3D features on plastic substrate by combined thermal and UV-imprinting

    Research output: Contribution to conferenceConference articleScientificpeer-review

    Abstract

    In this work, we report a method to fabricate 3D polymer stamps by combining thermal SSIL and UV Step and Stamp Imprint Lithography (UV-SSIL). In the first step 100 x 100 mm2 PET substrate was patterned by thermal SSIL using a small silicon stamp with micron scale test structures. In the second step submicron features of a quartz stamp were added into the PET substrate by UV-SSIL. Finally, the patterned PET substrate consists of micron scale recessed and submicron scale elevated features.
    Original languageEnglish
    Publication statusPublished - 2009
    MoE publication typeNot Eligible
    Event35th International Conference on Micro & Nano Engineering, MNE 2009 - Ghent, Belgium
    Duration: 28 Sep 20091 Oct 2009

    Conference

    Conference35th International Conference on Micro & Nano Engineering, MNE 2009
    Country/TerritoryBelgium
    CityGhent
    Period28/09/091/10/09

    Keywords

    • Nanoimprint lithography
    • UV imprinting

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