A flip chip process based on electroplated solder bumps

INIS

• alignment 33%
• aluminum 33%
• bonding 100%
• ceramics 33%
• comparative evaluations 33%
• copper 33%
• density 33%
• deposition 66%
• economy 33%
• electroplating 33%
• etching 33%
• glass 33%
• heat 33%
• joining 33%
• layers 66%
• liquids 33%
• masks 66%
• metals 100%
• molybdenum 33%
• packaging 33%
• pcb 33%
• performance 33%
• processing 33%
• silicon 33%
• sputtering 33%
• substrates 100%
• thin films 100%
• vacuum furnaces 33%
• wires 33%

Keyphrases

• Al Pad 25%
• Aluminum Pad 25%
• Bonder 25%
• Bump 100%
• Electrical Performance 25%
• Electroplating 100%
• Fine Line 25%
• Flip chip 25%
• Flip-chip Process 100%
• Flip-chip Technology 25%
• Full Potential 25%
• Glass-ceramics 25%
• Heat-assisted 25%
• Metal Cans 25%
• Metal Layer 25%
• Molybdenum 25%
• Packaging Density 25%
• Pb-Sn 25%
• Photoresist 25%
• Process-based 100%
• Processing Stages 25%
• Reflow 25%
• Solder Bump 100%
• Solder Joint 25%
• Sputter-deposited 25%
• Substrate Technology 25%
• Tack 25%
• Thin Film Layers 25%
• Upside down 25%
• Vacuum Furnace 25%
• Wire Bonding 25%

Material Science

• Aluminum 33%
• Density 33%
• Electroplating 33%
• Glass Ceramics 33%
• Molybdenum 33%
• Silicon 33%
• Solder Joint 33%
• Thin Films 100%