Adhesion of Flexible Printed Circuit Substrate to Overmoulded Polymer and Characterization of Overmoulded Electronic Components

Matti Koponen, Teemu Alajoki, Topi Kosonen, Jarno Petäjä, Mikko Heikkinen, Tommi Vuorinen, Jukka-Tapani Mäkinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

3 Citations (Scopus)

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Physics & Astronomy