A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

Tobias Baumgartner; Michael Töpper; Matthias Klein; Bernhard Schmid; Dieter Knödler; Heikki Kuisma; Sami Nurmi; Hannu Kattelus; James Dekker; Ralph Schachler

A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

Tobias Baumgartner
, Michael Töpper
, Matthias Klein
, Bernhard Schmid
, Dieter Knödler
, Heikki Kuisma
, Sami Nurmi
, Hannu Kattelus
, James Dekker
, Ralph Schachler

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Original language	English
Title of host publication	Proceedings of the European Microelectronics and Packaging Conference & Exhibition
Publisher	IMAPS-International Microelectronics and Packaging Society
Number of pages	5
Publication status	Published - 2009
MoE publication type	B3 Non-refereed article in conference proceedings
Event	European Microelectronics and Packaging Conference & Exhibition, EMPC 2009 - Rimini, Italy Duration: 15 Jun 2009 → 18 Jun 2009

Conference

Conference	European Microelectronics and Packaging Conference & Exhibition, EMPC 2009
Abbreviated title	EMPC 2009
Country/Territory	Italy
City	Rimini
Period	15/06/09 → 18/06/09

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

MEMS
3-D packaging

Cite this

Baumgartner, T., Töpper, M., Klein, M., Schmid, B., Knödler, D., Kuisma, H., Nurmi, S., Kattelus, H., Dekker, J., & Schachler, R. (2009). A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. In Proceedings of the European Microelectronics and Packaging Conference & Exhibition IMAPS-International Microelectronics and Packaging Society.

@inproceedings{87d54c46a54040858c2662a2253f6c46,

title = "A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level",

keywords = "MEMS, 3-D packaging",

author = "Tobias Baumgartner and Michael T{\"o}pper and Matthias Klein and Bernhard Schmid and Dieter Kn{\"o}dler and Heikki Kuisma and Sami Nurmi and Hannu Kattelus and James Dekker and Ralph Schachler",

year = "2009",

language = "English",

booktitle = "Proceedings of the European Microelectronics and Packaging Conference \& Exhibition",

publisher = "IMAPS-International Microelectronics and Packaging Society",

address = "United States",

note = "European Microelectronics and Packaging Conference \& Exhibition, EMPC 2009, EMPC 2009 ; Conference date: 15-06-2009 Through 18-06-2009",

}

Baumgartner, T, Töpper, M, Klein, M, Schmid, B, Knödler, D, Kuisma, H, Nurmi, S, Kattelus, H, Dekker, J & Schachler, R 2009, A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. in Proceedings of the European Microelectronics and Packaging Conference & Exhibition. IMAPS-International Microelectronics and Packaging Society, European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, Rimini, Italy, 15/06/09.

A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level. / Baumgartner, Tobias; Töpper, Michael; Klein, Matthias et al.
Proceedings of the European Microelectronics and Packaging Conference & Exhibition. IMAPS-International Microelectronics and Packaging Society, 2009.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

TY - GEN

T1 - A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

AU - Baumgartner, Tobias

AU - Töpper, Michael

AU - Klein, Matthias

AU - Schmid, Bernhard

AU - Knödler, Dieter

AU - Kuisma, Heikki

AU - Nurmi, Sami

AU - Kattelus, Hannu

AU - Dekker, James

AU - Schachler, Ralph

PY - 2009

Y1 - 2009

KW - MEMS

KW - 3-D packaging

M3 - Conference article in proceedings

BT - Proceedings of the European Microelectronics and Packaging Conference & Exhibition

PB - IMAPS-International Microelectronics and Packaging Society

T2 - European Microelectronics and Packaging Conference & Exhibition, EMPC 2009

Y2 - 15 June 2009 through 18 June 2009

ER -