Projects per year
Fingerprint Dive into the research topics where Tuomas Pensala is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 8 Similar Profiles
resonators
Physics & Astronomy
Resonators
Engineering & Materials Science
acoustics
Physics & Astronomy
thin films
Physics & Astronomy
microelectromechanical systems
Physics & Astronomy
Acoustic waves
Engineering & Materials Science
MEMS
Engineering & Materials Science
bulk acoustic wave devices
Physics & Astronomy
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Projects 2018 2021
- 1 Active
PRYSTINE: Programmable Systems for Intelligence in Automobiles
Pensala, T., Ylivaara, O. M. E., Morits, D. & Kyynäräinen, J.
1/05/18 → 30/04/21
Project: Research
Research Output 2003 2019
Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror
Ailas, H., Saarilahti, J., Pensala, T. & Kiihamäki, J., 22 May 2019, (Submitted) International Microelectronics and Packaging Society, Nordic: NordPac 2019.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
Encapsulation
MEMS
Mirrors
Copper
Temperature
1
Citation
(Scopus)
High-Volume Production and Non-Destructive Piezo-Property Mapping of 33% SC Doped Aluminium Nitride Thin Films
Mertin, S., Heinz, B., Mazzalar, A., Schmitz-Kempen, T., Tiedke, S. & Pensala, T., 2018, 2018 IEEE International Ultrasonics Symposium, IUS 2018. Institute of Electrical and Electronic Engineers IEEE, 8580120Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
aluminum nitrides
thin films
wafers
scandium
coefficients
Laterally acoustically coupled BAW filters at 3.6 GHz
Pensala, T., Makkonen, T., Dekker, J. R. & Ylilammi, M., 2018, 2018 IEEE International Ultrasonics Symposium: IUS 2018. Institute of Electrical and Electronic Engineers IEEE, p. 1-4 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
Aluminum nitride
Insertion losses
Bandwidth
Microacoustics and Piezo-MEMS at VTT: Technology platforms and applications
Pensala, T., 2017.Research output: Contribution to conference › Conference article › Scientific › peer-review
PiezoMEMS at VTT: R&D and manufacturing services
Dekker, J. & Pensala, T., 2017. 42 p.Research output: Contribution to conference › Conference article › Professional
silicon
manufacturing
sensor
substrate
cost