Pentti Korhonen

20062019
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Research Output 2006 2019

  • 7 Article
  • 6 Conference article in proceedings
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Conference article in proceedings
2018
1 Citation (Scopus)

High throughput R2R printing, testing and assembly processing of flexible RGB LED displays

Keranen, K., Korhonen, P., Happonen, T., Paakkolanvaara, M., Kangas, J. & Ronka, K., 29 Nov 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE Institute of Electrical and Electronic Engineers , p. 1-5 8546465

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Light emitting diodes
Printing
Display devices
Throughput
Flexible displays
2012
4 Citations (Scopus)

Demonstrators for autonomous automotive and signage applications by bonding flexible solar cells, batteries and LED elements on large area polycarbonate backplanes

Keränen, K., Jaakola, T., Korhonen, P., Antonipieri, M., Salomon, J., Visentin, L., Miettilä, R., Huttunen, A., Rönkä, K. & Li Pira, N., 2012, 4th Electronic System-Integration Technology Conference ESTC2012: Amsterdam, Netherlands, 17-20 Sept. 2012. IEEE Institute of Electrical and Electronic Engineers , 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Polycarbonates
Light emitting diodes
Solar cells
Energy harvesting
Silicon solar cells
2008

Improved infrared temperature sensing system for mobile devices

Keränen, K., Mäkinen, J-T., Korhonen, P., Juntunen, E., Heikkinen, V. & Mäkelä, J., 2008, Proceedings: 2nd Electronics Systemintegration Technology Conference, ESTC 2008. London: IEEE Institute of Electrical and Electronic Engineers , p. 809-814

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Mobile devices
Infrared radiation
Calibration
Sensors
Optics
2007
1 Citation (Scopus)

Fabrication of high performance RF-MEMS structures on surface planarised LTCC substrates

Dispenza, M., Buttiglione, R., Fiorello, A. M., Tuominen, J., Kautio, K., Jyrki, O., Korhonen, P., Lahdes, M., Pochesci, D., Rönkä, K., Catoni, S., Marcelli, R., Foglietti, V., Cianci, E. & Coppa, A., 2007, Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., p. 364-369

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

MEMS
Fabrication
Substrates
Lapping
Thin films
2006
1 Citation (Scopus)

Cost-efficient hermetic fibre pigtailed laser module utilizing passive device alignment on an LTCC substrate

Keränen, K., Ollila, J., Mäkinen, J-T., Kautio, K., Korhonen, P., Heikkinen, V., Väätäinen, O., Heilala, J. & Karioja, P., 2006, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, (Proceedings of SPIE, Vol. 6185).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

fiber lasers
Kovar (trademark)
modules
alignment
ceramics
13 Citations (Scopus)

LTCC toolbox for photonics integration

Karioja, P., Keränen, K., Karppinen, M., Kautio, K., Heikkinen, V., Lahti, M., Ollila, J., Mäkinen, J-T., Kataja, K., Tuominen, J., Jaakola, T., Park, S. H., Korhonen, P., Alajoki, T., Tanskanen, A., Lenkkeri, J. & Heilala, J., 2006, IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies: CICMT. 12 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Photonics
Millimeter waves
Temperature
Substrates
Laser cooling