A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks

D Ruffieux, N Scolari, F Giroud, T-C Le, S Dalla Piazza, F Staub, K Zoschke, C-A Manier, H Oppermann, Tommi Suni, James Dekker, G Allegato

    Research output: Contribution to journalArticleScientificpeer-review

    12 Citations (Scopus)

    Abstract

    This paper introduces and demonstrates with high yield a novel concept for the packaging under vacuum of tuning fork quartz XTALs on top of a silicon interposer equipped with TSVs. It paves the way to the implementation of a monolithic timing microsystem where the ASIC is part of the housing of a newly designed tiny 131-kHz XTAL to reach extreme module miniaturization (1.5,*,1.1,*,0.7 mm3) and integrity. As this task is still ongoing, an early demonstration of the generic versatile timing module is presented using a chip-on-board approach with standalone conventionally packaged XTAL and BAW resonators. The module achieves 0.4 µW power dissipation and pm 2 ppm stability over {-} 40 circ C to 85 circ C in RTC mode and can deliver on-demand programmable clocks between 1-50 MHz. The latter are obtained either with a RC PLL or after division of the signal obtained from a 2-GHz BAW DCO at a power dissipation of 100 µ W and 5.3 mW, respectively
    Original languageEnglish
    Pages (from-to)212-222
    JournalIEEE Journal of Solid-State Circuits
    Volume49
    Issue number1
    DOIs
    Publication statusPublished - 2014
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    Microsystems
    Clocks
    Resonators
    Energy dissipation
    Phase locked loops
    Application specific integrated circuits
    Quartz
    Packaging
    Demonstrations
    Tuning
    Vacuum
    Silicon

    Keywords

    • Hybrid integration
    • MEMS
    • oscillator
    • programme clocks
    • RTC
    • temperature sensor
    • wafer level packaging

    Cite this

    Ruffieux, D ; Scolari, N ; Giroud, F ; Le, T-C ; Dalla Piazza, S ; Staub, F ; Zoschke, K ; Manier, C-A ; Oppermann, H ; Suni, Tommi ; Dekker, James ; Allegato, G. / A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks. In: IEEE Journal of Solid-State Circuits. 2014 ; Vol. 49, No. 1. pp. 212-222.
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    title = "A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks",
    abstract = "This paper introduces and demonstrates with high yield a novel concept for the packaging under vacuum of tuning fork quartz XTALs on top of a silicon interposer equipped with TSVs. It paves the way to the implementation of a monolithic timing microsystem where the ASIC is part of the housing of a newly designed tiny 131-kHz XTAL to reach extreme module miniaturization (1.5,*,1.1,*,0.7 mm3) and integrity. As this task is still ongoing, an early demonstration of the generic versatile timing module is presented using a chip-on-board approach with standalone conventionally packaged XTAL and BAW resonators. The module achieves 0.4 µW power dissipation and pm 2 ppm stability over {-} 40 circ C to 85 circ C in RTC mode and can deliver on-demand programmable clocks between 1-50 MHz. The latter are obtained either with a RC PLL or after division of the signal obtained from a 2-GHz BAW DCO at a power dissipation of 100 µ W and 5.3 mW, respectively",
    keywords = "Hybrid integration, MEMS, oscillator, programme clocks, RTC, temperature sensor, wafer level packaging",
    author = "D Ruffieux and N Scolari and F Giroud and T-C Le and {Dalla Piazza}, S and F Staub and K Zoschke and C-A Manier and H Oppermann and Tommi Suni and James Dekker and G Allegato",
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    doi = "10.1109/JSSC.2013.2282111",
    language = "English",
    volume = "49",
    pages = "212--222",
    journal = "IEEE Journal of Solid-State Circuits",
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    Ruffieux, D, Scolari, N, Giroud, F, Le, T-C, Dalla Piazza, S, Staub, F, Zoschke, K, Manier, C-A, Oppermann, H, Suni, T, Dekker, J & Allegato, G 2014, 'A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks', IEEE Journal of Solid-State Circuits, vol. 49, no. 1, pp. 212-222. https://doi.org/10.1109/JSSC.2013.2282111

    A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µw RTC mode and programmable HF clocks. / Ruffieux, D; Scolari, N; Giroud, F; Le, T-C; Dalla Piazza, S; Staub, F; Zoschke, K; Manier, C-A; Oppermann, H; Suni, Tommi; Dekker, James; Allegato, G.

    In: IEEE Journal of Solid-State Circuits, Vol. 49, No. 1, 2014, p. 212-222.

    Research output: Contribution to journalArticleScientificpeer-review

    TY - JOUR

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    AU - Ruffieux, D

    AU - Scolari, N

    AU - Giroud, F

    AU - Le, T-C

    AU - Dalla Piazza, S

    AU - Staub, F

    AU - Zoschke, K

    AU - Manier, C-A

    AU - Oppermann, H

    AU - Suni, Tommi

    AU - Dekker, James

    AU - Allegato, G

    N1 - Project code: 70851

    PY - 2014

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    N2 - This paper introduces and demonstrates with high yield a novel concept for the packaging under vacuum of tuning fork quartz XTALs on top of a silicon interposer equipped with TSVs. It paves the way to the implementation of a monolithic timing microsystem where the ASIC is part of the housing of a newly designed tiny 131-kHz XTAL to reach extreme module miniaturization (1.5,*,1.1,*,0.7 mm3) and integrity. As this task is still ongoing, an early demonstration of the generic versatile timing module is presented using a chip-on-board approach with standalone conventionally packaged XTAL and BAW resonators. The module achieves 0.4 µW power dissipation and pm 2 ppm stability over {-} 40 circ C to 85 circ C in RTC mode and can deliver on-demand programmable clocks between 1-50 MHz. The latter are obtained either with a RC PLL or after division of the signal obtained from a 2-GHz BAW DCO at a power dissipation of 100 µ W and 5.3 mW, respectively

    AB - This paper introduces and demonstrates with high yield a novel concept for the packaging under vacuum of tuning fork quartz XTALs on top of a silicon interposer equipped with TSVs. It paves the way to the implementation of a monolithic timing microsystem where the ASIC is part of the housing of a newly designed tiny 131-kHz XTAL to reach extreme module miniaturization (1.5,*,1.1,*,0.7 mm3) and integrity. As this task is still ongoing, an early demonstration of the generic versatile timing module is presented using a chip-on-board approach with standalone conventionally packaged XTAL and BAW resonators. The module achieves 0.4 µW power dissipation and pm 2 ppm stability over {-} 40 circ C to 85 circ C in RTC mode and can deliver on-demand programmable clocks between 1-50 MHz. The latter are obtained either with a RC PLL or after division of the signal obtained from a 2-GHz BAW DCO at a power dissipation of 100 µ W and 5.3 mW, respectively

    KW - Hybrid integration

    KW - MEMS

    KW - oscillator

    KW - programme clocks

    KW - RTC

    KW - temperature sensor

    KW - wafer level packaging

    U2 - 10.1109/JSSC.2013.2282111

    DO - 10.1109/JSSC.2013.2282111

    M3 - Article

    VL - 49

    SP - 212

    EP - 222

    JO - IEEE Journal of Solid-State Circuits

    JF - IEEE Journal of Solid-State Circuits

    SN - 0018-9200

    IS - 1

    ER -