Markku Lahti

Senior Scientist

20012019
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Research Output 2001 2019

  • 36 Conference article in proceedings
  • 21 Article
  • 1 Chapter or book article
  • 1 Conference article
2019
1 Citation (Scopus)

A Wide-Angle Scanning Switched-Beam Antenna System in LTCC Technology with High Beam Crossing Levels for V-band Communications

Manzillo, F. F., Śmierzchalski, M., Le Coq, L., Ettorre, M., Aurinsalo, J., Kautio, K. T., Lahti, M. S., Lamminen, A. E. I., Saily, J. & Sauleau, R., 17 Jan 2019, In : IEEE Transactions on Antennas and Propagation. 67, 1, p. 541-553 13 p., 8502146.

Research output: Contribution to journalArticleScientificpeer-review

Antennas
Scanning
Communication
Switches
Temperature
1 Citation (Scopus)

Near-Field UHF RFID Transponder with a Screen-Printed Graphene Antenna

Jaakkola, K., Sandberg, H., Lahti, M. & Ermolov, V., Apr 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 4, p. 616-623 8 p.

Research output: Contribution to journalArticleScientificpeer-review

Transponders
Graphite
Radio frequency identification (RFID)
Graphene
Antennas
2018

Multibeam antenna with a passive beamforming system in LTCC technology for Mm-wave systems-in-package

Manzillo, F. F., Smierzchálski, M., Ettorre, M., Aurinsalo, J., Kautio, K. T., Lahti, M. S., Lamminen, A. E. I., Säily, J. & Sauleau, R., 2018, 12th European Conference on Antennas and Propagation . Institution of Engineering and Technology IET, Vol. CP741. 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Multibeam antennas
Beamforming
Antennas
Millimeter waves
Wireless networks
1 Citation (Scopus)

Reliability assessment and failure mode analysis of MEMS accelerometers for space applications

Marozau, I., Auchlin, M., Pejchal, V., Souchon, F., Vogel, D., Lahti, M., Saillen, N. & Sereda, O., 1 Sep 2018, In : Microelectronics Reliability. 88-90, p. 846-854 9 p.

Research output: Contribution to journalArticleScientificpeer-review

failure modes
Space applications
accelerometers
Accelerometers
Failure modes

SIW Cavity Filters with Embedded Planar Resonators in LTCC Package for 5G Applications

Showail, J., Lahti, M., Kautio, K., Arabi, E., Rantakari, P., Huhtinen, I., Vähä-Heikkilä, T. & Shamim, A., 2018, 48th European Microwave Conference (EuMC). Institute of Electrical and Electronic Engineers IEEE, p. 757-760 4 p. 8541552

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Resonators
Insertion losses
Bandwidth
Strip telecommunication lines
Temperature
2017
2 Citations (Scopus)

90-GHz CMOS phased-array transmitter integrated on LTCC

Vahdati, A., Lamminen, A., Varonen, M., Säily, J., Lahti, M., Kautio, K., Lahdes, M., Parveg, D., Karaca, D. & Halonen, K., 1 Dec 2017, In : IEEE Transactions on Antennas and Propagation. 65, 12, p. 6363-6371 9 p., 8014513.

Research output: Contribution to journalArticleScientificpeer-review

Antenna phased arrays
Transmitters
Temperature
Horn antennas
Monolithic microwave integrated circuits
2 Citations (Scopus)

An LTCC beam-switching antenna with high beam overlap for 60-GHz mobile access points

Foglia Manzillo, F., Smierzchalski, M., Ettorre, M., Aurinsalo, J., Kautio, K., Lahti, M., Lamminen, A., Säily, J. & Sauleau, R., 2017, 2017 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting. Institute of Electrical and Electronic Engineers IEEE, p. 1441-1442 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

beam switching
antennas
ceramics
Antennas
Antenna feeders
2 Citations (Scopus)

Low-power and low-profile miniature atomic clock ceramic based flat form factor miniature atomic clock physics package (C-MAC)

Haesler, J., Balet, L., Karlen, S., Overstolz, T., Gallinet, B., Lecomte, S., Droz, F., Kautio, K., Karioja, P., Lahti, M., Maattanen, A., Lahtinen, O. & Hevonkorpi, V., 27 Oct 2017, 2017 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFC 2017). Institute of Electrical and Electronic Engineers IEEE, p. 55-56 2 p. 8088798

