Markku Lahti

Senior Scientist

20012019
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Research Output 2001 2019

  • 36 Conference article in proceedings
  • 21 Article
  • 1 Chapter or book article
  • 1 Conference article
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Conference article in proceedings
2018

Multibeam antenna with a passive beamforming system in LTCC technology for Mm-wave systems-in-package

Manzillo, F. F., Smierzchálski, M., Ettorre, M., Aurinsalo, J., Kautio, K. T., Lahti, M. S., Lamminen, A. E. I., Säily, J. & Sauleau, R., 2018, 12th European Conference on Antennas and Propagation . Institution of Engineering and Technology IET, Vol. CP741. 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Multibeam antennas
Beamforming
Antennas
Millimeter waves
Wireless networks

SIW Cavity Filters with Embedded Planar Resonators in LTCC Package for 5G Applications

Showail, J., Lahti, M., Kautio, K., Arabi, E., Rantakari, P., Huhtinen, I., Vähä-Heikkilä, T. & Shamim, A., 2018, 48th European Microwave Conference (EuMC). Institute of Electrical and Electronic Engineers IEEE, p. 757-760 4 p. 8541552

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Resonators
Insertion losses
Bandwidth
Strip telecommunication lines
Temperature
2017
2 Citations (Scopus)

An LTCC beam-switching antenna with high beam overlap for 60-GHz mobile access points

Foglia Manzillo, F., Smierzchalski, M., Ettorre, M., Aurinsalo, J., Kautio, K., Lahti, M., Lamminen, A., Säily, J. & Sauleau, R., 2017, 2017 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting. Institute of Electrical and Electronic Engineers IEEE, p. 1441-1442 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

beam switching
antennas
ceramics
Antennas
Antenna feeders
2 Citations (Scopus)

Low-power and low-profile miniature atomic clock ceramic based flat form factor miniature atomic clock physics package (C-MAC)

Haesler, J., Balet, L., Karlen, S., Overstolz, T., Gallinet, B., Lecomte, S., Droz, F., Kautio, K., Karioja, P., Lahti, M., Maattanen, A., Lahtinen, O. & Hevonkorpi, V., 27 Oct 2017, 2017 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFC 2017). Institute of Electrical and Electronic Engineers IEEE, p. 55-56 2 p. 8088798

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Atomic clocks
atomic clocks
form factors
Physics
ceramics
1 Citation (Scopus)

Parallel fed 2×1 antenna array utilizing surface wave cancellation on LTCC substrate

Hagn, J., Frascolla, V., Sauleau, R., Aurinsalo, J., Lahti, M. & Kautio, K., 15 May 2017, 2017 11th European Conference on Antennas and Propagation (EUCAP). Institute of Electrical and Electronic Engineers IEEE, p. 185-189 5 p. 7928258

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Antenna feeders
Antenna arrays
Surface waves
Antennas
Substrates
2016

A long slot array fed by a multilayer true-time delay network in LTCC for 60-GHz communications

Manzillo, F. F., Ettorre, M., Lahti, M., Kautio, K., Lelaidier, D., Seguenot, E. & Sauleau, R., 2 Jun 2016, Antennas and Propagation (EuCAP), 2016 10th European Conference on. Institute of Electrical and Electronic Engineers IEEE, p. 1-5

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Millimeter waves
Time delay
Multilayers
HIgh speed networks
Communication
2 Citations (Scopus)

A V-band antenna module based on vertical TEM waveguides fully integrated in LTCC

Manzillo, F. F., Ettorre, M., Smierzchalski, M., Sauleau, R., Lahti, M., Kautio, K., Lelaidier, D. & Seguenot, E., 27 Oct 2016, Antennas and Propagation (APSURSI), 2016 IEEE International Symposium on. Institute of Electrical and Electronic Engineers IEEE, p. 387-388

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Waveguides
Antennas
Communication systems
Bandwidth
Temperature
2015

Microsystem integration from RF to millimeter wave applications

Vähä-Heikkilä, T. & Lahti, M., 2015, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems. International Society for Optics and Photonics SPIE, 95170R. (Proceedings of SPIE, Vol. 9517).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Microsystems
Millimeter waves
Packaging
Microwaves
Consumer products

Substrate integrated waveguide fed LTCC microstrip patch antenna for 94 GHz applications

Bunea, A. C., Neculoiu, D., Lahti, M. & Vaha-Heikkila, T., 17 Dec 2015, Semiconductor Conference (CAS), 2015 International. Institute of Electrical and Electronic Engineers IEEE, p. 127-130

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Substrate integrated waveguides
Antenna feeders
Microstrip antennas
Bandwidth
Tapes
2014
5 Citations (Scopus)

MEMS, MOEMS, RF-MEMS and photonics packaging based on LTCC technology

Karioja, P., Kautio, K., Ollila, J., Keränen, K., Karppinen, M., Heikkinen, V., Jaakola, T. & Lahti, M., 2014, Proceedings of the 5th Electronics System-integration Technology Conference, ESTC 2014. Institute of Electrical and Electronic Engineers IEEE, 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

