3D features on plastic substrate by combined thermal and UV-imprinting

Research output: Contribution to conferenceConference articleScientificpeer-review

Abstract

In this work, we report a method to fabricate 3D polymer stamps by combining thermal SSIL and UV Step and Stamp Imprint Lithography (UV-SSIL). In the first step 100 x 100 mm2 PET substrate was patterned by thermal SSIL using a small silicon stamp with micron scale test structures. In the second step submicron features of a quartz stamp were added into the PET substrate by UV-SSIL. Finally, the patterned PET substrate consists of micron scale recessed and submicron scale elevated features.
Original languageEnglish
Publication statusPublished - 2009
MoE publication typeNot Eligible
Event35th International Conference on Micro & Nano Engineering, MNE 2009 - Ghent, Belgium
Duration: 28 Sep 20091 Oct 2009

Conference

Conference35th International Conference on Micro & Nano Engineering, MNE 2009
CountryBelgium
CityGhent
Period28/09/091/10/09

Fingerprint

Plastics
Lithography
Substrates
Quartz
Silicon
Polymers
Hot Temperature

Keywords

  • Nanoimprint lithography
  • UV imprinting

Cite this

Haatainen, T., Mäkelä, T., & Jouni, A. (2009). 3D features on plastic substrate by combined thermal and UV-imprinting. Paper presented at 35th International Conference on Micro & Nano Engineering, MNE 2009, Ghent, Belgium.
Haatainen, Tomi ; Mäkelä, Tapio ; Jouni, Ahopelto. / 3D features on plastic substrate by combined thermal and UV-imprinting. Paper presented at 35th International Conference on Micro & Nano Engineering, MNE 2009, Ghent, Belgium.
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title = "3D features on plastic substrate by combined thermal and UV-imprinting",
abstract = "In this work, we report a method to fabricate 3D polymer stamps by combining thermal SSIL and UV Step and Stamp Imprint Lithography (UV-SSIL). In the first step 100 x 100 mm2 PET substrate was patterned by thermal SSIL using a small silicon stamp with micron scale test structures. In the second step submicron features of a quartz stamp were added into the PET substrate by UV-SSIL. Finally, the patterned PET substrate consists of micron scale recessed and submicron scale elevated features.",
keywords = "Nanoimprint lithography, UV imprinting",
author = "Tomi Haatainen and Tapio M{\"a}kel{\"a} and Ahopelto Jouni",
note = "Project code: 21975; 35th International Conference on Micro & Nano Engineering, MNE 2009 ; Conference date: 28-09-2009 Through 01-10-2009",
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Haatainen, T, Mäkelä, T & Jouni, A 2009, '3D features on plastic substrate by combined thermal and UV-imprinting' Paper presented at 35th International Conference on Micro & Nano Engineering, MNE 2009, Ghent, Belgium, 28/09/09 - 1/10/09, .

3D features on plastic substrate by combined thermal and UV-imprinting. / Haatainen, Tomi; Mäkelä, Tapio; Jouni, Ahopelto.

2009. Paper presented at 35th International Conference on Micro & Nano Engineering, MNE 2009, Ghent, Belgium.

Research output: Contribution to conferenceConference articleScientificpeer-review

TY - CONF

T1 - 3D features on plastic substrate by combined thermal and UV-imprinting

AU - Haatainen, Tomi

AU - Mäkelä, Tapio

AU - Jouni, Ahopelto

N1 - Project code: 21975

PY - 2009

Y1 - 2009

N2 - In this work, we report a method to fabricate 3D polymer stamps by combining thermal SSIL and UV Step and Stamp Imprint Lithography (UV-SSIL). In the first step 100 x 100 mm2 PET substrate was patterned by thermal SSIL using a small silicon stamp with micron scale test structures. In the second step submicron features of a quartz stamp were added into the PET substrate by UV-SSIL. Finally, the patterned PET substrate consists of micron scale recessed and submicron scale elevated features.

AB - In this work, we report a method to fabricate 3D polymer stamps by combining thermal SSIL and UV Step and Stamp Imprint Lithography (UV-SSIL). In the first step 100 x 100 mm2 PET substrate was patterned by thermal SSIL using a small silicon stamp with micron scale test structures. In the second step submicron features of a quartz stamp were added into the PET substrate by UV-SSIL. Finally, the patterned PET substrate consists of micron scale recessed and submicron scale elevated features.

KW - Nanoimprint lithography

KW - UV imprinting

M3 - Conference article

ER -

Haatainen T, Mäkelä T, Jouni A. 3D features on plastic substrate by combined thermal and UV-imprinting. 2009. Paper presented at 35th International Conference on Micro & Nano Engineering, MNE 2009, Ghent, Belgium.