A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector

Michael Campbell, G.A. Rinella, G.A. Izquierdo, Thierry Gys, N. Kanaya, C. Newby, D. Piedigrossi, Petra Riedler, Jorma Salmi, Jaakko Salonen, Satu Savolainen-Pulli, L. Somerville, Ilkka Suni, Sami Vähänen, Ken Wyllie

Research output: Contribution to journalArticleScientificpeer-review

Abstract

A new approach to photo detection using pixel-HPD's has been adopted for the LHCb-RICH detector. These devices use a hybrid pixel detector inside an evacuated photo tube providing high-precision, low noise detection of Cherenkov radiation. The approach takes advantage of modern CMOS technology offering many advantages over more traditional techniques. These advantages include extremely high sensitivity, low noise and fast readout. A major technological challenge was the encapsulation of a hybrid pixel detector inside a photo detector tube. The fabrication of the HPD tube involves packaging of the pixel detector assembly onto a ceramic carrier to form the photo-anode and the subsequent bake out of the pixel anode under vacuum. Both processes involve high temperatures. A fine pitch solder bump-bonding technique, which is compatible with the manufacture of hybrid photo detectors, has been developed. The technology and the tests used for qualifying the new process for pixel-HPD production are described. More than 40 pixel detector assemblies have been produced with almost all showing <1% of missing pixels. A number of assemblies were baked out using temperature cycles identical to those used for pixel-HPD manufacture. None of the assemblies demonstrated any degradation. SEM photos clearly indicate the reliability of the process. 10 pixel-HPD tubes have been produced using this new bump-bonding process and those behave according to expectations. The pixel-HPD is the first of a new generation of photo detector tubes suitable for RICH and other visible photon sensing applications.
Original languageEnglish
Pages (from-to)2296-2302
Number of pages7
JournalIEEE Transactions on Nuclear Science
Volume56
Issue number4
DOIs
Publication statusPublished - 2006
MoE publication typeA1 Journal article-refereed
EventIEEE Symposium Conference Record Nuclear Science 2004 - Rome, Italy
Duration: 16 Aug 200422 Aug 2004

Fingerprint

Pixels
pixels
Detectors
detectors
tubes
assemblies
low noise
Anodes
anodes
solders
Encapsulation
packaging
Soldering alloys
readout
CMOS
Packaging
Photons
assembly
Vacuum
ceramics

Keywords

  • photodetectors
  • radiation detectors

Cite this

Campbell, Michael ; Rinella, G.A. ; Izquierdo, G.A. ; Gys, Thierry ; Kanaya, N. ; Newby, C. ; Piedigrossi, D. ; Riedler, Petra ; Salmi, Jorma ; Salonen, Jaakko ; Savolainen-Pulli, Satu ; Somerville, L. ; Suni, Ilkka ; Vähänen, Sami ; Wyllie, Ken. / A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector. In: IEEE Transactions on Nuclear Science. 2006 ; Vol. 56, No. 4. pp. 2296-2302.
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abstract = "A new approach to photo detection using pixel-HPD's has been adopted for the LHCb-RICH detector. These devices use a hybrid pixel detector inside an evacuated photo tube providing high-precision, low noise detection of Cherenkov radiation. The approach takes advantage of modern CMOS technology offering many advantages over more traditional techniques. These advantages include extremely high sensitivity, low noise and fast readout. A major technological challenge was the encapsulation of a hybrid pixel detector inside a photo detector tube. The fabrication of the HPD tube involves packaging of the pixel detector assembly onto a ceramic carrier to form the photo-anode and the subsequent bake out of the pixel anode under vacuum. Both processes involve high temperatures. A fine pitch solder bump-bonding technique, which is compatible with the manufacture of hybrid photo detectors, has been developed. The technology and the tests used for qualifying the new process for pixel-HPD production are described. More than 40 pixel detector assemblies have been produced with almost all showing <1{\%} of missing pixels. A number of assemblies were baked out using temperature cycles identical to those used for pixel-HPD manufacture. None of the assemblies demonstrated any degradation. SEM photos clearly indicate the reliability of the process. 10 pixel-HPD tubes have been produced using this new bump-bonding process and those behave according to expectations. The pixel-HPD is the first of a new generation of photo detector tubes suitable for RICH and other visible photon sensing applications.",
keywords = "photodetectors, radiation detectors",
author = "Michael Campbell and G.A. Rinella and G.A. Izquierdo and Thierry Gys and N. Kanaya and C. Newby and D. Piedigrossi and Petra Riedler and Jorma Salmi and Jaakko Salonen and Satu Savolainen-Pulli and L. Somerville and Ilkka Suni and Sami V{\"a}h{\"a}nen and Ken Wyllie",
note = "Project code: T4SU00263",
year = "2006",
doi = "10.1109/NSSMIC.2004.1462278",
language = "English",
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pages = "2296--2302",
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Campbell, M, Rinella, GA, Izquierdo, GA, Gys, T, Kanaya, N, Newby, C, Piedigrossi, D, Riedler, P, Salmi, J, Salonen, J, Savolainen-Pulli, S, Somerville, L, Suni, I, Vähänen, S & Wyllie, K 2006, 'A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector', IEEE Transactions on Nuclear Science, vol. 56, no. 4, pp. 2296-2302. https://doi.org/10.1109/NSSMIC.2004.1462278

