A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks

D Ruffieux, N Scolari, F Giroud, T-C Le, S Dalla Piazza, F Staub, K Zoschke, C-A Manier, H Oppermann, Tommi Suni, James Dekker, G Allegato

Research output: Contribution to journalArticleScientificpeer-review

11 Citations (Scopus)

Abstract

This paper introduces and demonstrates with high yield a novel concept for the packaging under vacuum of tuning fork quartz XTALs on top of a silicon interposer equipped with TSVs. It paves the way to the implementation of a monolithic timing microsystem where the ASIC is part of the housing of a newly designed tiny 131-kHz XTAL to reach extreme module miniaturization (1.5,*,1.1,*,0.7 mm3) and integrity. As this task is still ongoing, an early demonstration of the generic versatile timing module is presented using a chip-on-board approach with standalone conventionally packaged XTAL and BAW resonators. The module achieves 0.4 µW power dissipation and pm 2 ppm stability over {-} 40 circ C to 85 circ C in RTC mode and can deliver on-demand programmable clocks between 1-50 MHz. The latter are obtained either with a RC PLL or after division of the signal obtained from a 2-GHz BAW DCO at a power dissipation of 100 µ W and 5.3 mW, respectively
Original languageEnglish
Pages (from-to)212-222
JournalIEEE Journal of Solid-State Circuits
Volume49
Issue number1
DOIs
Publication statusPublished - 2014
MoE publication typeA1 Journal article-refereed

Fingerprint

Microsystems
Clocks
Resonators
Energy dissipation
Phase locked loops
Application specific integrated circuits
Quartz
Packaging
Demonstrations
Tuning
Vacuum
Silicon

Keywords

  • Hybrid integration
  • MEMS
  • oscillator
  • programme clocks
  • RTC
  • temperature sensor
  • wafer level packaging

Cite this

Ruffieux, D ; Scolari, N ; Giroud, F ; Le, T-C ; Dalla Piazza, S ; Staub, F ; Zoschke, K ; Manier, C-A ; Oppermann, H ; Suni, Tommi ; Dekker, James ; Allegato, G. / A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks. In: IEEE Journal of Solid-State Circuits. 2014 ; Vol. 49, No. 1. pp. 212-222.
@article{3a175120cbe1476483c0618d07b487bc,
title = "A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks",
abstract = "This paper introduces and demonstrates with high yield a novel concept for the packaging under vacuum of tuning fork quartz XTALs on top of a silicon interposer equipped with TSVs. It paves the way to the implementation of a monolithic timing microsystem where the ASIC is part of the housing of a newly designed tiny 131-kHz XTAL to reach extreme module miniaturization (1.5,*,1.1,*,0.7 mm3) and integrity. As this task is still ongoing, an early demonstration of the generic versatile timing module is presented using a chip-on-board approach with standalone conventionally packaged XTAL and BAW resonators. The module achieves 0.4 µW power dissipation and pm 2 ppm stability over {-} 40 circ C to 85 circ C in RTC mode and can deliver on-demand programmable clocks between 1-50 MHz. The latter are obtained either with a RC PLL or after division of the signal obtained from a 2-GHz BAW DCO at a power dissipation of 100 µ W and 5.3 mW, respectively",
keywords = "Hybrid integration, MEMS, oscillator, programme clocks, RTC, temperature sensor, wafer level packaging",
author = "D Ruffieux and N Scolari and F Giroud and T-C Le and {Dalla Piazza}, S and F Staub and K Zoschke and C-A Manier and H Oppermann and Tommi Suni and James Dekker and G Allegato",
note = "Project code: 70851",
year = "2014",
doi = "10.1109/JSSC.2013.2282111",
language = "English",
volume = "49",
pages = "212--222",
journal = "IEEE Journal of Solid-State Circuits",
issn = "0018-9200",
publisher = "Institute of Electrical and Electronic Engineers IEEE",
number = "1",

}

Ruffieux, D, Scolari, N, Giroud, F, Le, T-C, Dalla Piazza, S, Staub, F, Zoschke, K, Manier, C-A, Oppermann, H, Suni, T, Dekker, J & Allegato, G 2014, 'A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks', IEEE Journal of Solid-State Circuits, vol. 49, no. 1, pp. 212-222. https://doi.org/10.1109/JSSC.2013.2282111

A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks. / Ruffieux, D; Scolari, N; Giroud, F; Le, T-C; Dalla Piazza, S; Staub, F; Zoschke, K; Manier, C-A; Oppermann, H; Suni, Tommi; Dekker, James; Allegato, G.

In: IEEE Journal of Solid-State Circuits, Vol. 49, No. 1, 2014, p. 212-222.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks

AU - Ruffieux, D

AU - Scolari, N

AU - Giroud, F

AU - Le, T-C

AU - Dalla Piazza, S

AU - Staub, F

AU - Zoschke, K

AU - Manier, C-A

AU - Oppermann, H

AU - Suni, Tommi

AU - Dekker, James

AU - Allegato, G

N1 - Project code: 70851

PY - 2014

Y1 - 2014

N2 - This paper introduces and demonstrates with high yield a novel concept for the packaging under vacuum of tuning fork quartz XTALs on top of a silicon interposer equipped with TSVs. It paves the way to the implementation of a monolithic timing microsystem where the ASIC is part of the housing of a newly designed tiny 131-kHz XTAL to reach extreme module miniaturization (1.5,*,1.1,*,0.7 mm3) and integrity. As this task is still ongoing, an early demonstration of the generic versatile timing module is presented using a chip-on-board approach with standalone conventionally packaged XTAL and BAW resonators. The module achieves 0.4 µW power dissipation and pm 2 ppm stability over {-} 40 circ C to 85 circ C in RTC mode and can deliver on-demand programmable clocks between 1-50 MHz. The latter are obtained either with a RC PLL or after division of the signal obtained from a 2-GHz BAW DCO at a power dissipation of 100 µ W and 5.3 mW, respectively

AB - This paper introduces and demonstrates with high yield a novel concept for the packaging under vacuum of tuning fork quartz XTALs on top of a silicon interposer equipped with TSVs. It paves the way to the implementation of a monolithic timing microsystem where the ASIC is part of the housing of a newly designed tiny 131-kHz XTAL to reach extreme module miniaturization (1.5,*,1.1,*,0.7 mm3) and integrity. As this task is still ongoing, an early demonstration of the generic versatile timing module is presented using a chip-on-board approach with standalone conventionally packaged XTAL and BAW resonators. The module achieves 0.4 µW power dissipation and pm 2 ppm stability over {-} 40 circ C to 85 circ C in RTC mode and can deliver on-demand programmable clocks between 1-50 MHz. The latter are obtained either with a RC PLL or after division of the signal obtained from a 2-GHz BAW DCO at a power dissipation of 100 µ W and 5.3 mW, respectively

KW - Hybrid integration

KW - MEMS

KW - oscillator

KW - programme clocks

KW - RTC

KW - temperature sensor

KW - wafer level packaging

U2 - 10.1109/JSSC.2013.2282111

DO - 10.1109/JSSC.2013.2282111

M3 - Article

VL - 49

SP - 212

EP - 222

JO - IEEE Journal of Solid-State Circuits

JF - IEEE Journal of Solid-State Circuits

SN - 0018-9200

IS - 1

ER -