A Roadmap for Next-Generation Solutions of Sustainable Mechatronic Integrated Devices via Laser Direct Structuring

Luciano Rietter; Catarina Rebelo; Lotta Hepo-Oja; Agnieszka Rocha; Filipa Carneiro

doi:10.1109/MoSICom67153.2025.11398334

A Roadmap for Next-Generation Solutions of Sustainable Mechatronic Integrated Devices via Laser Direct Structuring

Luciano Rietter
, Catarina Rebelo
, Lotta Hepo-Oja
, Agnieszka Rocha
, Filipa Carneiro

BA4608 Sustainable business

University of Minho

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

Mechatronic Integrated Devices (MIDs) combine electrical and mechanical functions and most of them are produced by the Laser Direct Structuring (LDS) technology. As a well-established technology, with a large number of applications, such devices experienced few to none concern regarding sustainability claims and practices. As electronics packaging complexity increases day-by-day, sustainability concerns have been largely overlooked. This work delivers a concise review of current LDS-MID technology from a sustainable point of view, identifying trade-offs between performance and environmental impact. In the use case presented, the production phase of the LDS-MID sensor is explored step-by-step, highlighting the sustainable solutions adopted, contributing to the concrete development and implementation of the next generation of sustainable mechatronic integrated devices.

Original language	English
Title of host publication	Proceedings of IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	442-447
Number of pages	6
ISBN (Electronic)	979-8-3315-7391-1
DOIs	https://doi.org/10.1109/MoSICom67153.2025.11398334
Publication status	Published - 2025
MoE publication type	A4 Article in a conference publication
Event	IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025 - Dubai, United Arab Emirates Duration: 10 Dec 2025 → 12 Dec 2025

Conference

Conference	IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025
Country/Territory	United Arab Emirates
City	Dubai
Period	10/12/25 → 12/12/25

Funding

The project is co-funded by the European Union under grant agreement 101112109.

Keywords

green electronics
laser direct structuring
mechatronic integrated devices
sustainability

Access to Document

10.1109/MoSICom67153.2025.11398334

Cite this

Rietter, L., Rebelo, C., Hepo-Oja, L., Rocha, A., & Carneiro, F. (2025). A Roadmap for Next-Generation Solutions of Sustainable Mechatronic Integrated Devices via Laser Direct Structuring. In Proceedings of IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025 (pp. 442-447). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/MoSICom67153.2025.11398334

@inproceedings{edbbca09949f438988893fb56661b61e,

title = "A Roadmap for Next-Generation Solutions of Sustainable Mechatronic Integrated Devices via Laser Direct Structuring",

abstract = "Mechatronic Integrated Devices (MIDs) combine electrical and mechanical functions and most of them are produced by the Laser Direct Structuring (LDS) technology. As a well-established technology, with a large number of applications, such devices experienced few to none concern regarding sustainability claims and practices. As electronics packaging complexity increases day-by-day, sustainability concerns have been largely overlooked. This work delivers a concise review of current LDS-MID technology from a sustainable point of view, identifying trade-offs between performance and environmental impact. In the use case presented, the production phase of the LDS-MID sensor is explored step-by-step, highlighting the sustainable solutions adopted, contributing to the concrete development and implementation of the next generation of sustainable mechatronic integrated devices.",

keywords = "green electronics, laser direct structuring, mechatronic integrated devices, sustainability",

author = "Luciano Rietter and Catarina Rebelo and Lotta Hepo-Oja and Agnieszka Rocha and Filipa Carneiro",

year = "2025",

doi = "10.1109/MoSICom67153.2025.11398334",

language = "English",

pages = "442--447",

booktitle = "Proceedings of IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025 ; Conference date: 10-12-2025 Through 12-12-2025",

