A Method and a system for generating a high-resolution pattern on a substrate

The present invention relates to a method and an apparatus for manufacturing of a desired pattern of an electrically conducting, semiconducting or insulating material on a substrate. A patterned polymer ink film (22') is produced out of a semi-dry polymer ink by bringing a three-dimensional relief pattern with a positive image of the desired pattern (25) temporarily into contact with the semi-dry polymer ink film (22) so that portions (22?) of the semi-dry polymer ink film (22) are transferred to the three-dimensional relief pattern (25). The patterned polymer ink film with the negative of the desired pattern (22') has vertical sidewalls caused by fracturing of the semi-dry polymer ink film (22) with cohesion by the edges of the three-dimensional relief pattern (25) and adhesion between the second portions (22?) of the semi-dry polymer ink film (22) and the three-dimensional relief pattern (25). The patterned polymer ink film (22') is transferred onto a substrate (26), and a conductive, semi-conductive or insulating material layer (30') is deposited onto the substrate (26) using physical vapor deposition or chemical vapor deposition. The patterned polymer ink film (22') is dissolved from the substrate (26) with an organic solvent to yield the desired pattern (30).

Patent family as of 21.7.2026
EP4248502 A1, FI130437 B, FI20215371 A, JP2024522384 T2, US2023399736 AA, WO22106755 A1