In this work, we report a method to fabricate 3D polymer stamps by combining thermal SSIL and UV Step and Stamp Imprint Lithography (UV-SSIL). In the first step 100 x 100 mm2 PET substrate was patterned by thermal SSIL using a small silicon stamp with micron scale test structures. In the second step submicron features of a quartz stamp were added into the PET substrate by UV-SSIL. Finally, the patterned PET substrate consists of micron scale recessed and submicron scale elevated features.
|Publication status||Published - 2009|
|MoE publication type||Not Eligible|
|Event||35th International Conference on Micro & Nano Engineering, MNE 2009 - Ghent, Belgium|
Duration: 28 Sep 2009 → 1 Oct 2009
|Conference||35th International Conference on Micro & Nano Engineering, MNE 2009|
|Period||28/09/09 → 1/10/09|
- Nanoimprint lithography
- UV imprinting
Haatainen, T., Mäkelä, T., & Jouni, A. (2009). 3D features on plastic substrate by combined thermal and UV-imprinting. Paper presented at 35th International Conference on Micro & Nano Engineering, MNE 2009, Ghent, Belgium.