3D RF integration at VTT

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review


    Integration of multiple chips and functions to the same radio module is a key issue when the size of a radio front-end is tried to minimize. VTT Technical Research Centre of Finland has developed both Low Temperature Co-fired Ceramics (LTCC) and Integrated Passive Devices (IPD) integration platforms for radio frequency (RF) integrated modules. Three dimensional (3D) integration technologies are enablers for realizing compact multi-chip modules with several different technologies in the same module. In addition to module level integration, both technologies are used for realizing high quality factor passive components.
    Original languageEnglish
    Title of host publicationNanosensors, Biosensors, and Info-Tech Sensors and Systems 2013
    EditorsVijay K. Varadan
    PublisherInternational Society for Optics and Photonics SPIE
    ISBN (Print)978-0-8194-9474-0
    Publication statusPublished - 2013
    MoE publication typeA4 Article in a conference publication
    EventNanosensors, Biosensors, and Info-Tech Sensors and Systems - San Diego, CA, United States
    Duration: 10 Mar 201314 Mar 2013

    Publication series

    SeriesProceedings of SPIE


    ConferenceNanosensors, Biosensors, and Info-Tech Sensors and Systems
    Country/TerritoryUnited States
    CitySan Diego, CA


    • IPD
    • LTCC


    Dive into the research topics of '3D RF integration at VTT'. Together they form a unique fingerprint.

    Cite this