Adhesion of Flexible Printed Circuit Substrate to Overmoulded Polymer and Characterization of Overmoulded Electronic Components

Matti Koponen, Teemu Alajoki, Topi Kosonen, Jarno Petäjä, Mikko Heikkinen, Tommi Vuorinen, Jukka-Tapani Mäkinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

3 Citations (Scopus)

Abstract

Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will have various electronic, optical and mechanical functions integrated in polymer packages. We have studied the in-mould integration of electronic and optoelectronic modules with injection moulding and film-overmoulding technologies. A test set was made to find out adhesion strength between various overmoulding thermoplastic materials and thermoplastic films that could be used as substrates for flexible printed circuits. By overmoulding we mean here that the film is set as an insert into injection moulding mould and thermoplastic polymer is cast on the film in injection moulding process. Both overmoulding and polymer materials were mainly transparent. It was found out that generally adhesion between the substrate and overmoulded plastic was poor, but some good material pairs could still be found. Situation is especially difficult with materials which can withstand high temperatures. These materials can be bound together only by special means. Adhesion was tested by ISO 8510-1 standard in addition to visual inspection. It was noticed that another problem beside poor adhesion was warping. Some of the tested overmoulding material pairs are not suitable for overmoulding, because of their remarkable high difference in coefficient of linear thermal expansion, which leads to distinct warping effect of the foil and overmoulded plastic package. Deformation takes place also after demoulding when plastics are cooling to room temperature. PET, PEN, and PC -type foils were tested as flexible printed circuit substrates. The overmoulding materials were PC, COC, PMMA and PS. Investigated high temperature resistant foil materials were PI and LCP and corresponding overmoulding materials LCP and LCP/PPS blend. A test structure was also made, in which bare die and SMT electronic components were assembled to foil with different interconnection methods before overmoulding process. Characterization of overmoulded components was carried out by visual inspection and by functional testing. It was found out that with correct injection moulding process parameters, all components survived the challenging conditions of the injection moulding process.
Original languageEnglish
Title of host publicationIMAPS Nordic Annual Conference Denmark 2008
PublisherIMAPS Nordic
Pages207-212
Publication statusPublished - 2008
MoE publication typeB3 Non-refereed article in conference proceedings
EventIMAPS Nordic Annual Conference - Helsingör, Denmark
Duration: 14 Sep 200816 Sep 2008

Conference

ConferenceIMAPS Nordic Annual Conference
CountryDenmark
CityHelsingör
Period14/09/0816/09/08

Fingerprint

Printed circuits
Adhesion
Injection molding
Polymers
Substrates
Metal foil
Thermoplastics
Plastics
Inspection
Automobile electronic equipment
Electronic medical equipment
Die casting inserts
Consumer electronics
Surface mount technology
Bond strength (materials)
Optoelectronic devices
Temperature
Thermal expansion
Cooling

Keywords

  • overmoulding
  • adhesion
  • in-mould integration

Cite this

Koponen, M., Alajoki, T., Kosonen, T., Petäjä, J., Heikkinen, M., Vuorinen, T., & Mäkinen, J-T. (2008). Adhesion of Flexible Printed Circuit Substrate to Overmoulded Polymer and Characterization of Overmoulded Electronic Components. In IMAPS Nordic Annual Conference Denmark 2008 (pp. 207-212). IMAPS Nordic.
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Koponen, M, Alajoki, T, Kosonen, T, Petäjä, J, Heikkinen, M, Vuorinen, T & Mäkinen, J-T 2008, Adhesion of Flexible Printed Circuit Substrate to Overmoulded Polymer and Characterization of Overmoulded Electronic Components. in IMAPS Nordic Annual Conference Denmark 2008. IMAPS Nordic, pp. 207-212, IMAPS Nordic Annual Conference , Helsingör, Denmark, 14/09/08.

Adhesion of Flexible Printed Circuit Substrate to Overmoulded Polymer and Characterization of Overmoulded Electronic Components. / Koponen, Matti; Alajoki, Teemu; Kosonen, Topi; Petäjä, Jarno; Heikkinen, Mikko; Vuorinen, Tommi; Mäkinen, Jukka-Tapani.

