Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 9 Industry, Innovation, and Infrastructure
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Collaborations and top research areas from the last five years
Projects
- 1 Finished
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GRAPHENE: Graphene-Based Revolutions in ICT And Beyond
Sandberg, H. (PI), Ermolov, V. (Manager) & Arpiainen, S. (PI)
1/10/13 → 31/03/16
Project: EU project
Research output
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Study of Isolation Improvement of Antenna Arrays for D-band Transceiver
Lamminen, A. & Ermolov, V., 14 Jan 2026, 2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). IEEE Institute of Electrical and Electronic Engineers, 2 p.Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Scientific
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Embedded component packaging for D-band radio systems
Schober, M., Rio, D. D., Chico, A. & Ermolov, V., 2024, 2024 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2024. IEEE Institute of Electrical and Electronic Engineers, p. 1044-1048 (European Conference on Networks and Communications, Vol. 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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Integrated Radiometer at 240 GHz With SiGe MMIC Detector and GRIN Silicon Lens
Pursula, P., Lamminen, A., Forsten, H., Sipola, H., Tappura, K., Saarilahti, J., Varonen, M., Ermolov, V. & Kantanen, M., 1 Jun 2024, In: IEEE Transactions on Microwave Theory and Techniques. 72, 6, p. 3505-3513Research output: Contribution to journal › Article › Scientific › peer-review
3 Link opens in a new tab Citations (Scopus) -
Module Implementation of 3D Sub-THz and THz Silicon Micromachined Systems
Ermolov, V., Varonen, M., Hujanen, A., Lamminen, A., Ailas, H. & Pursula, P., 2024, 2024 Asia-Pacific Microwave Conference. IEEE Institute of Electrical and Electronic Engineers, p. 61-63 (Asia-Pacific Conference on Microwave).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
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Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits
Ermolov, V., Lamminen, A., Varonen, M., Ailas, H., Lahti, M., Forstén, H., Kaunisto, M., Kantanen, M., Parveg, D. & Pursula, P., 26 Sept 2024, 2024 54th European Microwave Conference (EuMC). Wiley-IEEE Press, p. 581-584 4 p. 10732737Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
Prizes
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2017 EuMC Microwave Prize
Pursula, P. (Recipient), Lamminen, A. (Recipient), Kantanen, M. (Recipient), Saarilahti, J. (Recipient) & Ermolov, V. (Recipient), 12 Oct 2017
Prize: Prize for a work