A novel packaging concept for electronics in textile UHF antennas

C. Boehme, R. Vieroth, Mervi Hirvonen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)


    In this paper, we present the concept and describe the miniaturized packaging of a textile integrated wireless body-area-network (WBAN) node. The electronic modules have been laminated onto a textile antenna, by applying cutting edge integration technologies. The designed 868MHz UHF antenna is wrapped around the electronic module and consists of two layer of textile. Moreover, a layer of conductive textile has been mounted on a layer of non-conductive textile. For the mechanical and the electrical connection we have employed a thermoplastic non-conductive adhesive (NCA) and an isotropic conductive adhesive (ICA). The uniqueness of this process is to demonstrate how the electronic module was placed inside a textile UHF antenna. Precise packaging is important to avoid the negative effects of electronic components inside an UHF environment. The reliability of the mechanical and electrical connection of the electronic modules was tested. These tests were used to evaluate the adhesion strength between the electronic module and the base fabric (non-conductive textile). Moreover, they provided information about the contact resistance between the conductive textile and the antenna feed lines of the electronic module. Additionally, performed cross sections and X-Ray photography provided more insight in the reliability. The achieved results demonstrate the successful operation of the designed System in Package (SiP), consisting of an electronic module attached to a textile UHF antenna.
    Original languageEnglish
    Title of host publicationProceedings
    Subtitle of host publication45th International Symposium on Microelectronics, IMAPS 2012
    Place of PublicationRed Hook, NY, USA
    PublisherCurran Associates Inc.
    ISBN (Print)978-1-62748-095-6
    Publication statusPublished - 2012
    MoE publication typeA4 Article in a conference publication
    Event45th Annual International Symposium on Microelectronics, IMAPS 2012 - San Diego, CA, United States
    Duration: 9 Sept 201213 Sept 2012


    Conference45th Annual International Symposium on Microelectronics, IMAPS 2012
    Abbreviated titleIMAPS 2012
    Country/TerritoryUnited States
    CitySan Diego, CA


    • BAN
    • ICA
    • NCA
    • textile antenna
    • wireless sensor node


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