MOEMS
Photonics
MEMS
Packaging
Temperature
2013
5 Citations (Scopus)

Hermetic packaging for millimetre wave applications

Lahti, M., Kautio, K., Ollila, J., Vähä-Heikkilä, T. & Kaunisto, M., 2013, Proceedings: European Microelectronics and Packaging Conference, EMPC 2013 . Institute of Electrical and Electronic Engineers IEEE, 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Millimeter waves
Packaging
Ceramic materials
Soldering alloys
Melting point
3 Citations (Scopus)

LTCC Microstrip parasitic patch antenna for 77 GHz automotive applications

Bunea, A-C., Neculoiu, D., Lahti, M. & Vähä-Heikkilä, T., 2013, 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS 2013). Institute of Electrical and Electronic Engineers IEEE, 6685305

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Microstrip antennas
Radiation
Antenna feeders
Antennas
Temperature
1 Citation (Scopus)

RF-MEMS reconfigurable GaAs MMICs and antennas for microwave/MM-wave applications

Malmqvist, R., Jonsson, R., Samuelsson, C., Gustafsson, A., Reyaz, S., Dancila, D., Rydberg, A., Grandchamp, B., Seok, S., Fryziel, M., Rolland, P-A., Rantakari, P., Lahti, M., Vähä-Heikkilä, T. & Baggen, R., 2013, CAS 2013 Proceedings : 36th International Semiconductor Conference. Institute of Electrical and Electronic Engineers IEEE, Vol. 2. p. 83-88

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Monolithic microwave integrated circuits
MEMS
Microwaves
Antennas
Switching circuits
2012
1 Citation (Scopus)

94 GHz substrate integrated waveguide fed antenna in LTCC technology

Bunea, A-C., Neculoiu, D., Lahti, M. & Vähä-Heikkilä, T., 2012, Proceedings: IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012. Institute of Electrical and Electronic Engineers IEEE, p. 283-284

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Substrate integrated waveguides
Antenna feeders
Antenna arrays
Antennas
Tapes

LTCC filter based on via resonators

Kondratyev, V., Kautio, K. & Lahti, M., 2012, Proceedings: 42nd European Microwave Conference, EuMC 2012. Institute of Electrical and Electronic Engineers IEEE, p. 1111-1114

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Resonators
Temperature
Poles
2011
7 Citations (Scopus)

Design and experiments of 77 GHz antennas in LTCC technology

Neculoiu, D., Lahti, M., Stefanescu, A., Muller, A. A. & Vähä-Heikkilä, T., 2011, Proceedings of the 5th European Conference on Antennas and Propagation, EUCAP 2011. Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE, p. 253-257

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Microstrip antennas
Antennas
Electromagnetic waves
Experiments
Bandwidth
1 Citation (Scopus)

Design and experiments of a 77 GHz receiver in LTCC technology

Neculoiu, D., Lahti, M., Bunea, A. C., Stefanescu, A. & Vähä-Heikkilä, T., 2011, Asia-Pacific Microwave Conference Proceedings, APMC. Institute of Electrical and Electronic Engineers IEEE, p. 453-456

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Microstrip antennas
Nonlinear analysis
Millimeter waves
Electromagnetic waves
Diodes
6 Citations (Scopus)

Investigation of substrate integrated waveguide in LTCC technology for mm-wave applications

Bunea, A-C., Lahti, M., Neculoiu, D., Stefanescu, A. & Vähä-Heikkilä, T., 2011, Proceedings of the Asia-Pacific Microwave Conference, APMC 2011. Institute of Electrical and Electronic Engineers IEEE, p. 395-398

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Substrate integrated waveguides
Coplanar waveguides
Studios
Software packages
Temperature
1 Citation (Scopus)

LTCC packaging from RF to millimeter waves

Lahti, M., Kautio, K., Kondratyev, V., Kaunisto, M. & Vähä-Heikkilä, T., 2011, IMAPS Nordic Annual Conference 2011. Kutilainen, J. (ed.). Finland: Curran Associates Inc., p. 96-101

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Millimeter waves
Packaging
Microwaves
Telecommunication systems
Mobile phones
2 Citations (Scopus)

MEMS-4-MMIC: Design of Antenna Array Front End at 24 GHz

Campo, M. A., Litschke, O., Vähä-Heikkilä, T., Lahti, M. & Baggen, R., 2011, Proceedings: 5th European Conference on Antennas and Propagation, EuCAP 2011. Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE, p. 1907-1911

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Monolithic microwave integrated circuits
Insertion losses
Antenna arrays
Semiconductor switches
Phase shifters
1 Citation (Scopus)

System-in-package LTCC platform for 3D RF to millimeter wave

Vähä-Heikkilä, T. & Lahti, M., 2011, Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems . International Society for Optics and Photonics SPIE, 79800W. (Proceedings of SPIE, Vol. 7980).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Millimeter waves
Metallizing
Antenna arrays
Temperature
Microwaves
2010
3 Citations (Scopus)

