Projects per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
Fingerprint
Dive into the research topics where Vladimir Ermolov is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Projects
- 1 Finished
-
GRAPHENE: Graphene-Based Revolutions in ICT And Beyond
Sandberg, H. (PI), Ermolov, V. (Manager) & Arpiainen, S. (PI)
1/10/13 → 31/03/16
Project: EU project
Research output
-
Embedded component packaging for D-band radio systems
Schober, M., Rio, D. D., Chico, A. & Ermolov, V., 2024, 2024 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2024. IEEE Institute of Electrical and Electronic Engineers, p. 1044-1048 (European Conference on Networks and Communications, Vol. 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
-
Integrated Radiometer at 240 GHz With SiGe MMIC Detector and GRIN Silicon Lens
Pursula, P., Lamminen, A., Forsten, H., Sipola, H., Tappura, K., Saarilahti, J., Varonen, M., Ermolov, V. & Kantanen, M., 1 Jun 2024, In: IEEE Transactions on Microwave Theory and Techniques. 72, 6, p. 3505-3513Research output: Contribution to journal › Article › Scientific › peer-review
3 Citations (Scopus) -
Module Implementation of 3D Sub-THz and THz Silicon Micromachined Systems
Ermolov, V., Varonen, M., Hujanen, A., Lamminen, A., Ailas, H. & Pursula, P., 2024, 2024 Asia-Pacific Microwave Conference. IEEE Institute of Electrical and Electronic Engineers, p. 61-63 3 p.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
-
Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits
Ermolov, V., Lamminen, A., Varonen, M., Ailas, H., Lahti, M., Forstén, H., Kaunisto, M., Kantanen, M., Parveg, D. & Pursula, P., 26 Sept 2024, 2024 54th European Microwave Conference (EuMC). Wiley-IEEE Press, p. 581-584 4 p. 10732737Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
-
Single material multilayer radome for D band applications
Hujanen, A. & Ermolov, V., 2024, 18th European Conference on Antennas and Propagation, EuCAP 2024. IEEE Institute of Electrical and Electronic Engineers, 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
Prizes
-
2017 EuMC Microwave Prize
Pursula, P. (Recipient), Lamminen, A. (Recipient), Kantanen, M. (Recipient), Saarilahti, J. (Recipient) & Ermolov, V. (Recipient), 12 Oct 2017
Prize: Prize for a work