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Atomic clocks
atomic clocks
form factors
Physics
ceramics
1 Citation (Scopus)

Parallel fed 2×1 antenna array utilizing surface wave cancellation on LTCC substrate

Hagn, J., Frascolla, V., Sauleau, R., Aurinsalo, J., Lahti, M. & Kautio, K., 15 May 2017, 2017 11th European Conference on Antennas and Propagation (EUCAP). Institute of Electrical and Electronic Engineers IEEE, p. 185-189 5 p. 7928258

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Antenna feeders
Antenna arrays
Surface waves
Antennas
Substrates
2016

A long slot array fed by a multilayer true-time delay network in LTCC for 60-GHz communications

Manzillo, F. F., Ettorre, M., Lahti, M., Kautio, K., Lelaidier, D., Seguenot, E. & Sauleau, R., 2 Jun 2016, Antennas and Propagation (EuCAP), 2016 10th European Conference on. Institute of Electrical and Electronic Engineers IEEE, p. 1-5

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Millimeter waves
Time delay
Multilayers
HIgh speed networks
Communication
33 Citations (Scopus)

A multilayer LTCC solution for integrating 5G access point antenna modules

Foglia Manzillo, F., Ettorre, M., Lahti, M. S., Kautio, K. T., Lelaidier, D., Seguenot, E. & Sauleau, R., 2016, In : IEEE Transactions on Microwave Theory and Techniques. 64, 7, p. 2272-2283

Research output: Contribution to journalArticleScientificpeer-review

Multilayers
antennas
modules
ceramics
Antennas
2 Citations (Scopus)

A V-band antenna module based on vertical TEM waveguides fully integrated in LTCC

Manzillo, F. F., Ettorre, M., Smierzchalski, M., Sauleau, R., Lahti, M., Kautio, K., Lelaidier, D. & Seguenot, E., 27 Oct 2016, Antennas and Propagation (APSURSI), 2016 IEEE International Symposium on. Institute of Electrical and Electronic Engineers IEEE, p. 387-388

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Waveguides
Antennas
Communication systems
Bandwidth
Temperature
2015
1 Citation (Scopus)

Low temperature co-fired ceramic antenna for 35 GHz applications with a wideband GCPW to stripline transition

Brunea, A., Neculoiu, D., Lahti, M. & Vähä-Heikkilä, T., 2015, In : Romanian Journal of Information Science and Technology. 17, 4, p. 305-319

Research output: Contribution to journalArticleScientificpeer-review

Coplanar waveguides
Antennas
Strip telecommunication lines
Insertion losses
Temperature

Microsystem integration from RF to millimeter wave applications

Vähä-Heikkilä, T. & Lahti, M., 2015, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems. International Society for Optics and Photonics SPIE, 95170R. (Proceedings of SPIE, Vol. 9517).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Microsystems
Millimeter waves
Packaging
Microwaves
Consumer products

Substrate integrated waveguide fed LTCC microstrip patch antenna for 94 GHz applications

Bunea, A. C., Neculoiu, D., Lahti, M. & Vaha-Heikkila, T., 17 Dec 2015, Semiconductor Conference (CAS), 2015 International. Institute of Electrical and Electronic Engineers IEEE, p. 127-130

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Substrate integrated waveguides
Antenna feeders
Microstrip antennas
Bandwidth
Tapes
2014
20 Citations (Scopus)

A 3-D miniaturized high selectivity bandpass filter in LTCC technology

Arabi, E., Lahti, M., Vähä-Heikkilä, T. & Shamim, A., 2014, In : IEEE Microwave and Wireless Components Letters. 24, 1, p. 8-10

Research output: Contribution to journalArticleScientificpeer-review

Bandpass filters
bandpass filters
selectivity
filters
rejection
1 Citation (Scopus)

A study on the effect of wire bonding interconnects of BCB capped CPW to CPW on LTCC substrate

Seok, S., Kim, J. & Lahti, M., 2014, In : Microwave and Optical Technology Letters. 56, 6, p. 1378-1381

Research output: Contribution to journalArticleScientificpeer-review

wire
Wire
ceramics
Substrates
chips
5 Citations (Scopus)

MEMS, MOEMS, RF-MEMS and photonics packaging based on LTCC technology

Karioja, P., Kautio, K., Ollila, J., Keränen, K., Karppinen, M., Heikkinen, V., Jaakola, T. & Lahti, M., 2014, Proceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014. Institute of Electrical and Electronic Engineers IEEE, 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

