A follow-up case study of the relation of PLM Architecture, Maturity and Business processes

Ville Veli Vainio, Antti Juhani Pulkkinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

This paper presents findings of two research projects, which study current PLM practices and future PLM challenges of global manufacturing companies. This study focuses on maturity of PLM adoption, PLM system architectures and integrations between the tools and seeks a better understanding of a real business phenomenon by comparing case companies to models presented in literature. Data was collected by interviews and benchmarking sessions in six plus three companies in two projects. The companies are categorized by using a four level PLM maturity model. This research indicates that the PLM adoption maturity and architecture models are related to the effectiveness of PLM usage. Service and project businesses seem to be challenging aspects. This is because PLM systems are mainly used in beginning of life activities of the product. In the future also the end of life and middle of life activities should receive more support from the tools and software.

Original languageEnglish
Title of host publicationProduct Lifecycle Management in the Era of Internet of Things. PLM 2015
PublisherSpringer
Pages867-873
Number of pages7
ISBN (Electronic)978-3-319-33111-9
ISBN (Print)978-3-319-33110-2
DOIs
Publication statusPublished - 1 Jan 2016
MoE publication typeA4 Article in a conference publication

Publication series

SeriesIFIP Advances in Information and Communication Technology
Volume467
ISSN1868-4238

Keywords

  • PLM maturity
  • PLM systems architecture
  • Product lifecycle management

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    Vainio, V. V., & Pulkkinen, A. J. (2016). A follow-up case study of the relation of PLM Architecture, Maturity and Business processes. In Product Lifecycle Management in the Era of Internet of Things. PLM 2015 (pp. 867-873). Springer. IFIP Advances in Information and Communication Technology, Vol.. 467 https://doi.org/10.1007/978-3-319-33111-9_79