Projects per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Projects
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DecoChrom: Decorative Applications for Self-Organized Molecular Electrochromic Systems
Kraft, T., Kurkela, T., Heikkinen, K., Kololuoma, T., Huttunen, A., Korhonen, A., Hedman, R., Rekilä, J., Sääskilahti, H., Hietala, M., Nguyen, D., Hepo-oja, L., Kaisto, I., Sokka, L. & Räikkönen, M.
1/01/18 → 30/06/22
Project: EU project
Research output
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Adhesive bonding strength for printed and hybrid electronics
Happonen, T., Korhonen, A., Kololuoma, T. & Rönkä, K., 16 Sep 2021, 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). Wiley-IEEE Press, 6 p. 9585000Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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Electronic circuit
Ylikunnari, M. & Kololuoma, T., 4 Feb 2021, IPC No. H05K 1/ 11 A I, Patent No. US2021037658, Priority date 31 Jan 2019, Priority No. WO2019FI50070Research output: Patent › Patent
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Printed electronics based adaptive decoy: Invited paper
Huttunen, A. & Kololuoma, T., 14 Oct 2021, Target and Background Signatures VII. Stein, K. U. & Schleijpen, R. (eds.). International Society for Optics and Photonics SPIE, 7 p. 118650K. (Proceedings of SPIE - The International Society for Optical Engineering, Vol. 11865).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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Bending reliability of screen-printed vias for a flexible energy module
Kujala, M., Kololuoma, T., Keskinen, J., Lupo, D., Mäntysalo, M. & Kraft, T. M., 1 Dec 2020, In: npj Flexible Electronics. 4, 1, 8 p., 24.Research output: Contribution to journal › Article › Scientific › peer-review
Open AccessFile7 Citations (Scopus)44 Downloads (Pure) -
Development of a full roll-to-roll manufacturing process of through-substrate vias with stretchable substrates enabling double-sided wearable electronics
Jansson, E., Korhonen, A., Hietala, M. & Kololuoma, T., Dec 2020, In: International Journal of Advanced Manufacturing Technology. 111, 11-12, p. 3017-3027Research output: Contribution to journal › Article › Scientific › peer-review
Open Access7 Citations (Scopus)