A novel CMP process on fixed abrasive pads for the manufacturing of highly planar thick film SOI substrates

Martin Kulawski (Corresponding author), Kimmo Henttinen, Ilkka Suni, Frauke Weimar, Jari Mäkinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

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Physics & Astronomy