Abstract
| Original language | English |
|---|---|
| Pages (from-to) | 2272-2283 |
| Journal | IEEE Transactions on Microwave Theory and Techniques |
| Volume | 64 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 2016 |
| MoE publication type | A1 Journal article-refereed |
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Keywords
- Antenna-in-package (AiP)
- corporate feed networks (CFNs)
- fifth-generation (5G)
- low temperature cofired ceramic (LTCC)
- millimeter-wave (mm-wave) antennas
- mm-wave technologies
- transverse electromagnetic (TEM) waveguides
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A multilayer LTCC solution for integrating 5G access point antenna modules. / Foglia Manzillo, Francesco; Ettorre, Mauro; Lahti, Markku S.; Kautio, Kari T.; Lelaidier, Delphine; Seguenot, Eric; Sauleau, Ronan.
In: IEEE Transactions on Microwave Theory and Techniques, Vol. 64, No. 7, 2016, p. 2272-2283.Research output: Contribution to journal › Article › Scientific › peer-review
TY - JOUR
T1 - A multilayer LTCC solution for integrating 5G access point antenna modules
AU - Foglia Manzillo, Francesco
AU - Ettorre, Mauro
AU - Lahti, Markku S.
AU - Kautio, Kari T.
AU - Lelaidier, Delphine
AU - Seguenot, Eric
AU - Sauleau, Ronan
PY - 2016
Y1 - 2016
N2 - An integrated solution for the development of multilayer antenna modules for fifth-generation (5G) communications, based on low temperature cofired ceramic (LTCC), is presented. The design exploits the 3-D integration capabilities of the LTCC process, enabling the realization of a full-corporate feed network (CFN) in vertical configuration. A novel implementation of the CFN employing dielectric-embedded parallel plate waveguides (PPWs) is proposed. The PPW lines are delimited by via-rows. As opposed to standard substrate-integrated waveguide feed networks, guided fields are orthogonal to the via-rows and propagate along the vertical axis of the structure. The CFN feeds four long slots, without any coupling structure, and provides broadband operation. The final prototype comprises 18 LTCC tapes, with a total thickness of 3.4 mm. The measured -10-dB impedance bandwidth spans from 51.2 to 66 GHz (>25.2%). The module generates a fixed broadside beam, but multibeam operation in H-plane can be easily achieved. In the 50-66-GHz band, the peak gain is 14.25 dBi and the average first side-lobe level in H-plane is -20.6 dB. The proposed technology and the design concept are suited for highly integrated millimeter-wave systems, such as access points in the future V-band high data-rate wireless networks.
AB - An integrated solution for the development of multilayer antenna modules for fifth-generation (5G) communications, based on low temperature cofired ceramic (LTCC), is presented. The design exploits the 3-D integration capabilities of the LTCC process, enabling the realization of a full-corporate feed network (CFN) in vertical configuration. A novel implementation of the CFN employing dielectric-embedded parallel plate waveguides (PPWs) is proposed. The PPW lines are delimited by via-rows. As opposed to standard substrate-integrated waveguide feed networks, guided fields are orthogonal to the via-rows and propagate along the vertical axis of the structure. The CFN feeds four long slots, without any coupling structure, and provides broadband operation. The final prototype comprises 18 LTCC tapes, with a total thickness of 3.4 mm. The measured -10-dB impedance bandwidth spans from 51.2 to 66 GHz (>25.2%). The module generates a fixed broadside beam, but multibeam operation in H-plane can be easily achieved. In the 50-66-GHz band, the peak gain is 14.25 dBi and the average first side-lobe level in H-plane is -20.6 dB. The proposed technology and the design concept are suited for highly integrated millimeter-wave systems, such as access points in the future V-band high data-rate wireless networks.
KW - Antenna-in-package (AiP)
KW - corporate feed networks (CFNs)
KW - fifth-generation (5G)
KW - low temperature cofired ceramic (LTCC)
KW - millimeter-wave (mm-wave) antennas
KW - mm-wave technologies
KW - transverse electromagnetic (TEM) waveguides
U2 - 10.1109/TMTT.2016.2574313
DO - 10.1109/TMTT.2016.2574313
M3 - Article
VL - 64
SP - 2272
EP - 2283
JO - IEEE Transactions on Microwave Theory and Techniques
JF - IEEE Transactions on Microwave Theory and Techniques
SN - 0018-9480
IS - 7
ER -