A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector. / Campbell, Michael; Rinella, G.A.; Izquierdo, G.A.; Gys, Thierry; Kanaya, N.; Newby, C.; Piedigrossi, D.; Riedler, Petra; Salmi, Jorma; Salonen, Jaakko; Savolainen-Pulli, Satu; Somerville, L.; Suni, Ilkka; Vähänen, Sami; Wyllie, Ken.

In: IEEE Transactions on Nuclear Science, Vol. 56, No. 4, 2006, p. 2296-2302.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - A fine pitch bump bonding process compatible with the manufacture of the pixel-HPD's for the LHCb RICH detector

AU - Campbell, Michael

AU - Rinella, G.A.

AU - Izquierdo, G.A.

AU - Gys, Thierry

AU - Kanaya, N.

AU - Newby, C.

AU - Piedigrossi, D.

AU - Riedler, Petra

AU - Salmi, Jorma

AU - Salonen, Jaakko

AU - Savolainen-Pulli, Satu

AU - Somerville, L.

AU - Suni, Ilkka

AU - Vähänen, Sami

AU - Wyllie, Ken

N1 - Project code: T4SU00263

PY - 2006

Y1 - 2006

N2 - A new approach to photo detection using pixel-HPD's has been adopted for the LHCb-RICH detector. These devices use a hybrid pixel detector inside an evacuated photo tube providing high-precision, low noise detection of Cherenkov radiation. The approach takes advantage of modern CMOS technology offering many advantages over more traditional techniques. These advantages include extremely high sensitivity, low noise and fast readout. A major technological challenge was the encapsulation of a hybrid pixel detector inside a photo detector tube. The fabrication of the HPD tube involves packaging of the pixel detector assembly onto a ceramic carrier to form the photo-anode and the subsequent bake out of the pixel anode under vacuum. Both processes involve high temperatures. A fine pitch solder bump-bonding technique, which is compatible with the manufacture of hybrid photo detectors, has been developed. The technology and the tests used for qualifying the new process for pixel-HPD production are described. More than 40 pixel detector assemblies have been produced with almost all showing <1% of missing pixels. A number of assemblies were baked out using temperature cycles identical to those used for pixel-HPD manufacture. None of the assemblies demonstrated any degradation. SEM photos clearly indicate the reliability of the process. 10 pixel-HPD tubes have been produced using this new bump-bonding process and those behave according to expectations. The pixel-HPD is the first of a new generation of photo detector tubes suitable for RICH and other visible photon sensing applications.

AB - A new approach to photo detection using pixel-HPD's has been adopted for the LHCb-RICH detector. These devices use a hybrid pixel detector inside an evacuated photo tube providing high-precision, low noise detection of Cherenkov radiation. The approach takes advantage of modern CMOS technology offering many advantages over more traditional techniques. These advantages include extremely high sensitivity, low noise and fast readout. A major technological challenge was the encapsulation of a hybrid pixel detector inside a photo detector tube. The fabrication of the HPD tube involves packaging of the pixel detector assembly onto a ceramic carrier to form the photo-anode and the subsequent bake out of the pixel anode under vacuum. Both processes involve high temperatures. A fine pitch solder bump-bonding technique, which is compatible with the manufacture of hybrid photo detectors, has been developed. The technology and the tests used for qualifying the new process for pixel-HPD production are described. More than 40 pixel detector assemblies have been produced with almost all showing <1% of missing pixels. A number of assemblies were baked out using temperature cycles identical to those used for pixel-HPD manufacture. None of the assemblies demonstrated any degradation. SEM photos clearly indicate the reliability of the process. 10 pixel-HPD tubes have been produced using this new bump-bonding process and those behave according to expectations. The pixel-HPD is the first of a new generation of photo detector tubes suitable for RICH and other visible photon sensing applications.

KW - photodetectors

KW - radiation detectors

U2 - 10.1109/NSSMIC.2004.1462278

DO - 10.1109/NSSMIC.2004.1462278

M3 - Article

VL - 56

SP - 2296

EP - 2302

JO - IEEE Transactions on Nuclear Science

JF - IEEE Transactions on Nuclear Science

SN - 0018-9499

IS - 4

ER -