Oili M.E. Ylivaara

Research Scientist

20102021
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Research Output 2010 2019

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Conference article in proceedings
2017
1 Citation (Scopus)

Biocompatible ALD barrier coatings for medical devices

Matvejeff, M., Ek, S., Ritasalo, R., Kalliomäki, J., Järvinen, P., Ylivaara, O. & Östreng, E., 13 Jun 2017, Proceedings of 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM). Institute of Electrical and Electronic Engineers IEEE, p. 56-58 3 p. 7947504

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Atomic layer deposition
Coatings
Metals
Chemical resistance
Medical applications
2013

ALD Al2O3/TiO2 nanolaminates on Si: residual stress, elastic modulus, hardness and adhesion

Ylivaara, O., Liu, X., Ali, S., Sintonen, S., Laitinen, M., Julin, J., Kilpi, L., Sajavaara, T., Haimi, E., Ronkainen, H., Lipsanen, H., Hannula, S-P. & Puurunen, R. L., 2 Sep 2013, 19th European Conference on Chemical Vapor Deposition (EuroCVD 19). Elsevier

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2011
5 Citations (Scopus)

Direct wafer bonding of atomic layer deposited TiO2 and Al 2O3 thin films

Puurunen, R. L., Suni, T., Ylivaara, O., Kondo, H., Ammar, M., Ishida, T., Fujita, H., Bosseboeuf, A., Zaima, S. & Kattelus, H., 1 Aug 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11. p. 978-981 4 p. 5969474

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Wafer bonding
Thin films
Silicon
Silicon wafers
MEMS
2010
7 Citations (Scopus)

Bonding of ALD alumina for advanced SOI substrates

Suni, T., Puurunen, R. L., Ylivaara, O., Kattelus, H., Henttinen, K., Ishida, T. & Fujita, H., 15 Oct 2010, Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gosele. 4 ed. Vol. 33. p. 137-144 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Atomic layer deposition
Alumina
Silicon
Substrates
Thin films