A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

Tobias Baumgartner, Michael Töpper, Matthias Klein, Bernhard Schmid, Dieter Knödler, Heikki Kuisma, Sami Nurmi, Hannu Kattelus, James Dekker, Ralph Schachler

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    2 Citations (Scopus)
    Original languageEnglish
    Title of host publicationProceedings of the European Microelectronics and Packaging Conference & Exhibition
    PublisherIMAPS-International Microelectronics and Packaging Society
    Number of pages5
    Publication statusPublished - 2009
    MoE publication typeB3 Non-refereed article in conference proceedings
    EventEuropean Microelectronics and Packaging Conference & Exhibition, EMPC 2009 - Rimini, Italy
    Duration: 15 Jun 200918 Jun 2009

    Conference

    ConferenceEuropean Microelectronics and Packaging Conference & Exhibition, EMPC 2009
    Abbreviated titleEMPC 2009
    CountryItaly
    CityRimini
    Period15/06/0918/06/09

    Keywords

    • MEMS
    • 3-D packaging

    Cite this

    Baumgartner, T., Töpper, M., Klein, M., Schmid, B., Knödler, D., Kuisma, H., Nurmi, S., Kattelus, H., Dekker, J., & Schachler, R. (2009). A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. In Proceedings of the European Microelectronics and Packaging Conference & Exhibition IMAPS-International Microelectronics and Packaging Society.