A multilayer LTCC solution for integrating 5G access point antenna modules

Francesco Foglia Manzillo, Mauro Ettorre, Markku S. Lahti, Kari T. Kautio, Delphine Lelaidier, Eric Seguenot, Ronan Sauleau

    Research output: Contribution to journal › Article › Scientific › peer-review

    33 Citations (Scopus)

    Abstract

    An integrated solution for the development of multilayer antenna modules for fifth-generation (5G) communications, based on low temperature cofired ceramic (LTCC), is presented. The design exploits the 3-D integration capabilities of the LTCC process, enabling the realization of a full-corporate feed network (CFN) in vertical configuration. A novel implementation of the CFN employing dielectric-embedded parallel plate waveguides (PPWs) is proposed. The PPW lines are delimited by via-rows. As opposed to standard substrate-integrated waveguide feed networks, guided fields are orthogonal to the via-rows and propagate along the vertical axis of the structure. The CFN feeds four long slots, without any coupling structure, and provides broadband operation. The final prototype comprises 18 LTCC tapes, with a total thickness of 3.4 mm. The measured -10-dB impedance bandwidth spans from 51.2 to 66 GHz (>25.2%). The module generates a fixed broadside beam, but multibeam operation in H-plane can be easily achieved. In the 50-66-GHz band, the peak gain is 14.25 dBi and the average first side-lobe level in H-plane is -20.6 dB. The proposed technology and the design concept are suited for highly integrated millimeter-wave systems, such as access points in the future V-band high data-rate wireless networks.
    Original languageEnglish
    Pages (from-to)2272-2283
    JournalIEEE Transactions on Microwave Theory and Techniques
    Volume64
    Issue number7
    DOIs
    Publication statusPublished - 2016
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    Multilayers
    antennas
    modules
    ceramics
    Antennas
    Waveguides
    Substrate integrated waveguides
    waveguides
    parallel plates
    Telephone lines
    Antenna feeders
    Millimeter waves
    Temperature
    Tapes
    Wireless networks
    Bandwidth
    extremely high frequencies
    slots
    lobes
    Communication

    Keywords

    • Antenna-in-package (AiP)
    • corporate feed networks (CFNs)
    • fifth-generation (5G)
    • low temperature cofired ceramic (LTCC)
    • millimeter-wave (mm-wave) antennas
    • mm-wave technologies
    • transverse electromagnetic (TEM) waveguides

    Cite this

    Foglia Manzillo, Francesco ; Ettorre, Mauro ; Lahti, Markku S. ; Kautio, Kari T. ; Lelaidier, Delphine ; Seguenot, Eric ; Sauleau, Ronan. / A multilayer LTCC solution for integrating 5G access point antenna modules. In: IEEE Transactions on Microwave Theory and Techniques. 2016 ; Vol. 64, No. 7. pp. 2272-2283.
    @article{1d85346e4d9f4e66a86cbe5635240c6b,
    title = "A multilayer LTCC solution for integrating 5G access point antenna modules",
    abstract = "An integrated solution for the development of multilayer antenna modules for fifth-generation (5G) communications, based on low temperature cofired ceramic (LTCC), is presented. The design exploits the 3-D integration capabilities of the LTCC process, enabling the realization of a full-corporate feed network (CFN) in vertical configuration. A novel implementation of the CFN employing dielectric-embedded parallel plate waveguides (PPWs) is proposed. The PPW lines are delimited by via-rows. As opposed to standard substrate-integrated waveguide feed networks, guided fields are orthogonal to the via-rows and propagate along the vertical axis of the structure. The CFN feeds four long slots, without any coupling structure, and provides broadband operation. The final prototype comprises 18 LTCC tapes, with a total thickness of 3.4 mm. The measured -10-dB impedance bandwidth spans from 51.2 to 66 GHz (>25.2{\%}). The module generates a fixed broadside beam, but multibeam operation in H-plane can be easily achieved. In the 50-66-GHz band, the peak gain is 14.25 dBi and the average first side-lobe level in H-plane is -20.6 dB. The proposed technology and the design concept are suited for highly integrated millimeter-wave systems, such as access points in the future V-band high data-rate wireless networks.",
    keywords = "Antenna-in-package (AiP), corporate feed networks (CFNs), fifth-generation (5G), low temperature cofired ceramic (LTCC), millimeter-wave (mm-wave) antennas, mm-wave technologies, transverse electromagnetic (TEM) waveguides",
    author = "{Foglia Manzillo}, Francesco and Mauro Ettorre and Lahti, {Markku S.} and Kautio, {Kari T.} and Delphine Lelaidier and Eric Seguenot and Ronan Sauleau",
    year = "2016",
    doi = "10.1109/TMTT.2016.2574313",
    language = "English",
    volume = "64",
    pages = "2272--2283",
    journal = "IEEE Transactions on Microwave Theory and Techniques",
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    publisher = "IEEE Institute of Electrical and Electronic Engineers",
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    Foglia Manzillo, F, Ettorre, M, Lahti, MS, Kautio, KT, Lelaidier, D, Seguenot, E & Sauleau, R 2016, 'A multilayer LTCC solution for integrating 5G access point antenna modules', IEEE Transactions on Microwave Theory and Techniques, vol. 64, no. 7, pp. 2272-2283. https://doi.org/10.1109/TMTT.2016.2574313