MOEMS
Photonics
MEMS
Packaging
Temperature

MEMS- and MOEMS-Based Near-Infrared Spectrometers

Antila, J., Tuohiniemi, M., Rissanen, A., Kantojärvi, U., Lahti, M., Viherkanto, K., Kaarre, M. & Malinen, J., 2014, Encyclopedia of Analytical Chemistry. Wiley, p. 1-36

Research output: Chapter in Book/Report/Conference proceedingChapter or book articleProfessional

Infrared spectrometers
Spectrometers
Near infrared spectroscopy
Fabry-Perot interferometers
Light modulators
2013
5 Citations (Scopus)

Hermetic packaging for millimetre wave applications

Lahti, M., Kautio, K., Ollila, J., Vähä-Heikkilä, T. & Kaunisto, M., 2013, Proceedings: European Microelectronics and Packaging Conference, EMPC 2013 . Institute of Electrical and Electronic Engineers IEEE, 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Millimeter waves
Packaging
Ceramic materials
Soldering alloys
Melting point
3 Citations (Scopus)

LTCC Microstrip parasitic patch antenna for 77 GHz automotive applications

Bunea, A-C., Neculoiu, D., Lahti, M. & Vähä-Heikkilä, T., 2013, 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS 2013). Institute of Electrical and Electronic Engineers IEEE, 6685305

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Microstrip antennas
Radiation
Antenna feeders
Antennas
Temperature

Microstrip parasitic patch array with substrate integrated waveguide feed for 35 GHz applications

Bunea, A-C., Neculoiu, D., Lahti, M. & Vähä-Heikkilä, T., 2013.

Research output: Contribution to conferenceConference articleScientificpeer-review

Substrate integrated waveguides
Antenna feeders
Microstrip antennas
Antennas
Coplanar waveguides
1 Citation (Scopus)

RF-MEMS reconfigurable GaAs MMICs and antennas for microwave/MM-wave applications

Malmqvist, R., Jonsson, R., Samuelsson, C., Gustafsson, A., Reyaz, S., Dancila, D., Rydberg, A., Grandchamp, B., Seok, S., Fryziel, M., Rolland, P-A., Rantakari, P., Lahti, M., Vähä-Heikkilä, T. & Baggen, R., 2013, CAS 2013 Proceedings : 36th International Semiconductor Conference. Institute of Electrical and Electronic Engineers IEEE, Vol. 2. p. 83-88

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Monolithic microwave integrated circuits
MEMS
Microwaves
Antennas
Switching circuits
2012
1 Citation (Scopus)

94 GHz substrate integrated waveguide fed antenna in LTCC technology

Bunea, A-C., Neculoiu, D., Lahti, M. & Vähä-Heikkilä, T., 2012, Proceedings: IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012. Institute of Electrical and Electronic Engineers IEEE, p. 283-284

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Substrate integrated waveguides
Antenna feeders
Antenna arrays
Antennas
Tapes
8 Citations (Scopus)

Hot laminated multilayer polymer illumination structure based in embedded LED chips

Keränen, K., Mäkinen, J-T., Heikkinen, M., Hiltunen, M., Koponen, M., Lahti, M., Sunnari, A. & Rönkä, K., 2012, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 2, 12, p. 1965-1972 7 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
Light emitting diodes
Polymers
Multilayers
Lighting
Color

LTCC filter based on via resonators

Kondratyev, V., Kautio, K. & Lahti, M., 2012, Proceedings: 42nd European Microwave Conference, EuMC 2012. Institute of Electrical and Electronic Engineers IEEE, p. 1111-1114

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Resonators
Temperature
Poles
2011
35 Citations (Scopus)

60-GHz millimeter-wave identification reader on 90-nm CMOS and LTCC

Pursula, P., Karttaavi, T., Kantanen, M., Lamminen, A., Holmberg, J., Lahdes, M., Marttila, I., Lahti, M., Luukanen, A. & Vähä-Heikkilä, T., 2011, In : IEEE Transactions on Microwave Theory and Techniques. 59, 4, p. 1166-1173 8 p.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
readers
Millimeter waves
millimeter waves
CMOS
modules
7 Citations (Scopus)

