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Philippe Monnoyer

20102013
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Fingerprint Dive into the research topics where Philippe Monnoyer is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 6 Similar Profiles
Encapsulation Chemical Compounds
Silicon Engineering & Materials Science
Interdiffusion (solids) Chemical Compounds
Acoustic impedance Engineering & Materials Science
Soldering alloys Engineering & Materials Science
MEMS Chemical Compounds
Pixels Engineering & Materials Science
Fabrication Engineering & Materials Science

Research Output 2010 2013

  • 8 Conference article in proceedings
  • 3 Article
  • 2 Conference abstract in proceedings
2 Citations (Scopus)

Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias

Dixit, P., Viljanen, H., Salonen, J., Molarius, J. & Monnoyer, P., 2013, Proceedings : 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2013. Institute of Electrical and Electronic Engineers IEEE, p. 190-193

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Acoustic impedance
Copper
Fabrication
Silicon
MEMS

Reliability of wafer-level SLID bonds for MEMS encapsulation

Xu, H., Broas, M., Dong, H., Vuorinen, V., Suni, T., Vähänen, S., Monnoyer, P. & Paulasto-Krockel, M., 2013, 2013 European Microelectronics Packaging Conference (EMPC). Grenoble: Institute of Electrical and Electronic Engineers IEEE, 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

microelectromechanical systems
sealing
wafers
vacuum
silicon

Screening of ALD thin films for Cu diffusion barrier applications

Puurunen, R. L., Salonen, J., Nurmela, A., Ylivaara, O., Viljanen, H., Molarius, J., Monnoyer, P., Yliniemi, S., Pudas, M., Lehto, T., Lehto, T. & Li, W-M., 2013, Technical Program & Abstracts. American Vacuum Society AVS

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

Suni, T., Xu, H., Vuorinen, V., Heikkinen, H., Vähänen, S., Jaakkola, A., Monnoyer, P. & Paulasto-Kröckel, M., 2013, 2013 European Microelectronics Packaging Conference (EMPC). Grenoble: Institute of Electrical and Electronic Engineers IEEE

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Encapsulation
MEMS
Interdiffusion (solids)
Seals
Liquids

Wafer level MEMS encapsulation using SLID bonding

Suni, T., Xu, H., Heikkinen, H., Dekker, J., Vuorinen, V., Jaakkola, A., Monnoyer, P. & Paulasto-Kröckel, M., 2013, Book of abstracts. Stockholm, p. 105-106

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

Encapsulation
MEMS
Tin
Interdiffusion (solids)
Electroplating