Abstract
This paper presents the latest progress in the development of compact and low-loss photonic integrated circuits on 3-micron silicon-on-insulator platform that covers both near and mid-infrared applications.
Language | English |
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Title of host publication | 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings |
Pages | 3-5 |
Number of pages | 3 |
Volume | Part F84-OFC 2018 |
ISBN (Electronic) | 9781557528209, 978-1-943580-38-5 |
DOIs | |
Publication status | Published - 1 Jan 2018 |
Event | Optical Fiber Communication Conference, OFC 2018 - San Diego, United States Duration: 11 Mar 2017 → 15 Mar 2017 |
Conference
Conference | Optical Fiber Communication Conference, OFC 2018 |
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Country | United States |
City | San Diego |
Period | 11/03/17 → 15/03/17 |
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3μm silicon photonics. / Aalto, Timo; Cherchi, Matteo; Harjanne, Mikko; Sun, Fei; Kapulainen, Markku.
2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Vol. Part F84-OFC 2018 2018. p. 3-5 TU3A.5.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Research › peer-review
TY - GEN
T1 - 3μm silicon photonics
AU - Aalto, Timo
AU - Cherchi, Matteo
AU - Harjanne, Mikko
AU - Sun, Fei
AU - Kapulainen, Markku
PY - 2018/1/1
Y1 - 2018/1/1
N2 - This paper presents the latest progress in the development of compact and low-loss photonic integrated circuits on 3-micron silicon-on-insulator platform that covers both near and mid-infrared applications.
AB - This paper presents the latest progress in the development of compact and low-loss photonic integrated circuits on 3-micron silicon-on-insulator platform that covers both near and mid-infrared applications.
UR - http://www.scopus.com/inward/record.url?scp=85047144589&partnerID=8YFLogxK
U2 - 10.1364/OFC.2018.TU3A.5
DO - 10.1364/OFC.2018.TU3A.5
M3 - Conference article in proceedings
VL - Part F84-OFC 2018
SP - 3
EP - 5
BT - 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
ER -