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Tuomas Pensala

D. Sc. (Tech) , Principal Scientist

20032021
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Fingerprint Dive into the research topics where Tuomas Pensala is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 8 Similar Profiles
resonators Physics & Astronomy
Resonators Engineering & Materials Science
acoustics Physics & Astronomy
thin films Physics & Astronomy
microelectromechanical systems Physics & Astronomy
Acoustic waves Engineering & Materials Science
MEMS Engineering & Materials Science
bulk acoustic wave devices Physics & Astronomy

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Projects 2018 2021

Research Output 2003 2019

Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror

Ailas, H., Saarilahti, J., Pensala, T. & Kiihamäki, J., 22 May 2019, (Submitted) International Microelectronics and Packaging Society, Nordic: NordPac 2019.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Encapsulation
MEMS
Mirrors
Copper
Temperature
1 Citation (Scopus)

High-Volume Production and Non-Destructive Piezo-Property Mapping of 33% SC Doped Aluminium Nitride Thin Films

Mertin, S., Heinz, B., Mazzalar, A., Schmitz-Kempen, T., Tiedke, S. & Pensala, T., 2018, 2018 IEEE International Ultrasonics Symposium, IUS 2018. Institute of Electrical and Electronic Engineers IEEE, 8580120

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

aluminum nitrides
thin films
wafers
scandium
coefficients

Laterally acoustically coupled BAW filters at 3.6 GHz

Pensala, T., Makkonen, T., Dekker, J. R. & Ylilammi, M., 2018, 2018 IEEE International Ultrasonics Symposium: IUS 2018. Institute of Electrical and Electronic Engineers IEEE, p. 1-4 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Aluminum nitride
Insertion losses
Bandwidth

Microacoustics and Piezo-MEMS at VTT: Technology platforms and applications

Pensala, T., 2017.

Research output: Contribution to conferenceConference articleScientificpeer-review

PiezoMEMS at VTT: R&D and manufacturing services

Dekker, J. & Pensala, T., 2017. 42 p.

Research output: Contribution to conferenceConference articleProfessional

silicon
manufacturing
sensor
substrate
cost