A 3D micromechanical compass

Jukka Kyynäräinen; Jaakko Saarilahti; Hannu Kattelus; Anu Kärkkäinen; Tor Meinander; Aarne Oja; Panu Pekko; Heikki Seppä; Mika Suhonen; Heikki Kuisma; Sami Ruotsalainen; Markku Tilli

doi:10.1016/j.sna.2007.08.025

A 3D micromechanical compass

Jukka Kyynäräinen (Corresponding Author), Jaakko Saarilahti, Hannu Kattelus, Anu Kärkkäinen, Tor Meinander, Aarne Oja, Panu Pekko, Heikki Seppä, Mika Suhonen, Heikki Kuisma, Sami Ruotsalainen, Markku Tilli

Research output: Contribution to journal › Article › Scientific › peer-review

80 Citations (Scopus)

Abstract

We have designed and fabricated micromechanical magnetometers intended for a 3D electronic compass which could be embedded in portable devices. The sensors are based on the Lorentz force acting on a current-carrying coil, processed on a single crystal silicon resonator, and they are operated in vacuum to reach high enough Q values. Sensors for all cartesian components of the magnetic field vector can be processed on the same chip. The vibration amplitude is detected capacitively and the resonance is tracked by a phase-locked-loop circuit. The fabrication process is based on aligned direct bonding of a double side polished silicon wafer and a SOI wafer. Magnetometers measuring the field component along the chip surface have a flux density resolution of about 10 nT/√Hz at a coil current of 100 μA. Magnetometers measuring the field component perpendicular to the chip surface are currently less sensitive with a flux density resolution of about 70 nT/√Hz. The standard deviation of the signal was less than 1% over a period of a few days.

Original language	English
Pages (from-to)	561-568
Number of pages	8
Journal	Sensors and Actuators A: Physical
Volume	142
Issue number	2
DOIs	https://doi.org/10.1016/j.sna.2007.08.025
Publication status	Published - 10 Apr 2008
MoE publication type	A1 Journal article-refereed

Keywords

Magnetometers
MEMS
Micromechanics
Resonant sensors

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10.1016/j.sna.2007.08.025

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title = "A 3D micromechanical compass",

abstract = "We have designed and fabricated micromechanical magnetometers intended for a 3D electronic compass which could be embedded in portable devices. The sensors are based on the Lorentz force acting on a current-carrying coil, processed on a single crystal silicon resonator, and they are operated in vacuum to reach high enough Q values. Sensors for all cartesian components of the magnetic field vector can be processed on the same chip. The vibration amplitude is detected capacitively and the resonance is tracked by a phase-locked-loop circuit. The fabrication process is based on aligned direct bonding of a double side polished silicon wafer and a SOI wafer. Magnetometers measuring the field component along the chip surface have a flux density resolution of about 10 nT/√Hz at a coil current of 100 μA. Magnetometers measuring the field component perpendicular to the chip surface are currently less sensitive with a flux density resolution of about 70 nT/√Hz. The standard deviation of the signal was less than 1% over a period of a few days.",

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AU - Kyynäräinen, Jukka

AU - Saarilahti, Jaakko

AU - Kattelus, Hannu

AU - Kärkkäinen, Anu

AU - Meinander, Tor

AU - Oja, Aarne

AU - Pekko, Panu

AU - Seppä, Heikki

AU - Suhonen, Mika

AU - Kuisma, Heikki

AU - Ruotsalainen, Sami

AU - Tilli, Markku

PY - 2008/4/10

Y1 - 2008/4/10

N2 - We have designed and fabricated micromechanical magnetometers intended for a 3D electronic compass which could be embedded in portable devices. The sensors are based on the Lorentz force acting on a current-carrying coil, processed on a single crystal silicon resonator, and they are operated in vacuum to reach high enough Q values. Sensors for all cartesian components of the magnetic field vector can be processed on the same chip. The vibration amplitude is detected capacitively and the resonance is tracked by a phase-locked-loop circuit. The fabrication process is based on aligned direct bonding of a double side polished silicon wafer and a SOI wafer. Magnetometers measuring the field component along the chip surface have a flux density resolution of about 10 nT/√Hz at a coil current of 100 μA. Magnetometers measuring the field component perpendicular to the chip surface are currently less sensitive with a flux density resolution of about 70 nT/√Hz. The standard deviation of the signal was less than 1% over a period of a few days.

AB - We have designed and fabricated micromechanical magnetometers intended for a 3D electronic compass which could be embedded in portable devices. The sensors are based on the Lorentz force acting on a current-carrying coil, processed on a single crystal silicon resonator, and they are operated in vacuum to reach high enough Q values. Sensors for all cartesian components of the magnetic field vector can be processed on the same chip. The vibration amplitude is detected capacitively and the resonance is tracked by a phase-locked-loop circuit. The fabrication process is based on aligned direct bonding of a double side polished silicon wafer and a SOI wafer. Magnetometers measuring the field component along the chip surface have a flux density resolution of about 10 nT/√Hz at a coil current of 100 μA. Magnetometers measuring the field component perpendicular to the chip surface are currently less sensitive with a flux density resolution of about 70 nT/√Hz. The standard deviation of the signal was less than 1% over a period of a few days.

KW - Magnetometers

KW - MEMS

KW - Micromechanics

KW - Resonant sensors

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DO - 10.1016/j.sna.2007.08.025

M3 - Article

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SN - 0924-4247

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EP - 568

JO - Sensors and Actuators A: Physical

JF - Sensors and Actuators A: Physical

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ER -

A 3D micromechanical compass

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Keywords

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