Backlight illumination structure based on inorganic LED devices and laminated multilayer polymer substrate

Keränen, K., Heikkinen, M., Hiltunen, M., Lahti, M., Mäkinen, J-T., Sunnari, A., Rekilä, J. & Rönkä, K., 2010, 2010 3rd Electronic System-Integration Technology Conference (ESTC 2010): Berlin, Germany, 13-16 Sept. 2010. Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE, 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

light emitting diodes
illumination
polymers
laminates
diffusers
19 Citations (Scopus)

Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology

Malmqvist, C., Samuelsson, C., Simon, W., Rantakari, P., Smith, D., Lahdes, M., Lahti, M., Vähä-Heikkilä, T., Varis, J. & Baggen, R., 2010, The 40th European Microwave Conference. Institute of Electrical and Electronic Engineers IEEE, p. 85-88

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Monolithic microwave integrated circuits
Foundries
MEMS
Packaging
Switches
10 Citations (Scopus)

On the LTCC characterization in millimeter-waves

Kondratyev, V., Lahti, M. & Kautio, K., 2010, Conference Proceedings: European Microwave Week 2010, "Connection the World". Institute of Electrical and Electronic Engineers IEEE, p. 156-159

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Millimeter waves
Materials properties
Temperature
6 Citations (Scopus)

Thermo-mechanical simulations of LTCC packages for RF MEMS applications

Lenkkeri, J., Juntunen, E., Lahti, M. & Bouwstra, S., 2010, Proceedings: 11th International. Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2010. Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE, 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

MEMS
Wire
Substrates
Heat losses
Temperature control
2009
12 Citations (Scopus)

RF MEMS Based Impedance Matching Networks for Tunable Multi-Band Microwave Low Noise Amplifiers

Malmqvist, R., Rantakari, P., Samuelsson, C., Lahti, M., Cheng, S., Saijets, J., Vähä-Heikkilä, T., Rydberg, A. & Varis, J., 2009, Proceedings of the International Semiconductor Conference, 2009 - CAS 2009. Institute of Electrical and Electronic Engineers IEEE, p. 303-306

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Open Access
Microwave amplifiers
Low noise amplifiers
MEMS
Tuning
Millimeter waves
2008

Adhesive flip-chip interconnections for inlays of contact-less smart cards

Lenkkeri, J., Kaskiala, T., Allen, M., Jaakola, T. & Lahti, M., 2008, ARCSIS Micropackaging Days 2008: CD.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

1 Citation (Scopus)

Chip/antenna interconnections for contact-less smart card applications

Lenkkeri, J., Jaakola, T., Lahti, M., Allen, M. & Kaskiala, T., 2008, Proceedings of the IMAPS Nordic Annual Conference 2008. p. 197-202

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Packaging of RF MEMS switches in LTCC

Lahti, M., Lenkkeri, J., Kautio, K., Lahdes, M. & Vähä-Heikkilä, T., 2008, Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference. p. 167-170

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

2006

High-power module integrated in LTCC substrate

Lahti, M., Kautio, K., Juntunen, E., Petäjä, J. & Karioja, P., 2006, 4th European Microelectronics and Packaging Symposium. p. 155-158

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

High-power module integrated into LTCC package

Lahti, M., Kautio, K., Juntunen, E. & Karioja, P., 2006, 3rd EMRS DTC Technical Conference. A13

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

1 Citation (Scopus)

Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

Lahti, M., Kautio, K. & Karioja, P., 2006, 2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE, p. 372-375

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Laminating
Heat sinks
Tapes
Processing
Laminates

Integrated LTCC modules by laminating and co-firing tapes directly on heat sink

Lahti, M., Kautio, K. & Karioja, P., 2006, 2006 European Conference on Wireless Technology. Institute of Electrical and Electronic Engineers IEEE, p. 1667-1670

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Laminating
Heat sinks
Tapes
Processing
Laminates
13 Citations (Scopus)

LTCC toolbox for photonics integration

Karioja, P., Keränen, K., Karppinen, M., Kautio, K., Heikkinen, V., Lahti, M., Ollila, J., Mäkinen, J-T., Kataja, K., Tuominen, J., Jaakola, T., Park, S. H., Korhonen, P., Alajoki, T., Tanskanen, A., Lenkkeri, J. & Heilala, J., 2006, IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies: CICMT. 12 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Photonics
Millimeter waves
Temperature
Substrates
Laser cooling
4 Citations (Scopus)

Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results

Vervaeke, M., Lahti, M., Karppinen, M., Debaes, C., Volckaerts, B., Karioja, P. & Thienpont, H., 2006, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, p. 201-213 (Proceedings of SPIE, Vol. 6185).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2005

Advanced heat management methods in LTCC technology

Lahti, M., Kautio, K., Juntunen, E., Petäjä, J. & Karioja, P., 2005, EMRS DTC 2nd Annual Technical Conference. 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Heat sinks
Tapes
Temperature
Strength of materials
Hot Temperature