3D flip chip packaging of MEMS sensor

Akiko Gädda, Reijo Tuovinen, Henry Rimminen, Sinikka Lalu, Jaakko Saarilahti, Anu Kärkkäinen

    Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

    2 Citations (Scopus)

    Fingerprint

    Dive into the research topics of '3D flip chip packaging of MEMS sensor'. Together they form a unique fingerprint.

    Engineering

    Material Science