Abstract
An integrated solution for the development of multilayer
antenna modules for fifth-generation (5G) communications,
based on low temperature cofired ceramic (LTCC), is
presented. The design exploits the 3-D integration
capabilities of the LTCC process, enabling the
realization of a full-corporate feed network (CFN) in
vertical configuration. A novel implementation of the CFN
employing dielectric-embedded parallel plate waveguides
(PPWs) is proposed. The PPW lines are delimited by
via-rows. As opposed to standard substrate-integrated
waveguide feed networks, guided fields are orthogonal to
the via-rows and propagate along the vertical axis of the
structure. The CFN feeds four long slots, without any
coupling structure, and provides broadband operation. The
final prototype comprises 18 LTCC tapes, with a total
thickness of 3.4 mm. The measured -10-dB impedance
bandwidth spans from 51.2 to 66 GHz (>25.2%). The module
generates a fixed broadside beam, but multibeam operation
in H-plane can be easily achieved. In the 50-66-GHz band,
the peak gain is 14.25 dBi and the average first
side-lobe level in H-plane is -20.6 dB. The proposed
technology and the design concept are suited for highly
integrated millimeter-wave systems, such as access points
in the future V-band high data-rate wireless networks.
Original language | English |
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Pages (from-to) | 2272-2283 |
Journal | IEEE Transactions on Microwave Theory and Techniques |
Volume | 64 |
Issue number | 7 |
DOIs | |
Publication status | Published - 2016 |
MoE publication type | A1 Journal article-refereed |
Keywords
- Antenna-in-package (AiP)
- corporate feed networks (CFNs)
- fifth-generation (5G)
- low temperature cofired ceramic (LTCC)
- millimeter-wave (mm-wave) antennas
- mm-wave technologies
- transverse electromagnetic (TEM) waveguides