A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks

David Ruffieux; Nicola Scolari; Frederic Giroud; Thanh Chau Le; Silvio Dalla Piazza; Felix Staub; Kai Zoschke; Charles Alix Manier; Hermann Oppermann; James Dekker; Tommi Suni; Giorgio Allegato

doi:10.1109/ISSCC.2013.6487697

A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks

David Ruffieux
, Nicola Scolari
, Frederic Giroud
, Thanh Chau Le
, Silvio Dalla Piazza
, Felix Staub
, Kai Zoschke
, Charles Alix Manier
, Hermann Oppermann
, James Dekker
, Tommi Suni
, Giorgio Allegato

VTT Technical Research Centre of Finland

Micro Crystal AG
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
Centre Suisse d'Electronique et de Microtechnique S.A. (CSEM)
VTT (former employee or external)
STMicroelectronics S.r.l.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

1 Citation (Scopus)

Abstract

Over recent years the several decades long quartz-dominated timing industry has been continuously challenged by the introduction of new products or demonstration of prototypes based on MEMS resonators [1-4]. The poor intrinsic stability of such devices has led to the development of very high performance temperature sensors to reach TCXO-level frequency stability [5]. One of the true advantages of the technology is the fact that well-proven semiconductor manufacturing technologies amenable for high volume production can be leveraged to produce wafer-level encapsulated low-cost components. This paper explores how XTAL resonators could benefit from similar wafer level, vacuum sealing packaging technologies with the demonstration of a generic versatile timing module.

Original language	English
Title of host publication	Digest of Technical Papers
Subtitle of host publication	IEEE International Solid-State Circuits Conference, ISSCC 2013
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	196-197
ISBN (Electronic)	978-1-4673-4516-3, 978-1-4673-4514-9
ISBN (Print)	978-1-4673-4515-6
DOIs	https://doi.org/10.1109/ISSCC.2013.6487697
Publication status	Published - 2013
MoE publication type	A4 Article in a conference publication
Event	60th IEEE International Solid-State Circuits Conference, ISSCC 2013 - San Francisco, CA, United States Duration: 17 Feb 2013 → 21 Feb 2013

Publication series

Series	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
ISSN	0193-6530

Conference

Conference	60th IEEE International Solid-State Circuits Conference, ISSCC 2013
Abbreviated title	ISSCC 2013
Country/Territory	United States
City	San Francisco, CA
Period	17/02/13 → 21/02/13

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Access to Document

10.1109/ISSCC.2013.6487697

Cite this

Ruffieux, D., Scolari, N., Giroud, F., Le, T. C., Piazza, S. D., Staub, F., Zoschke, K., Manier, C. A., Oppermann, H., Dekker, J., Suni, T., & Allegato, G. (2013). A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. In Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013 (pp. 196-197). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ISSCC.2013.6487697

Ruffieux, David ; Scolari, Nicola ; Giroud, Frederic et al. / A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013. IEEE Institute of Electrical and Electronic Engineers, 2013. pp. 196-197 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

@inproceedings{b63b91dda85e47ca922dd0ef77a7b950,

title = "A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks",

abstract = "Over recent years the several decades long quartz-dominated timing industry has been continuously challenged by the introduction of new products or demonstration of prototypes based on MEMS resonators [1-4]. The poor intrinsic stability of such devices has led to the development of very high performance temperature sensors to reach TCXO-level frequency stability [5]. One of the true advantages of the technology is the fact that well-proven semiconductor manufacturing technologies amenable for high volume production can be leveraged to produce wafer-level encapsulated low-cost components. This paper explores how XTAL resonators could benefit from similar wafer level, vacuum sealing packaging technologies with the demonstration of a generic versatile timing module.",

author = "David Ruffieux and Nicola Scolari and Frederic Giroud and Le, \{Thanh Chau\} and Piazza, \{Silvio Dalla\} and Felix Staub and Kai Zoschke and Manier, \{Charles Alix\} and Hermann Oppermann and James Dekker and Tommi Suni and Giorgio Allegato",

year = "2013",

doi = "10.1109/ISSCC.2013.6487697",

language = "English",

isbn = "978-1-4673-4515-6",

series = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

pages = "196--197",

booktitle = "Digest of Technical Papers",

address = "United States",

note = "60th IEEE International Solid-State Circuits Conference, ISSCC 2013, ISSCC 2013 ; Conference date: 17-02-2013 Through 21-02-2013",

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Ruffieux, D, Scolari, N, Giroud, F, Le, TC, Piazza, SD, Staub, F, Zoschke, K, Manier, CA, Oppermann, H, Dekker, J, Suni, T & Allegato, G 2013, A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. in Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013. IEEE Institute of Electrical and Electronic Engineers, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, pp. 196-197, 60th IEEE International Solid-State Circuits Conference, ISSCC 2013, San Francisco, CA, United States, 17/02/13. https://doi.org/10.1109/ISSCC.2013.6487697

A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. / Ruffieux, David; Scolari, Nicola; Giroud, Frederic et al.
Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013. IEEE Institute of Electrical and Electronic Engineers, 2013. p. 196-197 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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T1 - A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks

AU - Ruffieux, David

AU - Scolari, Nicola

AU - Giroud, Frederic

AU - Le, Thanh Chau

AU - Piazza, Silvio Dalla

AU - Staub, Felix

AU - Zoschke, Kai

AU - Manier, Charles Alix

AU - Oppermann, Hermann

AU - Dekker, James

AU - Suni, Tommi

AU - Allegato, Giorgio

PY - 2013

Y1 - 2013

N2 - Over recent years the several decades long quartz-dominated timing industry has been continuously challenged by the introduction of new products or demonstration of prototypes based on MEMS resonators [1-4]. The poor intrinsic stability of such devices has led to the development of very high performance temperature sensors to reach TCXO-level frequency stability [5]. One of the true advantages of the technology is the fact that well-proven semiconductor manufacturing technologies amenable for high volume production can be leveraged to produce wafer-level encapsulated low-cost components. This paper explores how XTAL resonators could benefit from similar wafer level, vacuum sealing packaging technologies with the demonstration of a generic versatile timing module.

AB - Over recent years the several decades long quartz-dominated timing industry has been continuously challenged by the introduction of new products or demonstration of prototypes based on MEMS resonators [1-4]. The poor intrinsic stability of such devices has led to the development of very high performance temperature sensors to reach TCXO-level frequency stability [5]. One of the true advantages of the technology is the fact that well-proven semiconductor manufacturing technologies amenable for high volume production can be leveraged to produce wafer-level encapsulated low-cost components. This paper explores how XTAL resonators could benefit from similar wafer level, vacuum sealing packaging technologies with the demonstration of a generic versatile timing module.

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DO - 10.1109/ISSCC.2013.6487697

M3 - Conference article in proceedings

SN - 978-1-4673-4515-6

T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

SP - 196

EP - 197

BT - Digest of Technical Papers

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 60th IEEE International Solid-State Circuits Conference, ISSCC 2013

Y2 - 17 February 2013 through 21 February 2013

ER -

Ruffieux D, Scolari N, Giroud F, Le TC, Piazza SD, Staub F et al. A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. In Digest of Technical Papers : IEEE International Solid-State Circuits Conference, ISSCC 2013. IEEE Institute of Electrical and Electronic Engineers. 2013. p. 196-197. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). doi: 10.1109/ISSCC.2013.6487697

A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks

Abstract

Publication series

Conference

UN SDGs

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