A 3-D miniaturized high selectivity bandpass filter in LTCC technology

Research output: Contribution to journalArticleScientificpeer-review

20 Citations (Scopus)

Abstract

Transmission zeros are used to improve the roll-off factors of filters but as a consequence, the out-of-band rejection decreases. In this work, an LTCC filter design is presented which employs a series inductor (implemented as a via hole) to improve the out-of-band rejection by introducing a third transmission zero. The filter, designed for GPS band (1.57 GHz), has one of the smallest reported foot prints ((0.063*0.048*0.005)?g) and demonstrates the highest roll off factor (16.7 dB/100 MHz) for this band. With only four LTCC layers, the design is cost effective and thus highly suitable for miniaturized, ultra-thin system-on-package applications
Original languageEnglish
Pages (from-to)8-10
JournalIEEE Microwave and Wireless Components Letters
Volume24
Issue number1
DOIs
Publication statusPublished - 2014
MoE publication typeA1 Journal article-refereed

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Bandpass filters
bandpass filters
selectivity
filters
rejection
Global positioning system
inductors
Costs
costs
System-on-package

Keywords

  • Bandpass filter (BPF)
  • Low temperature co-fired ceramic (LTCC)
  • System on package (SoP)

Cite this

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title = "A 3-D miniaturized high selectivity bandpass filter in LTCC technology",
abstract = "Transmission zeros are used to improve the roll-off factors of filters but as a consequence, the out-of-band rejection decreases. In this work, an LTCC filter design is presented which employs a series inductor (implemented as a via hole) to improve the out-of-band rejection by introducing a third transmission zero. The filter, designed for GPS band (1.57 GHz), has one of the smallest reported foot prints ((0.063*0.048*0.005)?g) and demonstrates the highest roll off factor (16.7 dB/100 MHz) for this band. With only four LTCC layers, the design is cost effective and thus highly suitable for miniaturized, ultra-thin system-on-package applications",
keywords = "Bandpass filter (BPF), Low temperature co-fired ceramic (LTCC), System on package (SoP)",
author = "E Arabi and Markku Lahti and Tauno V{\"a}h{\"a}-Heikkil{\"a} and A Shamim",
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A 3-D miniaturized high selectivity bandpass filter in LTCC technology. / Arabi, E; Lahti, Markku; Vähä-Heikkilä, Tauno; Shamim, A.

In: IEEE Microwave and Wireless Components Letters, Vol. 24, No. 1, 2014, p. 8-10.

Research output: Contribution to journalArticleScientificpeer-review

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T1 - A 3-D miniaturized high selectivity bandpass filter in LTCC technology

AU - Arabi, E

AU - Lahti, Markku

AU - Vähä-Heikkilä, Tauno

AU - Shamim, A

PY - 2014

Y1 - 2014

N2 - Transmission zeros are used to improve the roll-off factors of filters but as a consequence, the out-of-band rejection decreases. In this work, an LTCC filter design is presented which employs a series inductor (implemented as a via hole) to improve the out-of-band rejection by introducing a third transmission zero. The filter, designed for GPS band (1.57 GHz), has one of the smallest reported foot prints ((0.063*0.048*0.005)?g) and demonstrates the highest roll off factor (16.7 dB/100 MHz) for this band. With only four LTCC layers, the design is cost effective and thus highly suitable for miniaturized, ultra-thin system-on-package applications

AB - Transmission zeros are used to improve the roll-off factors of filters but as a consequence, the out-of-band rejection decreases. In this work, an LTCC filter design is presented which employs a series inductor (implemented as a via hole) to improve the out-of-band rejection by introducing a third transmission zero. The filter, designed for GPS band (1.57 GHz), has one of the smallest reported foot prints ((0.063*0.048*0.005)?g) and demonstrates the highest roll off factor (16.7 dB/100 MHz) for this band. With only four LTCC layers, the design is cost effective and thus highly suitable for miniaturized, ultra-thin system-on-package applications

KW - Bandpass filter (BPF)

KW - Low temperature co-fired ceramic (LTCC)

KW - System on package (SoP)

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DO - 10.1109/LMWC.2013.2285285

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EP - 10

JO - IEEE Microwave and Wireless Components Letters

JF - IEEE Microwave and Wireless Components Letters

SN - 1531-1309

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