IMAPS Nordic Annual Conference Denmark 2008. IMAPS Nordic, 2008. p. 207-212.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

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T1 - Adhesion of Flexible Printed Circuit Substrate to Overmoulded Polymer and Characterization of Overmoulded Electronic Components

AU - Koponen, Matti

AU - Alajoki, Teemu

AU - Kosonen, Topi

AU - Petäjä, Jarno

AU - Heikkinen, Mikko

AU - Vuorinen, Tommi

AU - Mäkinen, Jukka-Tapani

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N2 - Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will have various electronic, optical and mechanical functions integrated in polymer packages. We have studied the in-mould integration of electronic and optoelectronic modules with injection moulding and film-overmoulding technologies. A test set was made to find out adhesion strength between various overmoulding thermoplastic materials and thermoplastic films that could be used as substrates for flexible printed circuits. By overmoulding we mean here that the film is set as an insert into injection moulding mould and thermoplastic polymer is cast on the film in injection moulding process. Both overmoulding and polymer materials were mainly transparent. It was found out that generally adhesion between the substrate and overmoulded plastic was poor, but some good material pairs could still be found. Situation is especially difficult with materials which can withstand high temperatures. These materials can be bound together only by special means. Adhesion was tested by ISO 8510-1 standard in addition to visual inspection. It was noticed that another problem beside poor adhesion was warping. Some of the tested overmoulding material pairs are not suitable for overmoulding, because of their remarkable high difference in coefficient of linear thermal expansion, which leads to distinct warping effect of the foil and overmoulded plastic package. Deformation takes place also after demoulding when plastics are cooling to room temperature. PET, PEN, and PC -type foils were tested as flexible printed circuit substrates. The overmoulding materials were PC, COC, PMMA and PS. Investigated high temperature resistant foil materials were PI and LCP and corresponding overmoulding materials LCP and LCP/PPS blend. A test structure was also made, in which bare die and SMT electronic components were assembled to foil with different interconnection methods before overmoulding process. Characterization of overmoulded components was carried out by visual inspection and by functional testing. It was found out that with correct injection moulding process parameters, all components survived the challenging conditions of the injection moulding process.

AB - Next generation of smart systems in different application areas such as automotive, medical and consumer electronics will have various electronic, optical and mechanical functions integrated in polymer packages. We have studied the in-mould integration of electronic and optoelectronic modules with injection moulding and film-overmoulding technologies. A test set was made to find out adhesion strength between various overmoulding thermoplastic materials and thermoplastic films that could be used as substrates for flexible printed circuits. By overmoulding we mean here that the film is set as an insert into injection moulding mould and thermoplastic polymer is cast on the film in injection moulding process. Both overmoulding and polymer materials were mainly transparent. It was found out that generally adhesion between the substrate and overmoulded plastic was poor, but some good material pairs could still be found. Situation is especially difficult with materials which can withstand high temperatures. These materials can be bound together only by special means. Adhesion was tested by ISO 8510-1 standard in addition to visual inspection. It was noticed that another problem beside poor adhesion was warping. Some of the tested overmoulding material pairs are not suitable for overmoulding, because of their remarkable high difference in coefficient of linear thermal expansion, which leads to distinct warping effect of the foil and overmoulded plastic package. Deformation takes place also after demoulding when plastics are cooling to room temperature. PET, PEN, and PC -type foils were tested as flexible printed circuit substrates. The overmoulding materials were PC, COC, PMMA and PS. Investigated high temperature resistant foil materials were PI and LCP and corresponding overmoulding materials LCP and LCP/PPS blend. A test structure was also made, in which bare die and SMT electronic components were assembled to foil with different interconnection methods before overmoulding process. Characterization of overmoulded components was carried out by visual inspection and by functional testing. It was found out that with correct injection moulding process parameters, all components survived the challenging conditions of the injection moulding process.

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Koponen M, Alajoki T, Kosonen T, Petäjä J, Heikkinen M, Vuorinen T et al. Adhesion of Flexible Printed Circuit Substrate to Overmoulded Polymer and Characterization of Overmoulded Electronic Components. In IMAPS Nordic Annual Conference Denmark 2008. IMAPS Nordic. 2008. p. 207-212