Design and experiments of 77 GHz antennas in LTCC technology

Neculoiu, D., Lahti, M., Stefanescu, A., Muller, A. A. & Vähä-Heikkilä, T., 2011, Proceedings of the 5th European Conference on Antennas and Propagation, EUCAP 2011. Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE, p. 253-257

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Microstrip antennas
Antennas
Electromagnetic waves
Experiments
Bandwidth
1 Citation (Scopus)

Design and experiments of a 77 GHz receiver in LTCC technology

Neculoiu, D., Lahti, M., Bunea, A. C., Stefanescu, A. & Vähä-Heikkilä, T., 2011, Asia-Pacific Microwave Conference Proceedings, APMC. Institute of Electrical and Electronic Engineers IEEE, p. 453-456

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Microstrip antennas
Nonlinear analysis
Millimeter waves
Electromagnetic waves
Diodes
6 Citations (Scopus)

Investigation of substrate integrated waveguide in LTCC technology for mm-wave applications

Bunea, A-C., Lahti, M., Neculoiu, D., Stefanescu, A. & Vähä-Heikkilä, T., 2011, Proceedings of the Asia-Pacific Microwave Conference, APMC 2011. Institute of Electrical and Electronic Engineers IEEE, p. 395-398

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Substrate integrated waveguides
Coplanar waveguides
Studios
Software packages
Temperature
1 Citation (Scopus)

LTCC packaging from RF to millimeter waves

Lahti, M., Kautio, K., Kondratyev, V., Kaunisto, M. & Vähä-Heikkilä, T., 2011, IMAPS Nordic Annual Conference 2011. Kutilainen, J. (ed.). Finland: Curran Associates Inc., p. 96-101

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Millimeter waves
Packaging
Microwaves
Telecommunication systems
Mobile phones
2 Citations (Scopus)

MEMS-4-MMIC: Design of Antenna Array Front End at 24 GHz

Campo, M. A., Litschke, O., Vähä-Heikkilä, T., Lahti, M. & Baggen, R., 2011, Proceedings: 5th European Conference on Antennas and Propagation, EuCAP 2011. Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE, p. 1907-1911

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Monolithic microwave integrated circuits
Insertion losses
Antenna arrays
Semiconductor switches
Phase shifters
1 Citation (Scopus)

System-in-package LTCC platform for 3D RF to millimeter wave

Vähä-Heikkilä, T. & Lahti, M., 2011, Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems . International Society for Optics and Photonics SPIE, 79800W. (Proceedings of SPIE, Vol. 7980).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Millimeter waves
Metallizing
Antenna arrays
Temperature
Microwaves
2010
3 Citations (Scopus)

Backlight illumination structure based on inorganic LED devices and laminated multilayer polymer substrate

Keränen, K., Heikkinen, M., Hiltunen, M., Lahti, M., Mäkinen, J-T., Sunnari, A., Rekilä, J. & Rönkä, K., 2010, 2010 3rd Electronic System-Integration Technology Conference (ESTC 2010): Berlin, Germany, 13-16 Sept. 2010. Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE, 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

light emitting diodes
illumination
polymers
laminates
diffusers
19 Citations (Scopus)

Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology

Malmqvist, C., Samuelsson, C., Simon, W., Rantakari, P., Smith, D., Lahdes, M., Lahti, M., Vähä-Heikkilä, T., Varis, J. & Baggen, R., 2010, The 40th European Microwave Conference. Institute of Electrical and Electronic Engineers IEEE, p. 85-88

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Monolithic microwave integrated circuits
Foundries
MEMS
Packaging
Switches

Millimetriradio ratkaisee monta ongelmaa

Järvensivu, P., Kautio, K., Lahti, M., Lamminen, A., Säily, J., Ala-Laurinaho, J., Halonen, K., Karttunen, A., Kolmonen, V-M., Kyrö, M., Kärkkäinen, M., Sandström, D. & Varonen, M., 2010, In : Prosessori. 11, 4.

