Project Details
Description
TAU and VTT’s consortium will advanced low-power, high-speed flexible electronics. In WP1, TAU will explore novel material processing of high-? dielectrics and high mobility metal-oxide channel semiconductors atop soft substrates, while in WP2, VTT will advance reverse offset printing to enable reduced gate lengths with minimal gate overlap. Together, in WP3, they will realize a print-defined high-frequency amplifier. Benefits: 1) Low-cost, ultra-low power autonomous soft electronic wearable sensor systems; and 2) Advanced high-k dielectrics and metal-oxide semiconductors compatible with a limited processing thermal budget. One full-time postdoctoral researcher will be directly supported at TAU and two staff scientists at VTT, along with international scientific visitations.
Acronym | HI-PHOTO-SINTER |
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Status | Active |
Effective start/end date | 1/09/22 → 31/08/26 |
Collaborative partners
- VTT Technical Research Centre of Finland
- Tampere University (lead)