}

Rietter, L, Rebelo, C, Hepo-Oja, L, Rocha, A & Carneiro, F 2025, A Roadmap for Next-Generation Solutions of Sustainable Mechatronic Integrated Devices via Laser Direct Structuring. in Proceedings of IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025. IEEE Institute of Electrical and Electronic Engineers, pp. 442-447, IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025, Dubai, United Arab Emirates, 10/12/25. https://doi.org/10.1109/MoSICom67153.2025.11398334

A Roadmap for Next-Generation Solutions of Sustainable Mechatronic Integrated Devices via Laser Direct Structuring. / Rietter, Luciano; Rebelo, Catarina; Hepo-Oja, Lotta et al.
Proceedings of IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025. IEEE Institute of Electrical and Electronic Engineers, 2025. p. 442-447.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - A Roadmap for Next-Generation Solutions of Sustainable Mechatronic Integrated Devices via Laser Direct Structuring

AU - Rietter, Luciano

AU - Rebelo, Catarina

AU - Hepo-Oja, Lotta

AU - Rocha, Agnieszka

AU - Carneiro, Filipa

PY - 2025

Y1 - 2025

N2 - Mechatronic Integrated Devices (MIDs) combine electrical and mechanical functions and most of them are produced by the Laser Direct Structuring (LDS) technology. As a well-established technology, with a large number of applications, such devices experienced few to none concern regarding sustainability claims and practices. As electronics packaging complexity increases day-by-day, sustainability concerns have been largely overlooked. This work delivers a concise review of current LDS-MID technology from a sustainable point of view, identifying trade-offs between performance and environmental impact. In the use case presented, the production phase of the LDS-MID sensor is explored step-by-step, highlighting the sustainable solutions adopted, contributing to the concrete development and implementation of the next generation of sustainable mechatronic integrated devices.

AB - Mechatronic Integrated Devices (MIDs) combine electrical and mechanical functions and most of them are produced by the Laser Direct Structuring (LDS) technology. As a well-established technology, with a large number of applications, such devices experienced few to none concern regarding sustainability claims and practices. As electronics packaging complexity increases day-by-day, sustainability concerns have been largely overlooked. This work delivers a concise review of current LDS-MID technology from a sustainable point of view, identifying trade-offs between performance and environmental impact. In the use case presented, the production phase of the LDS-MID sensor is explored step-by-step, highlighting the sustainable solutions adopted, contributing to the concrete development and implementation of the next generation of sustainable mechatronic integrated devices.

KW - green electronics

KW - laser direct structuring

KW - mechatronic integrated devices

KW - sustainability

UR - https://www.scopus.com/pages/publications/105036270153

U2 - 10.1109/MoSICom67153.2025.11398334

DO - 10.1109/MoSICom67153.2025.11398334

M3 - Conference article in proceedings

AN - SCOPUS:105036270153

SP - 442

EP - 447

BT - Proceedings of IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025

Y2 - 10 December 2025 through 12 December 2025

ER -

Rietter L, Rebelo C, Hepo-Oja L, Rocha A, Carneiro F. A Roadmap for Next-Generation Solutions of Sustainable Mechatronic Integrated Devices via Laser Direct Structuring. In Proceedings of IEEE International Conference on Modelling, Simulation and Intelligent Computing, MoSICom 2025. IEEE Institute of Electrical and Electronic Engineers. 2025. p. 442-447 doi: 10.1109/MoSICom67153.2025.11398334

A Roadmap for Next-Generation Solutions of Sustainable Mechatronic Integrated Devices via Laser Direct Structuring

Abstract

Conference

Funding

Keywords

Access to Document

Other files and links

Fingerprint

SUSTRONICS: Sustainable and green electronics for circular economy

Cite this

A Roadmap for Next-Generation Solutions of Sustainable Mechatronic Integrated Devices via Laser Direct Structuring

Abstract

Conference

Funding

Keywords

Access to Document

Other files and links

Fingerprint

Projects

SUSTRONICS: Sustainable and green electronics for circular economy

Cite this