Research output: Contribution to journalArticleGeneral public

10 Citations (Scopus)

On the LTCC characterization in millimeter-waves

Kondratyev, V., Lahti, M. & Kautio, K., 2010, Conference Proceedings: European Microwave Week 2010, "Connection the World". Institute of Electrical and Electronic Engineers IEEE, p. 156-159

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Millimeter waves
Materials properties
Temperature
6 Citations (Scopus)

Thermo-mechanical simulations of LTCC packages for RF MEMS applications

Lenkkeri, J., Juntunen, E., Lahti, M. & Bouwstra, S., 2010, Proceedings: 11th International. Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2010. Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE, 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

MEMS
Wire
Substrates
Heat losses
Temperature control
2009
12 Citations (Scopus)

RF MEMS Based Impedance Matching Networks for Tunable Multi-Band Microwave Low Noise Amplifiers

Malmqvist, R., Rantakari, P., Samuelsson, C., Lahti, M., Cheng, S., Saijets, J., Vähä-Heikkilä, T., Rydberg, A. & Varis, J., 2009, Proceedings of the International Semiconductor Conference, 2009 - CAS 2009. Institute of Electrical and Electronic Engineers IEEE, p. 303-306

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Open Access
Microwave amplifiers
Low noise amplifiers
MEMS
Tuning
Millimeter waves
2008

Adhesive flip-chip interconnections for inlays of contact-less smart cards

Lenkkeri, J., Kaskiala, T., Allen, M., Jaakola, T. & Lahti, M., 2008, ARCSIS Micropackaging Days 2008: CD.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

18 Citations (Scopus)

Broadband BGA-via transitions for reliable RF/microwave LTCC-SiP module packaging

Kangasvieri, T., Halme, J., Vähäkangas, J. & Lahti, M., 2008, In : IEEE Microwave and Wireless Components Letters. 18, 1, p. 34 - 36 3 p.

Research output: Contribution to journalArticleScientificpeer-review

Electromagnetic shielding
Ball grid arrays
Microwave frequencies
Cutoff frequency
packaging
1 Citation (Scopus)

Chip/antenna interconnections for contact-less smart card applications

Lenkkeri, J., Jaakola, T., Lahti, M., Allen, M. & Kaskiala, T., 2008, Proceedings of the IMAPS Nordic Annual Conference 2008. p. 197-202

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

12 Citations (Scopus)

Low-loss and broadband BGA package transition for LTCC-SiP applications

Kangasvieri, T., Halme, J., Vähäkangas, J. & Lahti, M., 2008, In : Microwave and Optical Technology Letters. 50, 4, p. 1036 - 1040 5 p.

Research output: Contribution to journalArticleScientificpeer-review

Soldering alloys
broadband
Polychlorinated Biphenyls
solders
Insertion losses

Packaging of RF MEMS switches in LTCC

Lahti, M., Lenkkeri, J., Kautio, K., Lahdes, M. & Vähä-Heikkilä, T., 2008, Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference. p. 167-170

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

2007
2 Citations (Scopus)

High-performance vertical transition for broadband and millimetre-wave BGA module packaging

Kangasvieri, T., Halme, J., Vähäkangas, J. & Lahti, M., 2007, In : Electronics Letters. 43, 11, p. 638-639

Research output: Contribution to journalArticleScientificpeer-review

Ball grid arrays
Insertion losses
Millimeter waves
Electromagnetic waves
Packaging
6 Citations (Scopus)

Printable resistors in LTCC systems

Lahti, M., Vimpari, A. & Kautio, K., 2007, In : Journal of the European Ceramic Society. 27, 8-9, p. 2953-2956

Research output: Contribution to journalArticleScientificpeer-review

Resistors
Processing
Electric lines
2006

Finland joining forces in high performance electronics ceramic modules

Lahti, M., Kautio, K., Jaakola, T., Lenkkeri, J., Karioja, P., Vähäkangas, J., Kangasvieri, T., Uusimäki, A., Jantunen, H., Petäjäjärvi, A., Kutilainen, T. & Rönkä, K., 2006, In : Advancing Microelectronics. 33, 2, p. 10-13 4 p.

Research output: Contribution to journalArticleScientificpeer-review

Joining
Electronic equipment
Microwaves
Industry

High-power module integrated in LTCC substrate

Lahti, M., Kautio, K., Juntunen, E., Petäjä, J. & Karioja, P., 2006, 4th European Microelectronics and Packaging Symposium. p. 155-158

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

High-power module integrated into LTCC package

Lahti, M., Kautio, K., Juntunen, E. & Karioja, P., 2006, 3rd EMRS DTC Technical Conference. A13

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

1 Citation (Scopus)

Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

Lahti, M., Kautio, K. & Karioja, P., 2006, 2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE, p. 372-375

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Laminating
Heat sinks
Tapes
Processing
Laminates