@inproceedings{2bb104f3f528485a8d7d31539df8db04,
title = "3D RF integration at VTT",
abstract = "Integration of multiple chips and functions to the same radio module is a key issue when the size of a radio front-end is tried to minimize. VTT Technical Research Centre of Finland has developed both Low Temperature Co-fired Ceramics (LTCC) and Integrated Passive Devices (IPD) integration platforms for radio frequency (RF) integrated modules. Three dimensional (3D) integration technologies are enablers for realizing compact multi-chip modules with several different technologies in the same module. In addition to module level integration, both technologies are used for realizing high quality factor passive components.",
keywords = "IPD, LTCC",
author = "Tauno V{\"a}h{\"a}-Heikkil{\"a}",
year = "2013",
doi = "10.1117/12.2012001",
language = "English",
isbn = "978-0-8194-9474-0",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
editor = "Varadan, {Vijay K. }",
booktitle = "Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2013",
address = "United States",
note = "Nanosensors, Biosensors, and Info-Tech Sensors and Systems ; Conference date: 10-03-2013 Through 14-03-2013",
}