3μm silicon photonics

Timo Aalto; Matteo Cherchi; Mikko Harjanne; Fei Sun; Markku Kapulainen

doi:10.1364/OFC.2018.TU3A.5

3μm silicon photonics

Timo Aalto^*, Matteo Cherchi, Mikko Harjanne, Fei Sun, Markku Kapulainen

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

3 Citations (Scopus)

Abstract

This paper presents the latest progress in the development of compact and low-loss photonic integrated circuits on 3-micron silicon-on-insulator platform that covers both near and mid-infrared applications.

Original language	English
Title of host publication	2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
Publisher	Optica Publishing Group
Pages	3-5
Number of pages	3
Volume	Part F84-OFC 2018
ISBN (Electronic)	978-1-943580-38-5
DOIs	https://doi.org/10.1364/OFC.2018.TU3A.5
Publication status	Published - 1 Jan 2018
MoE publication type	A4 Article in a conference publication
Event	Optical Fiber Communication Conference, OFC 2018 - San Diego, United States Duration: 11 Mar 2017 → 15 Mar 2017

Conference

Conference	Optical Fiber Communication Conference, OFC 2018
Country/Territory	United States
City	San Diego
Period	11/03/17 → 15/03/17

Keywords

OtaNano

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10.1364/OFC.2018.TU3A.5

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@inproceedings{f9f5dfbc14254d0888aa005f3f0bd3a0,

title = "3μm silicon photonics",

abstract = "This paper presents the latest progress in the development of compact and low-loss photonic integrated circuits on 3-micron silicon-on-insulator platform that covers both near and mid-infrared applications.",

keywords = "OtaNano",

author = "Timo Aalto and Matteo Cherchi and Mikko Harjanne and Fei Sun and Markku Kapulainen",

year = "2018",

month = jan,

day = "1",

doi = "10.1364/OFC.2018.TU3A.5",

language = "English",

volume = "Part F84-OFC 2018",

pages = "3--5",

booktitle = "2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings",

publisher = "Optica Publishing Group",

address = "United States",

note = "Optical Fiber Communication Conference, OFC 2018 ; Conference date: 11-03-2017 Through 15-03-2017",

}

TY - GEN

T1 - 3μm silicon photonics

AU - Aalto, Timo

AU - Cherchi, Matteo

AU - Harjanne, Mikko

AU - Sun, Fei

AU - Kapulainen, Markku

PY - 2018/1/1

Y1 - 2018/1/1

N2 - This paper presents the latest progress in the development of compact and low-loss photonic integrated circuits on 3-micron silicon-on-insulator platform that covers both near and mid-infrared applications.

AB - This paper presents the latest progress in the development of compact and low-loss photonic integrated circuits on 3-micron silicon-on-insulator platform that covers both near and mid-infrared applications.

KW - OtaNano

UR - http://www.scopus.com/inward/record.url?scp=85047144589&partnerID=8YFLogxK

U2 - 10.1364/OFC.2018.TU3A.5

DO - 10.1364/OFC.2018.TU3A.5

M3 - Conference article in proceedings

AN - SCOPUS:85047144589

VL - Part F84-OFC 2018

SP - 3

EP - 5

BT - 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings

PB - Optica Publishing Group

T2 - Optical Fiber Communication Conference, OFC 2018

Y2 - 11 March 2017 through 15 March 2017

ER -

3μm silicon photonics

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3μm silicon photonics

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