Projects per year
Fingerprint Dive into the research topics where Tuomas Pensala is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 7 Similar Profiles
resonators
Physics & Astronomy
Resonators
Engineering & Materials Science
acoustics
Physics & Astronomy
thin films
Physics & Astronomy
microelectromechanical systems
Physics & Astronomy
aluminum nitrides
Physics & Astronomy
Acoustic waves
Engineering & Materials Science
MEMS
Engineering & Materials Science
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Projects 2018 2021
- 1 Active
PRYSTINE: Programmable Systems for Intelligence in Automobiles
Pensala, T., Ylivaara, O. M. E., Morits, D. & Kyynäräinen, J.
1/05/18 → 30/04/21
Project: Research
Research Output 2003 2019
Design and Fabrication of Aluminum Nitride Piezoelectric Micromachined Ultrasonic Transducers for Air Flow Measurements
Karuthedath, C., Thanniyil Sebastian, A., Saarilahti, J., Sillanpää, T. & Pensala, T., 6 Oct 2019, 2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE Institute of Electrical and Electronic Engineers , p. 2489-2492 4 p. 8925544Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
aluminum nitrides
flow measurement
air flow
transducers
ultrasonics
Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS Mirror
Ailas, H., Saarilahti, J., Pensala, T. & Kiihamäki, J., 11 Jun 2019, 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019. IEEE Institute of Electrical and Electronic Engineers , p. 12-16 8760353Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
Encapsulation
MEMS
Mirrors
Copper
Temperature
Non-destructive piezoelectric characterisation of Sc doped aluminium nitride thin films at wafer level
Mertin, S., Nyffeler, C., Makkonen, T., Heinz, B., Mazzalai, A., Schmitz-kempen, T., Tiedke, S., Pensala, T. & Muralt, P., Oct 2019, 2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE Institute of Electrical and Electronic Engineers , p. 2592-2595 4 p. 8925964Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
aluminum nitrides
wafers
scandium
thin films
actuation
Wobbling Mode AlN-Piezo-MEMS Mirror Enabling 360-Degree Field of View LIDAR for Automotive Applications
Pensala, T., Kyynäräinen, J., Dekker, J. R., Gorelick, S., Pekko, P., Pernu, T., Ylivaara, O. M. E., Gao, F., Morits, D. & Kiihamäki, J., Oct 2019, 2019 IEEE International Ultrasonics Symposium, IUS 2019. IEEE Institute of Electrical and Electronic Engineers , p. 1977-1980 4 p. 8925660Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
microelectromechanical systems
field of view
mirrors
frequency scanning
aluminum nitrides
1
Citation
(Scopus)
High-Volume Production and Non-Destructive Piezo-Property Mapping of 33% SC Doped Aluminium Nitride Thin Films
Mertin, S., Heinz, B., Mazzalar, A., Schmitz-Kempen, T., Tiedke, S. & Pensala, T., 2018, 2018 IEEE International Ultrasonics Symposium, IUS 2018. IEEE Institute of Electrical and Electronic Engineers , 8580120Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
aluminum nitrides
thin films
wafers
scandium
coefficients