A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

Tobias Baumgartner, Michael Töpper, Matthias Klein, Bernhard Schmid, Dieter Knödler, Heikki Kuisma, Sami Nurmi, Hannu Kattelus, James Dekker, Ralph Schachler

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

2 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the European Microelectronics and Packaging Conference & Exhibition
Number of pages5
Publication statusPublished - 2009
MoE publication typeB3 Non-refereed article in conference proceedings
EventEuropean Microelectronics and Packaging Conference & Exhibition, EMPC 2009 - Rimini, Italy
Duration: 15 Jun 200918 Jun 2009

Conference

ConferenceEuropean Microelectronics and Packaging Conference & Exhibition, EMPC 2009
Abbreviated titleEMPC 2009
CountryItaly
CityRimini
Period15/06/0918/06/09

Keywords

  • MEMS
  • 3-D packaging

Cite this

Baumgartner, T., Töpper, M., Klein, M., Schmid, B., Knödler, D., Kuisma, H., ... Schachler, R. (2009). A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. In Proceedings of the European Microelectronics and Packaging Conference & Exhibition
Baumgartner, Tobias ; Töpper, Michael ; Klein, Matthias ; Schmid, Bernhard ; Knödler, Dieter ; Kuisma, Heikki ; Nurmi, Sami ; Kattelus, Hannu ; Dekker, James ; Schachler, Ralph. / A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. Proceedings of the European Microelectronics and Packaging Conference & Exhibition. 2009.
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title = "A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level",
keywords = "MEMS, 3-D packaging",
author = "Tobias Baumgartner and Michael T{\"o}pper and Matthias Klein and Bernhard Schmid and Dieter Kn{\"o}dler and Heikki Kuisma and Sami Nurmi and Hannu Kattelus and James Dekker and Ralph Schachler",
year = "2009",
language = "English",
booktitle = "Proceedings of the European Microelectronics and Packaging Conference & Exhibition",

}

Baumgartner, T, Töpper, M, Klein, M, Schmid, B, Knödler, D, Kuisma, H, Nurmi, S, Kattelus, H, Dekker, J & Schachler, R 2009, A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. in Proceedings of the European Microelectronics and Packaging Conference & Exhibition. European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, Rimini, Italy, 15/06/09.

A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. / Baumgartner, Tobias; Töpper, Michael; Klein, Matthias; Schmid, Bernhard; Knödler, Dieter; Kuisma, Heikki; Nurmi, Sami; Kattelus, Hannu; Dekker, James; Schachler, Ralph.

Proceedings of the European Microelectronics and Packaging Conference & Exhibition. 2009.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

TY - GEN

T1 - A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

AU - Baumgartner, Tobias

AU - Töpper, Michael

AU - Klein, Matthias

AU - Schmid, Bernhard

AU - Knödler, Dieter

AU - Kuisma, Heikki

AU - Nurmi, Sami

AU - Kattelus, Hannu

AU - Dekker, James

AU - Schachler, Ralph

PY - 2009

Y1 - 2009

KW - MEMS

KW - 3-D packaging

M3 - Conference article in proceedings

BT - Proceedings of the European Microelectronics and Packaging Conference & Exhibition

ER -

Baumgartner T, Töpper M, Klein M, Schmid B, Knödler D, Kuisma H et al. A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. In Proceedings of the European Microelectronics and Packaging Conference & Exhibition. 2009