Adhesive bonding strength for printed and hybrid electronics

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Electrically conductive adhesives offer a low-temperature alternative for soldering process in electronics assembly. Adhesive bonding technology is especially advisable when integrating components on printed structures on soft substrates with low heat-tolerance. This study investigates mechanical durability of surface mounted chip resistors bonded on a flexible substrate with an isotropic conductive adhesive. The test specimen are manufactured in fully automated roll-to-roll processes by rotary screen printing a conductive circuitry, and subsequently dispensing silver epoxy, pick-and-placing components and heat-curing the adhesive. The adhesive bonding strength is studied with an automated test setup pulling a component off from the substrate. This destructive test method is used to evaluate the mechanical strength when varying adhesive volume at the interconnection areas with different component sizes. The results prove that the adhesive bonding strength for printed and hybrid electronics can be improved by increasing the adhesive volume in bonds when using a silver epoxy. At the same time, spreading of adhesive dots during assembly process limits the applicable adhesive volume to avoid short circuits and to maintain the electrical functionality. The study provides guidelines to optimize dispensing routines to achieve stable electro-mechanical interconnections.
Original languageEnglish
Title of host publication2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
PublisherWiley-IEEE Press
Number of pages6
ISBN (Electronic)978-0-9568086-7-7
ISBN (Print)978-1-6654-2368-7
DOIs
Publication statusPublished - 16 Sep 2021
MoE publication typeA4 Article in a conference publication
Event23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021 -
Duration: 13 Sep 202116 Sep 2021

Conference

Conference23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021
Period13/09/2116/09/21

Keywords

  • Heating systems
  • Resistors
  • Printing
  • Silver
  • Integrated circuit interconnections
  • Soldering
  • Substrates

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