A novel method for processing capacitive micromechanical ultrasonic transducers (cMUT)

Jaakko Saarilahti, Martti Blomberg, Ari Häärä, Hannu Kattelus

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    10 Citations (Scopus)

    Abstract

    The cMUTs presented in this study are based on a new surface micromachining process, where part of the top electrode of the cMUT is fabricated of porous polysilicon. This method gives many advantages over the previously reported fabrication processes.
    Original languageEnglish
    Title of host publication2002 IEEE Ultrasonics Symposium Proceedings
    EditorsDonald E. Yuhas, Susan C. Schneider
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages1071-1074
    Volume2
    ISBN (Electronic)0-7803-7583-1
    ISBN (Print)978-0-7803-7582-6
    DOIs
    Publication statusPublished - 2002
    MoE publication typeA4 Article in a conference publication
    Event2002 IEEE International Ultrasonics Symposium and Short Courses - Munich, Germany
    Duration: 8 Oct 200211 Oct 2002

    Publication series

    SeriesProceedings - IEEE Ultrasonics Symposium
    Volume2002
    ISSN1051-0117

    Conference

    Conference2002 IEEE International Ultrasonics Symposium and Short Courses
    Country/TerritoryGermany
    CityMunich
    Period8/10/0211/10/02

    Keywords

    • Ultrasonics
    • Micromechanics
    • cMUT

    Fingerprint

    Dive into the research topics of 'A novel method for processing capacitive micromechanical ultrasonic transducers (cMUT)'. Together they form a unique fingerprint.

    Cite this