A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

Tobias Baumgartner; Michael Töpper; Matthias Klein; Bernhard Schmid; Dieter Knödler; Heikki Kuisma; Sami Nurmi; Hannu Kattelus; James Dekker; Ralph Schachler

A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

Tobias Baumgartner, Michael Töpper, Matthias Klein, Bernhard Schmid, Dieter Knödler, Heikki Kuisma, Sami Nurmi, Hannu Kattelus, James Dekker, Ralph Schachler

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

2 Citations (Scopus)

Original language	English
Title of host publication	Proceedings of the European Microelectronics and Packaging Conference & Exhibition
Publisher	IMAPS-International Microelectronics and Packaging Society
Number of pages	5
Publication status	Published - 2009
MoE publication type	B3 Non-refereed article in conference proceedings
Event	European Microelectronics and Packaging Conference & Exhibition, EMPC 2009 - Rimini, Italy Duration: 15 Jun 2009 → 18 Jun 2009

Conference

Conference	European Microelectronics and Packaging Conference & Exhibition, EMPC 2009
Abbreviated title	EMPC 2009
Country/Territory	Italy
City	Rimini
Period	15/06/09 → 18/06/09

Keywords

MEMS
3-D packaging

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Cite this

Baumgartner, T., Töpper, M., Klein, M., Schmid, B., Knödler, D., Kuisma, H., Nurmi, S., Kattelus, H., Dekker, J., & Schachler, R. (2009). A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. In Proceedings of the European Microelectronics and Packaging Conference & Exhibition IMAPS-International Microelectronics and Packaging Society.

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title = "A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level",

keywords = "MEMS, 3-D packaging",

author = "Tobias Baumgartner and Michael T{\"o}pper and Matthias Klein and Bernhard Schmid and Dieter Kn{\"o}dler and Heikki Kuisma and Sami Nurmi and Hannu Kattelus and James Dekker and Ralph Schachler",

year = "2009",

language = "English",

booktitle = "Proceedings of the European Microelectronics and Packaging Conference & Exhibition",

publisher = "IMAPS-International Microelectronics and Packaging Society",

address = "United States",

note = "European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, EMPC 2009 ; Conference date: 15-06-2009 Through 18-06-2009",

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Baumgartner, T, Töpper, M, Klein, M, Schmid, B, Knödler, D, Kuisma, H, Nurmi, S, Kattelus, H, Dekker, J & Schachler, R 2009, A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. in Proceedings of the European Microelectronics and Packaging Conference & Exhibition. IMAPS-International Microelectronics and Packaging Society, European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, Rimini, Italy, 15/06/09.

A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. / Baumgartner, Tobias; Töpper, Michael; Klein, Matthias et al.
Proceedings of the European Microelectronics and Packaging Conference & Exhibition. IMAPS-International Microelectronics and Packaging Society, 2009.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

TY - GEN

T1 - A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

AU - Baumgartner, Tobias

AU - Töpper, Michael

AU - Klein, Matthias

AU - Schmid, Bernhard

AU - Knödler, Dieter

AU - Kuisma, Heikki

AU - Nurmi, Sami

AU - Kattelus, Hannu

AU - Dekker, James

AU - Schachler, Ralph

PY - 2009

Y1 - 2009

KW - MEMS

KW - 3-D packaging

M3 - Conference article in proceedings

BT - Proceedings of the European Microelectronics and Packaging Conference & Exhibition

PB - IMAPS-International Microelectronics and Packaging Society

T2 - European Microelectronics and Packaging Conference & Exhibition, EMPC 2009

Y2 - 15 June 2009 through 18 June 2009

ER -