Projects per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
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Projects
- 1 Active
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APECS-PL: Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line
Pekko, P. (Manager), Morits, D. (Participant), Alastalo, A. (Owner), Vainio, M.-R. (Participant), Elomaa, S. (Participant) & Lahti, M. (Participant)
1/11/24 → 30/06/29
Project: EU project
Research output
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Cryogenic characterization of LTCC material in Millimeter-Wave Frequencies
Vargas-Millalonco, F., Martinez-Ledesma, M., Reeves, R., Rodriguez, R., Paaso, J., Lahti, M., Kaunisto, M. & Varonen, M., 1 Jun 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 6, p. 1007-1014 8 p.Research output: Contribution to journal › Article › Scientific › peer-review
2 Citations (Scopus) -
Optically pumped magnetometer arrays for magnetoencephalography (OPMMEG)
Lahti, M., 2024, 60th Annual Microelectronics and Packaging Conference and Exhibition (NordPac 2024). IMAPS NordicResearch output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits
Ermolov, V., Lamminen, A., Varonen, M., Ailas, H., Lahti, M., Forstén, H., Kaunisto, M., Kantanen, M., Parveg, D. & Pursula, P., 26 Sept 2024, 2024 54th European Microwave Conference (EuMC). Wiley-IEEE Press, p. 581-584 4 p. 10732737Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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Wafer Level Integration of Sub-THz and THz Systems
Ermolov, V., Lamminen, A., Saarilahti, J., Varonen, M., Kantanen, M., Lahti, M. & Pursula, P., 1 Feb 2024, In: IEEE Microwave and Wireless Technology Letters. 34, 2, p. 187-190Research output: Contribution to journal › Article › Scientific › peer-review
3 Citations (Scopus) -
In-line Vector Modulator Integration in Dielectric-filled Waveguide
Haarla, J., Ala-Laurinaho, J., Lahti, M., Varonen, M., Kantanen, M., Holmberg, J. & Viikari, V., 1 Feb 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 2, p. 153-160 8 p.Research output: Contribution to journal › Article › Scientific › peer-review
Open Access2 Citations (Scopus)