Research output per year
Research output per year
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Dive into the research topics where Philippe Monnoyer is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias
Dixit, P., Viljanen, H., Salonen, J., Molarius, J. & Monnoyer, P., 2013, 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2013. IEEE Institute of Electrical and Electronic Engineers, p. 190-193Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
3 Citations (Scopus) -
Reliability of wafer-level SLID bonds for MEMS encapsulation
Xu, H., Broas, M., Dong, H., Vuorinen, V., Suni, T., Vähänen, S., Monnoyer, P. & Paulasto-Krockel, M., 2013, 2013 European Microelectronics Packaging Conference (EMPC). Grenoble: IEEE Institute of Electrical and Electronic Engineers, 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
3 Citations (Scopus) -
Screening of ALD thin films for Cu diffusion barrier applications
Puurunen, R. L., Salonen, J., Nurmela, A., Ylivaara, O., Viljanen, H., Molarius, J., Monnoyer, P., Yliniemi, S., Pudas, M., Lehto, T., Lehto, T. & Li, W-M., 2013, Technical Program & Abstracts. American Vacuum Society (AVS)Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Scientific
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Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Suni, T., Xu, H., Vuorinen, V., Heikkinen, H., Vähänen, S., Jaakkola, A., Monnoyer, P. & Paulasto-Kröckel, M., 2013, 2013 European Microelectronics Packaging Conference (EMPC). Grenoble: IEEE Institute of Electrical and Electronic EngineersResearch output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
6 Citations (Scopus) -
Wafer level MEMS encapsulation using SLID bonding
Suni, T., Xu, H., Heikkinen, H., Dekker, J., Vuorinen, V., Jaakkola, A., Monnoyer, P. & Paulasto-Kröckel, M., 2013, Book of abstracts. Stockholm, p. 105-106Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Scientific