A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

Tobias Baumgartner, Michael Töpper, Matthias Klein, Bernhard Schmid, Dieter Knödler, Heikki Kuisma, Sami Nurmi, Hannu Kattelus, James Dekker, Ralph Schachler

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    2 Citations (Scopus)
    Original languageEnglish
    Title of host publicationProceedings of the European Microelectronics and Packaging Conference & Exhibition
    Number of pages5
    Publication statusPublished - 2009
    MoE publication typeB3 Non-refereed article in conference proceedings
    EventEuropean Microelectronics and Packaging Conference & Exhibition, EMPC 2009 - Rimini, Italy
    Duration: 15 Jun 200918 Jun 2009

    Conference

    ConferenceEuropean Microelectronics and Packaging Conference & Exhibition, EMPC 2009
    Abbreviated titleEMPC 2009
    CountryItaly
    CityRimini
    Period15/06/0918/06/09

    Keywords

    • MEMS
    • 3-D packaging

    Cite this

    Baumgartner, T., Töpper, M., Klein, M., Schmid, B., Knödler, D., Kuisma, H., ... Schachler, R. (2009). A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. In Proceedings of the European Microelectronics and Packaging Conference & Exhibition
    Baumgartner, Tobias ; Töpper, Michael ; Klein, Matthias ; Schmid, Bernhard ; Knödler, Dieter ; Kuisma, Heikki ; Nurmi, Sami ; Kattelus, Hannu ; Dekker, James ; Schachler, Ralph. / A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. Proceedings of the European Microelectronics and Packaging Conference & Exhibition. 2009.
    @inproceedings{87d54c46a54040858c2662a2253f6c46,
    title = "A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level",
    keywords = "MEMS, 3-D packaging",
    author = "Tobias Baumgartner and Michael T{\"o}pper and Matthias Klein and Bernhard Schmid and Dieter Kn{\"o}dler and Heikki Kuisma and Sami Nurmi and Hannu Kattelus and James Dekker and Ralph Schachler",
    year = "2009",
    language = "English",
    booktitle = "Proceedings of the European Microelectronics and Packaging Conference & Exhibition",

    }

    Baumgartner, T, Töpper, M, Klein, M, Schmid, B, Knödler, D, Kuisma, H, Nurmi, S, Kattelus, H, Dekker, J & Schachler, R 2009, A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. in Proceedings of the European Microelectronics and Packaging Conference & Exhibition. European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, Rimini, Italy, 15/06/09.

    A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. / Baumgartner, Tobias; Töpper, Michael; Klein, Matthias; Schmid, Bernhard; Knödler, Dieter; Kuisma, Heikki; Nurmi, Sami; Kattelus, Hannu; Dekker, James; Schachler, Ralph.

    Proceedings of the European Microelectronics and Packaging Conference & Exhibition. 2009.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    TY - GEN

    T1 - A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

    AU - Baumgartner, Tobias

    AU - Töpper, Michael

    AU - Klein, Matthias

    AU - Schmid, Bernhard

    AU - Knödler, Dieter

    AU - Kuisma, Heikki

    AU - Nurmi, Sami

    AU - Kattelus, Hannu

    AU - Dekker, James

    AU - Schachler, Ralph

    PY - 2009

    Y1 - 2009

    KW - MEMS

    KW - 3-D packaging

    M3 - Conference article in proceedings

    BT - Proceedings of the European Microelectronics and Packaging Conference & Exhibition

    ER -

    Baumgartner T, Töpper M, Klein M, Schmid B, Knödler D, Kuisma H et al. A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. In Proceedings of the European Microelectronics and Packaging Conference & Exhibition. 2009