INIS
applications
44%
bolometers
83%
bonding
27%
clothing
16%
comparative evaluations
33%
compression
27%
cryogenics
100%
data
16%
detection
50%
devices
27%
electrons
27%
explosives
16%
fabrication
16%
finland
16%
fluids
16%
heating load
27%
humans
33%
increasing
16%
indium
27%
inductance
83%
industrial plants
16%
junctions
27%
kinetics
83%
losses
16%
low temperature
27%
management
27%
metals
16%
narcotics
16%
noise
33%
organic matter
16%
packaging
16%
people
16%
performance
77%
power
44%
radiations
66%
risks
33%
security
50%
sensitivity
33%
signals
16%
silicon
27%
solids
27%
spatial resolution
16%
superconducting films
16%
temperature dependence
27%
temperature range 0273-0400 k
16%
thermal conduction
27%
thermal properties
16%
thermalization
27%
values
27%
water
16%
Keyphrases
3D Integration
41%
Anatomical Complexity
16%
Black Men
16%
Bolometer
83%
Bonded Assemblies
20%
Compression Bonding
20%
Concealed Object Detection
33%
Contact Area
20%
Cryogenic Temperature
20%
Fabrication Methods
16%
Flip chip
20%
Flip-chip Assembly
83%
Focal Plane Array
83%
Heat Load
20%
High Bandwidth
16%
High Kinetics
16%
High Performance
33%
High-throughput
16%
Human Contact
16%
Indium Bump
20%
Industrial Facilities
16%
Integration Techniques
20%
Interchip
41%
Interfacial Thermal Resistance
20%
Kinetic Inductance
83%
Low Temperature
33%
Low Temperature Devices
20%
Microrefrigerators
20%
Microsystems
20%
Passive Terahertz Imaging
83%
Phononics
20%
Power Law
20%
Quantum Technologies
20%
Resistance Value
20%
Security Imaging
33%
Signal Amplification
16%
Silicon chip
20%
Solid-state Junction
20%
Submillimeter-wave
16%
Superconducting Parameters
16%
Temperature Effect
20%
Terahertz Imaging
16%
Terahertz Imaging Systems
83%
Terahertz Radiation
66%
Thermal Conduction
20%
Thermal Contact
20%
Thermal Isolation
20%
Thermal Management
20%
Thermal Resistance
83%
Thermalization
20%
Engineering
Close Range
10%
Clothing Material
10%
Conduction Loss
10%
Contact Area
20%
Conventional Method
10%
Cryogenic Temperature
20%
Dielectrics
10%
Focal Plane
83%
Frame Rate
10%
Geographical Location
10%
Heat Resistance
83%
Imaging Systems
83%
Interfacial Thermal Resistance
20%
Low-Temperature
41%
Microfabrication
10%
Microsystem
20%
Millimeter Wave
10%
Packaging Material
10%
Responsivity
10%
Room Temperature
10%
Signal Amplification
10%
Spatial Resolution
10%
Technical Research Centre
10%
Temperature Dependence
20%
Terahertz
83%
Thermal Load
20%
Thermal Noise
10%
