3D features on plastic substrate by combined thermal and UV-imprinting

Research output: Contribution to conferenceConference articleScientificpeer-review

Abstract

In this work, we report a method to fabricate 3D polymer stamps by combining thermal SSIL and UV Step and Stamp Imprint Lithography (UV-SSIL). In the first step 100 x 100 mm2 PET substrate was patterned by thermal SSIL using a small silicon stamp with micron scale test structures. In the second step submicron features of a quartz stamp were added into the PET substrate by UV-SSIL. Finally, the patterned PET substrate consists of micron scale recessed and submicron scale elevated features.
Original languageEnglish
Publication statusPublished - 2009
MoE publication typeNot Eligible
Event35th International Conference on Micro & Nano Engineering, MNE 2009 - Ghent, Belgium
Duration: 28 Sep 20091 Oct 2009

Conference

Conference35th International Conference on Micro & Nano Engineering, MNE 2009
CountryBelgium
CityGhent
Period28/09/091/10/09

Keywords

  • Nanoimprint lithography
  • UV imprinting

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    Haatainen, T., Mäkelä, T., & Ahopelto, J. (2009). 3D features on plastic substrate by combined thermal and UV-imprinting. Paper presented at 35th International Conference on Micro & Nano Engineering, MNE 2009, Ghent, Belgium.