Abstract
Over recent years the several decades long
quartz-dominated timing industry has been continuously
challenged by the introduction of new products or
demonstration of prototypes based on MEMS resonators
[1-4]. The poor intrinsic stability of such devices has
led to the development of very high performance
temperature sensors to reach TCXO-level frequency
stability [5]. One of the true advantages of the
technology is the fact that well-proven semiconductor
manufacturing technologies amenable for high volume
production can be leveraged to produce wafer-level
encapsulated low-cost components. This paper explores how
XTAL resonators could benefit from similar wafer level,
vacuum sealing packaging technologies with the
demonstration of a generic versatile timing module.
Original language | English |
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Title of host publication | Digest of Technical Papers |
Subtitle of host publication | IEEE International Solid-State Circuits Conference, ISSCC 2013 |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 196-197 |
ISBN (Electronic) | 978-1-4673-4516-3, 978-1-4673-4514-9 |
ISBN (Print) | 978-1-4673-4515-6 |
DOIs | |
Publication status | Published - 2013 |
MoE publication type | A4 Article in a conference publication |
Event | 60th IEEE International Solid-State Circuits Conference, ISSCC 2013 - San Francisco, CA, United States Duration: 17 Feb 2013 → 21 Feb 2013 |
Publication series
Series | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
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ISSN | 0193-6530 |
Conference
Conference | 60th IEEE International Solid-State Circuits Conference, ISSCC 2013 |
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Abbreviated title | ISSCC 2013 |
Country/Territory | United States |
City | San Francisco, CA |
Period | 17/02/13 → 21/02/13 |