Terho Kololuoma

19992019
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Research Output 1999 2019

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Report
2003

Tulevaisuuden elektroniikan pakkaus- ja komponenttitekniikat

Translated title of the contribution: Packaging and component technologies of future electronicsLenkkeri, J., Majamaa, T., Jaakola, T., Karppinen, M. & Kololuoma, T., 2003, Espoo: VTT Technical Research Centre of Finland. 86 p. (VTT Tiedotteita - Meddelanden - Research Notes; No. 2213).

Research output: Book/ReportReport

Open Access
packaging
electronics