A novel packaging concept for electronics in textile UHF antennas

C. Boehme, R. Vieroth, Mervi Hirvonen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)

Abstract

In this paper, we present the concept and describe the miniaturized packaging of a textile integrated wireless body-area-network (WBAN) node. The electronic modules have been laminated onto a textile antenna, by applying cutting edge integration technologies. The designed 868MHz UHF antenna is wrapped around the electronic module and consists of two layer of textile. Moreover, a layer of conductive textile has been mounted on a layer of non-conductive textile. For the mechanical and the electrical connection we have employed a thermoplastic non-conductive adhesive (NCA) and an isotropic conductive adhesive (ICA). The uniqueness of this process is to demonstrate how the electronic module was placed inside a textile UHF antenna. Precise packaging is important to avoid the negative effects of electronic components inside an UHF environment. The reliability of the mechanical and electrical connection of the electronic modules was tested. These tests were used to evaluate the adhesion strength between the electronic module and the base fabric (non-conductive textile). Moreover, they provided information about the contact resistance between the conductive textile and the antenna feed lines of the electronic module. Additionally, performed cross sections and X-Ray photography provided more insight in the reliability. The achieved results demonstrate the successful operation of the designed System in Package (SiP), consisting of an electronic module attached to a textile UHF antenna.
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publication45th International Symposium on Microelectronics, IMAPS 2012
Place of PublicationRed Hook, NY, USA
PublisherCurran Associates Inc.
Pages425-432
Volume1
ISBN (Print)978-1-62748-095-6
Publication statusPublished - 2012
MoE publication typeA4 Article in a conference publication
Event45th Annual International Symposium on Microelectronics, IMAPS 2012 - San Diego, CA, United States
Duration: 9 Sep 201213 Sep 2012

Conference

Conference45th Annual International Symposium on Microelectronics, IMAPS 2012
Abbreviated titleIMAPS 2012
CountryUnited States
CitySan Diego, CA
Period9/09/1213/09/12

Fingerprint

Packaging
Textiles
Electronic equipment
Antennas
Adhesives
Radiography
Bond strength (materials)
Antenna feeders
Contact resistance
Thermoplastics

Keywords

  • BAN
  • ICA
  • NCA
  • textile antenna
  • wireless sensor node

Cite this

Boehme, C., Vieroth, R., & Hirvonen, M. (2012). A novel packaging concept for electronics in textile UHF antennas. In Proceedings: 45th International Symposium on Microelectronics, IMAPS 2012 (Vol. 1, pp. 425-432). Red Hook, NY, USA: Curran Associates Inc..
Boehme, C. ; Vieroth, R. ; Hirvonen, Mervi. / A novel packaging concept for electronics in textile UHF antennas. Proceedings: 45th International Symposium on Microelectronics, IMAPS 2012. Vol. 1 Red Hook, NY, USA : Curran Associates Inc., 2012. pp. 425-432
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abstract = "In this paper, we present the concept and describe the miniaturized packaging of a textile integrated wireless body-area-network (WBAN) node. The electronic modules have been laminated onto a textile antenna, by applying cutting edge integration technologies. The designed 868MHz UHF antenna is wrapped around the electronic module and consists of two layer of textile. Moreover, a layer of conductive textile has been mounted on a layer of non-conductive textile. For the mechanical and the electrical connection we have employed a thermoplastic non-conductive adhesive (NCA) and an isotropic conductive adhesive (ICA). The uniqueness of this process is to demonstrate how the electronic module was placed inside a textile UHF antenna. Precise packaging is important to avoid the negative effects of electronic components inside an UHF environment. The reliability of the mechanical and electrical connection of the electronic modules was tested. These tests were used to evaluate the adhesion strength between the electronic module and the base fabric (non-conductive textile). Moreover, they provided information about the contact resistance between the conductive textile and the antenna feed lines of the electronic module. Additionally, performed cross sections and X-Ray photography provided more insight in the reliability. The achieved results demonstrate the successful operation of the designed System in Package (SiP), consisting of an electronic module attached to a textile UHF antenna.",
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Boehme, C, Vieroth, R & Hirvonen, M 2012, A novel packaging concept for electronics in textile UHF antennas. in Proceedings: 45th International Symposium on Microelectronics, IMAPS 2012. vol. 1, Curran Associates Inc., Red Hook, NY, USA, pp. 425-432, 45th Annual International Symposium on Microelectronics, IMAPS 2012, San Diego, CA, United States, 9/09/12.

A novel packaging concept for electronics in textile UHF antennas. / Boehme, C.; Vieroth, R.; Hirvonen, Mervi.

Proceedings: 45th International Symposium on Microelectronics, IMAPS 2012. Vol. 1 Red Hook, NY, USA : Curran Associates Inc., 2012. p. 425-432.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AB - In this paper, we present the concept and describe the miniaturized packaging of a textile integrated wireless body-area-network (WBAN) node. The electronic modules have been laminated onto a textile antenna, by applying cutting edge integration technologies. The designed 868MHz UHF antenna is wrapped around the electronic module and consists of two layer of textile. Moreover, a layer of conductive textile has been mounted on a layer of non-conductive textile. For the mechanical and the electrical connection we have employed a thermoplastic non-conductive adhesive (NCA) and an isotropic conductive adhesive (ICA). The uniqueness of this process is to demonstrate how the electronic module was placed inside a textile UHF antenna. Precise packaging is important to avoid the negative effects of electronic components inside an UHF environment. The reliability of the mechanical and electrical connection of the electronic modules was tested. These tests were used to evaluate the adhesion strength between the electronic module and the base fabric (non-conductive textile). Moreover, they provided information about the contact resistance between the conductive textile and the antenna feed lines of the electronic module. Additionally, performed cross sections and X-Ray photography provided more insight in the reliability. The achieved results demonstrate the successful operation of the designed System in Package (SiP), consisting of an electronic module attached to a textile UHF antenna.

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Boehme C, Vieroth R, Hirvonen M. A novel packaging concept for electronics in textile UHF antennas. In Proceedings: 45th International Symposium on Microelectronics, IMAPS 2012. Vol. 1. Red Hook, NY, USA: Curran Associates Inc. 2012. p. 425-432