Pentti Korhonen

20062019
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Research Output 2006 2019

  • 7 Article
  • 6 Conference article in proceedings
2019
Open Access
Siloxanes
Silver
Electronic equipment
Substrates
Screen printing
2018
1 Citation (Scopus)

High throughput R2R printing, testing and assembly processing of flexible RGB LED displays

Keranen, K., Korhonen, P., Happonen, T., Paakkolanvaara, M., Kangas, J. & Ronka, K., 29 Nov 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE Institute of Electrical and Electronic Engineers , p. 1-5 8546465

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Light emitting diodes
Printing
Display devices
Throughput
Flexible displays
2017
8 Citations (Scopus)

Custom-Shaped Organic Photovoltaic Modules-Freedom of Design by Printing

Välimäki, M., Jansson, E., Korhonen, P., Peltoniemi, A. & Rousu, S., Dec 2017, In : Nanoscale Research Letters. 12, 1, p. 117 117.

Research output: Contribution to journalArticleScientificpeer-review

Open Access
printing
Printing
modules
Electric contacts
leaves
2016
12 Citations (Scopus)

Bending reliability of printed conductors deposited on plastic foil with various silver pastes

Happonen, T., Ritvonen, T., Korhonen, P., Häkkinen, J. & Fabritius, T., 1 Feb 2016, In : The International Journal of Advanced Manufacturing Technology. 82, 9-12, p. 1663-1673 11 p.

Research output: Contribution to journalArticleScientificpeer-review

Adhesive pastes
Metal foil
Silver
Plastics
Printing
7 Citations (Scopus)

Modeling the lifetime of printed silver conductors in cyclic bending with the Coffin-Manson relation

Happonen, T., Ritvonen, T., Korhonen, P., Häkkinen, J. & Fabritius, T. E. J., 2016, In : IEEE Transactions on Device and Materials Reliability. 16, 1, p. 25-29

Research output: Contribution to journalArticleScientificpeer-review

Silver
Plastic films
Reliability analysis
Geometry
Substrates
2015
25 Citations (Scopus)

Roll-to-roll printed and assembled large area LED lighting element

Keränen, K., Korhonen, P., Rekilä, J., Tapaninen, O., Happonen, T., Makkonen, P. & Rönkä, K., 2015, In : The International Journal of Advanced Manufacturing Technology. 81, 1-4, p. 529-536

Research output: Contribution to journalArticleScientificpeer-review

Open Access
Light emitting diodes
Lighting
Metal foil
Ink
Adhesives
2012
4 Citations (Scopus)

Demonstrators for autonomous automotive and signage applications by bonding flexible solar cells, batteries and LED elements on large area polycarbonate backplanes

Keränen, K., Jaakola, T., Korhonen, P., Antonipieri, M., Salomon, J., Visentin, L., Miettilä, R., Huttunen, A., Rönkä, K. & Li Pira, N., 2012, 4th Electronic System-Integration Technology Conference ESTC2012: Amsterdam, Netherlands, 17-20 Sept. 2012. IEEE Institute of Electrical and Electronic Engineers , 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Polycarbonates
Light emitting diodes
Solar cells
Energy harvesting
Silicon solar cells
2009
8 Citations (Scopus)

Hermetic fiber pigtailed laser module utilizing passive device alignment on an LTCC substrate

Keränen, K., Ollila, J., Mäkinen, J-T., Korhonen, P., Kautio, K., Heikkinen, V. & Karioja, P., 2009, In : IEEE Transactions on Advanced Packaging. 32, 1, p. 223-227 5 p.

Research output: Contribution to journalArticleScientificpeer-review

Fiber lasers
Fibers
Substrates
Helium
Temperature
2008

Improved infrared temperature sensing system for mobile devices

Keränen, K., Mäkinen, J-T., Korhonen, P., Juntunen, E., Heikkinen, V. & Mäkelä, J., 2008, Proceedings: 2nd Electronics Systemintegration Technology Conference, ESTC 2008. London: IEEE Institute of Electrical and Electronic Engineers , p. 809-814

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Mobile devices
Infrared radiation
Calibration
Sensors
Optics
2007
1 Citation (Scopus)

Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates

Dispenza, M., Buttiglione, R., Fiorello, A. M., Tuominen, J., Kautio, K., Jyrki, O., Korhonen, P., Lahdes, M., Pochesci, D., Rönkä, K., Catoni, S., Marcelli, R., Foglietti, V., Cianci, E. & Coppa, A., 2007, Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., p. 364-369

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

MEMS
Fabrication
Substrates
Lapping
Thin films
2 Citations (Scopus)

High-brightness LED modules on alumina substrates

Heikkinen, V., Juntunen, E., Kautio, K., Kemppainen, A., Korhonen, P., Ollila, J., Sitomaniemi, A., Kemppainen, T., Kutilainen, T. & Sahavirta, H., 2007, In : Advancing Microelectronics. 34, 4, p. 12-16

Research output: Contribution to journalArticleScientificpeer-review

2006
1 Citation (Scopus)

Cost-efficient hermetic fibre pigtailed laser module utilizing passive device alignment on an LTCC substrate

Keränen, K., Ollila, J., Mäkinen, J-T., Kautio, K., Korhonen, P., Heikkinen, V., Väätäinen, O., Heilala, J. & Karioja, P., 2006, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, (Proceedings of SPIE, Vol. 6185).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

fiber lasers
Kovar (trademark)
modules
alignment
ceramics
13 Citations (Scopus)

LTCC toolbox for photonics integration

Karioja, P., Keränen, K., Karppinen, M., Kautio, K., Heikkinen, V., Lahti, M., Ollila, J., Mäkinen, J-T., Kataja, K., Tuominen, J., Jaakola, T., Park, S. H., Korhonen, P., Alajoki, T., Tanskanen, A., Lenkkeri, J. & Heilala, J., 2006, IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies: CICMT. 12 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Photonics
Millimeter waves
Temperature
Substrates
Laser cooling