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Philippe Monnoyer

  • Phone+358400912446
20102013

Research output per year

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Research Output

  • 8 Conference article in proceedings
  • 3 Article
  • 2 Conference abstract in proceedings

Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias

Dixit, P., Viljanen, H., Salonen, J., Molarius, J. & Monnoyer, P., 2013, Proceedings : 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2013. IEEE Institute of Electrical and Electronic Engineers , p. 190-193

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

  • 2 Citations (Scopus)

    Reliability of wafer-level SLID bonds for MEMS encapsulation

    Xu, H., Broas, M., Dong, H., Vuorinen, V., Suni, T., Vähänen, S., Monnoyer, P. & Paulasto-Krockel, M., 2013, 2013 European Microelectronics Packaging Conference (EMPC). Grenoble: IEEE Institute of Electrical and Electronic Engineers , 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

  • Screening of ALD thin films for Cu diffusion barrier applications

    Puurunen, R. L., Salonen, J., Nurmela, A., Ylivaara, O., Viljanen, H., Molarius, J., Monnoyer, P., Yliniemi, S., Pudas, M., Lehto, T., Lehto, T. & Li, W-M., 2013, Technical Program & Abstracts. American Vacuum Society AVS

    Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

    Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

    Suni, T., Xu, H., Vuorinen, V., Heikkinen, H., Vähänen, S., Jaakkola, A., Monnoyer, P. & Paulasto-Kröckel, M., 2013, 2013 European Microelectronics Packaging Conference (EMPC). Grenoble: IEEE Institute of Electrical and Electronic Engineers

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

  • Wafer level MEMS encapsulation using SLID bonding

    Suni, T., Xu, H., Heikkinen, H., Dekker, J., Vuorinen, V., Jaakkola, A., Monnoyer, P. & Paulasto-Kröckel, M., 2013, Book of abstracts. Stockholm, p. 105-106

    Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific