3μm silicon photonics

Timo Aalto, Matteo Cherchi, Mikko Harjanne, Fei Sun, Markku Kapulainen

    Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

    2 Citations (Scopus)

    Abstract

    This paper presents the latest progress in the development of compact and low-loss photonic integrated circuits on 3-micron silicon-on-insulator platform that covers both near and mid-infrared applications.

    Original languageEnglish
    Title of host publication2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings
    PublisherOptical Society of America OSA
    Pages3-5
    Number of pages3
    VolumePart F84-OFC 2018
    ISBN (Electronic)9781557528209, 978-1-943580-38-5
    DOIs
    Publication statusPublished - 1 Jan 2018
    MoE publication typeA4 Article in a conference publication
    EventOptical Fiber Communication Conference, OFC 2018 - San Diego, United States
    Duration: 11 Mar 2017 → 15 Mar 2017

    Conference

    ConferenceOptical Fiber Communication Conference, OFC 2018
    CountryUnited States
    CitySan Diego
    Period11/03/17 → 15/03/17

    Keywords

    • OtaNano

    Access to Document

    Fingerprint Dive into the research topics of '3μm silicon photonics'. Together they form a unique fingerprint.

    • Equipment

    OtaNano

    VTT Technical Research Centre of Finland

    Facility/equipment: Facility

    • Cite this

    Aalto, T., Cherchi, M., Harjanne, M., Sun, F., & Kapulainen, M. (2018). 3μm silicon photonics. In 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings (Vol. Part F84-OFC 2018, pp. 3-5). [TU3A.5] Optical Society of America OSA. https://doi.org/10.1364/OFC.2018.TU3A.5