon chip
20%
Anatomical Complexity
16%
Engineering
Focal Plane
83%
Thermal Resistance
83%
Terahertz
83%
Imaging Systems
83%
Low-Temperature
41%
Temperature Dependence
20%
Thermal Loads
20%
Contact Area
20%
Interfacial Thermal Resistance
20%
Microsystem
20%
Cryogenic Temperature
20%
Dielectrics
10%
Microfabrication
10%
Geographical Location
10%
Clothing Material
10%
Thermal Noise
10%
Signal Amplification
10%
Spatial Resolution
10%
Conventional Method
10%
Millimeter Wave
10%
Conduction Loss
10%
Close Range
10%
Technical Research Centre
10%
Room Temperature
10%
Frame Rate
10%
Packaging Material
10%
Responsivity
10%