    A multilayer LTCC solution for integrating 5G access point antenna modules. / Foglia Manzillo, Francesco; Ettorre, Mauro; Lahti, Markku S.; Kautio, Kari T.; Lelaidier, Delphine; Seguenot, Eric; Sauleau, Ronan.

    In: IEEE Transactions on Microwave Theory and Techniques, Vol. 64, No. 7, 2016, p. 2272-2283.

    Research output: Contribution to journal › Article › Scientific › peer-review

    TY - JOUR

    T1 - A multilayer LTCC solution for integrating 5G access point antenna modules

    AU - Foglia Manzillo, Francesco

    AU - Ettorre, Mauro

    AU - Lahti, Markku S.

    AU - Kautio, Kari T.

    AU - Lelaidier, Delphine

    AU - Seguenot, Eric

    AU - Sauleau, Ronan

    PY - 2016

    Y1 - 2016

    N2 - An integrated solution for the development of multilayer antenna modules for fifth-generation (5G) communications, based on low temperature cofired ceramic (LTCC), is presented. The design exploits the 3-D integration capabilities of the LTCC process, enabling the realization of a full-corporate feed network (CFN) in vertical configuration. A novel implementation of the CFN employing dielectric-embedded parallel plate waveguides (PPWs) is proposed. The PPW lines are delimited by via-rows. As opposed to standard substrate-integrated waveguide feed networks, guided fields are orthogonal to the via-rows and propagate along the vertical axis of the structure. The CFN feeds four long slots, without any coupling structure, and provides broadband operation. The final prototype comprises 18 LTCC tapes, with a total thickness of 3.4 mm. The measured -10-dB impedance bandwidth spans from 51.2 to 66 GHz (>25.2%). The module generates a fixed broadside beam, but multibeam operation in H-plane can be easily achieved. In the 50-66-GHz band, the peak gain is 14.25 dBi and the average first side-lobe level in H-plane is -20.6 dB. The proposed technology and the design concept are suited for highly integrated millimeter-wave systems, such as access points in the future V-band high data-rate wireless networks.

    AB - An integrated solution for the development of multilayer antenna modules for fifth-generation (5G) communications, based on low temperature cofired ceramic (LTCC), is presented. The design exploits the 3-D integration capabilities of the LTCC process, enabling the realization of a full-corporate feed network (CFN) in vertical configuration. A novel implementation of the CFN employing dielectric-embedded parallel plate waveguides (PPWs) is proposed. The PPW lines are delimited by via-rows. As opposed to standard substrate-integrated waveguide feed networks, guided fields are orthogonal to the via-rows and propagate along the vertical axis of the structure. The CFN feeds four long slots, without any coupling structure, and provides broadband operation. The final prototype comprises 18 LTCC tapes, with a total thickness of 3.4 mm. The measured -10-dB impedance bandwidth spans from 51.2 to 66 GHz (>25.2%). The module generates a fixed broadside beam, but multibeam operation in H-plane can be easily achieved. In the 50-66-GHz band, the peak gain is 14.25 dBi and the average first side-lobe level in H-plane is -20.6 dB. The proposed technology and the design concept are suited for highly integrated millimeter-wave systems, such as access points in the future V-band high data-rate wireless networks.

    KW - Antenna-in-package (AiP)

    KW - corporate feed networks (CFNs)

    KW - fifth-generation (5G)

    KW - low temperature cofired ceramic (LTCC)

    KW - millimeter-wave (mm-wave) antennas

    KW - mm-wave technologies

    KW - transverse electromagnetic (TEM) waveguides

    U2 - 10.1109/TMTT.2016.2574313

    DO - 10.1109/TMTT.2016.2574313

    M3 - Article

    VL - 64

    SP - 2272

    EP - 2283

    JO - IEEE Transactions on Microwave Theory and Techniques

    JF - IEEE Transactions on Microwave Theory and Techniques

    SN - 0018-9480

    IS - 7

    ER -

    Foglia Manzillo F, Ettorre M, Lahti MS, Kautio KT, Lelaidier D, Seguenot E et al. A multilayer LTCC solution for integrating 5G access point antenna modules. IEEE Transactions on Microwave Theory and Techniques. 2016;64(7):2272-2283. https://doi.org/10.1109/TMTT.2016.2574313

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