Translated title of the contribution | : Packaging and component technologies of future electronics |
Lenkkeri, J.,
Majamaa, T.,
Jaakola, T.,
Karppinen, M. &
Kololuoma, T.,
2003, Espoo:
VTT Technical Research Centre of Finland.
86 p. (VTT Tiedotteita - Meddelanden - Research Notes; No. 2213).
Research output: Book/Report › Report