A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks

D. Ruffieux, N. Scolari, F. Giroud, T.C. Le, S.D. Piazza, F. Staub, K. Zoschke, C.A. Manier, H. Oppermann, James Dekker, Tommi Suni, G. Allegato

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

Over recent years the several decades long quartz-dominated timing industry has been continuously challenged by the introduction of new products or demonstration of prototypes based on MEMS resonators [1-4]. The poor intrinsic stability of such devices has led to the development of very high performance temperature sensors to reach TCXO-level frequency stability [5]. One of the true advantages of the technology is the fact that well-proven semiconductor manufacturing technologies amenable for high volume production can be leveraged to produce wafer-level encapsulated low-cost components. This paper explores how XTAL resonators could benefit from similar wafer level, vacuum sealing packaging technologies with the demonstration of a generic versatile timing module.
Original languageEnglish
Title of host publicationDigest of Technical Papers
Subtitle of host publicationIEEE International Solid-State Circuits Conference, ISSCC 2013
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages196-197
ISBN (Electronic)978-1-4673-4516-3
ISBN (Print)978-1-4673-4515-6
DOIs
Publication statusPublished - 2013
MoE publication typeA4 Article in a conference publication
Event60th IEEE International Solid-State Circuits Conference, ISSCC 2013 - San Francisco, CA, United States
Duration: 17 Feb 201321 Feb 2013

Conference

Conference60th IEEE International Solid-State Circuits Conference, ISSCC 2013
Abbreviated titleISSCC 2013
CountryUnited States
CitySan Francisco, CA
Period17/02/1321/02/13

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Microsystems
Clocks
Resonators
Demonstrations
Frequency stability
Temperature sensors
MEMS
Quartz
Packaging
Vacuum
Semiconductor materials
Costs
Industry

Cite this

Ruffieux, D., Scolari, N., Giroud, F., Le, T. C., Piazza, S. D., Staub, F., ... Allegato, G. (2013). A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. In Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013 (pp. 196-197). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/ISSCC.2013.6487697
Ruffieux, D. ; Scolari, N. ; Giroud, F. ; Le, T.C. ; Piazza, S.D. ; Staub, F. ; Zoschke, K. ; Manier, C.A. ; Oppermann, H. ; Dekker, James ; Suni, Tommi ; Allegato, G. / A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013. IEEE Institute of Electrical and Electronic Engineers , 2013. pp. 196-197
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abstract = "Over recent years the several decades long quartz-dominated timing industry has been continuously challenged by the introduction of new products or demonstration of prototypes based on MEMS resonators [1-4]. The poor intrinsic stability of such devices has led to the development of very high performance temperature sensors to reach TCXO-level frequency stability [5]. One of the true advantages of the technology is the fact that well-proven semiconductor manufacturing technologies amenable for high volume production can be leveraged to produce wafer-level encapsulated low-cost components. This paper explores how XTAL resonators could benefit from similar wafer level, vacuum sealing packaging technologies with the demonstration of a generic versatile timing module.",
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Ruffieux, D, Scolari, N, Giroud, F, Le, TC, Piazza, SD, Staub, F, Zoschke, K, Manier, CA, Oppermann, H, Dekker, J, Suni, T & Allegato, G 2013, A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. in Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013. IEEE Institute of Electrical and Electronic Engineers , pp. 196-197, 60th IEEE International Solid-State Circuits Conference, ISSCC 2013, San Francisco, CA, United States, 17/02/13. https://doi.org/10.1109/ISSCC.2013.6487697

A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. / Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, James; Suni, Tommi; Allegato, G.

Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013. IEEE Institute of Electrical and Electronic Engineers , 2013. p. 196-197.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Ruffieux, D.

AU - Scolari, N.

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AU - Le, T.C.

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AU - Manier, C.A.

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AU - Suni, Tommi

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AB - Over recent years the several decades long quartz-dominated timing industry has been continuously challenged by the introduction of new products or demonstration of prototypes based on MEMS resonators [1-4]. The poor intrinsic stability of such devices has led to the development of very high performance temperature sensors to reach TCXO-level frequency stability [5]. One of the true advantages of the technology is the fact that well-proven semiconductor manufacturing technologies amenable for high volume production can be leveraged to produce wafer-level encapsulated low-cost components. This paper explores how XTAL resonators could benefit from similar wafer level, vacuum sealing packaging technologies with the demonstration of a generic versatile timing module.

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BT - Digest of Technical Papers

PB - IEEE Institute of Electrical and Electronic Engineers

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Ruffieux D, Scolari N, Giroud F, Le TC, Piazza SD, Staub F et al. A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. In Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013. IEEE Institute of Electrical and Electronic Engineers . 2013. p. 196-197 https://doi.org/10.1109/ISSCC.2013.6487697