A novel CMP process on fixed abrasive pads for the manufacturing of highly planar thick film SOI substrates

Martin Kulawski (Corresponding author), Kimmo Henttinen, Ilkka Suni, Frauke Weimar, Jari Mäkinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

Abstract

A new approach using Fixed Abrasive (FA) pads has been undertaken to overcome the problem of non-uniform thick film Silicon-on-Insulator (SOI) wafers after CMP polishing. The theoretical models indicating the advantages of the 2-body system of the fixed abrasive configuration vs. the conventional 3-body system of slurry based polishing have been convincingly demonstrated in practise upon experiments in a wide range of parameters. As a result it is possible to maintain or improve the flatness of wafers after back grinding, while simultaneously removing the sub-surface damage. A surface quality of prime wafers can be reached on the device layer. Capacitive thickness measurement scans and atomic force microscopy (AFM) monitoring confirm the results. A detailed comparison with conventional processing has been carried out to clarify the advantages on bulk silicon wafers. Decoration etching is used to analyse the wafer surface quality in terms of oxide induced stacking faults (OISF). As a result an alternative processing method is proposed for manufacturing thick film SOI substrates with improved uniformity.
Original languageEnglish
Title of host publicationMaterials Research Society Proceedings 2003
Subtitle of host publicationSymposium F - Chemical-Mechanical Planarization
EditorsD. Boning, K. Devriendt, M. Oliver, D. Stein
Place of PublicationWarrendale
PublisherMaterials Research Society
Pages133-138
DOIs
Publication statusPublished - 2003
MoE publication typeA4 Article in a conference publication
EventMaterials Research Society 2003 Conference: Symposium F - Chemical-Mechanical Planarization - San Francisco, United States
Duration: 22 Apr 200324 Apr 2003

Publication series

SeriesMaterials Research Society Symposia Proceedings
Volume767
ISSN0272-9172

Conference

ConferenceMaterials Research Society 2003 Conference
CountryUnited States
CitySan Francisco
Period22/04/0324/04/03

Keywords

  • SOI
  • CMP
  • fixed abrasive
  • FA
  • polishing
  • chemical mechanical planarization

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