3D RF integration at VTT

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Integration of multiple chips and functions to the same radio module is a key issue when the size of a radio front-end is tried to minimize. VTT Technical Research Centre of Finland has developed both Low Temperature Co-fired Ceramics (LTCC) and Integrated Passive Devices (IPD) integration platforms for radio frequency (RF) integrated modules. Three dimensional (3D) integration technologies are enablers for realizing compact multi-chip modules with several different technologies in the same module. In addition to module level integration, both technologies are used for realizing high quality factor passive components.
Original languageEnglish
Title of host publicationNanosensors, Biosensors, and Info-Tech Sensors and Systems
EditorsVijay K. Varadan
PublisherInternational Society for Optics and Photonics SPIE
ISBN (Print)978-081949474-0
DOIs
Publication statusPublished - 2013
MoE publication typeNot Eligible
EventNanosensors, Biosensors, and Info-Tech Sensors and Systems - San Diego, CA, United States
Duration: 10 Mar 201314 Mar 2013

Publication series

SeriesProceedings of SPIE
Volume8691
ISSN0277-786X

Conference

ConferenceNanosensors, Biosensors, and Info-Tech Sensors and Systems
CountryUnited States
CitySan Diego, CA
Period10/03/1314/03/13

Keywords

  • IPD
  • LTCC

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  • Cite this

    Vähä-Heikkilä, T. (2013). 3D RF integration at VTT. In V. K. Varadan (Ed.), Nanosensors, Biosensors, and Info-Tech Sensors and Systems [86910V] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 8691 https://doi.org/10.1117/12.2012001